专利检索 cpc:"H01L2224/45120130101" 第 1 页

1.

发明授权
COOLING SYSTEM WHERE SEMICONDUCTOR COMPONENT COMPRISING SEMICONDUCTOR CHIP AND COOLING APPARATUS ARE JOINED 有权转让

公开(公告)号：EP4071802B1

公开(公告)日：2024-05-01

申请号：EP22162382.0

申请日：2022-03-16

IPC分类号： H01L23/473 , H01L23/367 , H01L23/373

CPC分类号： H01L23/473 , H01L25/115 , H01L23/3735 , H01L23/3677 , H01L23/4334 , H01L25/072 , H01L23/3121 , H01L2224/7326520130101 , H01L2224/3222520130101 , H01L2224/4822720130101 , H01L2224/4809120130101 , H01L2224/45120130101 , H01L24/45 , H01L24/40 , H01L2224/37120130101 , H01L2224/4022520130101 , H01L2224/2913920130101 , H01L2224/2914720130101 , H01L2924/1309120130101 , H01L2924/1305520130101 , H01L2924/18120130101 , H01L24/29 , H01L24/37 , H01L24/73 , H01L24/32 , H01L24/33 , H01L2224/3318120130101 , H01L2924/0001420130101 , H01L2224/7322120130101