专利检索 cpc:"H01L2224/8304820130101" 第 1 页

1.

发明授权
METHOD OF BONDING AN ELECTRONIC COMPONENT TO A SUBSTRATE BY SOLDERING USING AN SN-AG-CU-SB-NI OR AN SN-AG-CU-SB-NI-(CO,FE) SOLDER ALLOY AND CORRESPONDING SOLDERED ASSEMBLY 有权

公开(公告)号：EP3706161B1

公开(公告)日：2024-10-09

申请号：EP18873077.4

申请日：2018-10-30

IPC分类号： H01L23/488 , H01L23/482 , H01L21/60 , B23K35/26 , C22C13/02 , B23K1/20

CPC分类号： B23K1/008 , C22C13/02 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/8381520130101 , H01L2224/838120130101 , H01L2224/3250320130101 , H01L2924/35120130101 , H01L2924/351220130101 , H01L24/05 , H01L2224/0402620130101 , H01L23/4827 , H01L2224/0508320130101 , H01L2224/034520130101 , H01L2224/034620130101 , H01L2224/3222720130101 , H01L2224/3224520130101 , H01L2224/8320420130101 , H01L2224/8321120130101 , H01L2224/8307520130101 , H01L2224/8306520130101 , H01L2224/8302220130101 , H01L2224/8302420130101 , H01L2224/8304820130101 , H01L2224/29320130101 , H01L2224/29120130101 , H01L2224/2929420130101 , H01L2224/8310120130101 , H01L2224/2911120130101 , H01L2224/8345520130101 , H01L2224/0507320130101 , H01L2224/0508220130101 , H01L2224/0508420130101 , H01L2224/0564420130101 , H01L2224/0563920130101 , H01L2224/0565520130101 , H01L2224/0516620130101 , H01L2224/0512420130101 , H01L2224/0515520130101 , H01L2224/0513920130101 , H01L2224/0514720130101 , H01L2224/0511120130101 , H01L2224/3250720130101 , H01L24/03 , B23K1/0016 , B23K2101/3620180801 , B23K1/203 , B23K1/206 , B23K35/262 , C22C19/03 , B23K35/025 , H01L2224/0564720130101 , H01L2224/0517220130101 , H01L2224/0517120130101 , H01L2224/0561120130101 , H01L2224/0514420130101