专利检索 cpc:"H01L2224/0561120130101" 第 1 页

1.

发明公开
STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING 审中-公开

公开(公告)号：EP4435152A2

公开(公告)日：2024-09-25

申请号：EP24191899.4

申请日：2017-10-25

申请人： Adeia Semiconductor Technologies LLC

发明人： UZOH, Cyprian, Emeka

IPC分类号： C25D7/12

CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/1308420130101 , H01L2224/1626520130101 , H01L2224/1385520130101 , H01L2224/1162220130101 , H01L2224/1626820130101 , H01L2224/1605920130101 , H01L24/80 , H01L2224/040120130101 , H01L2224/055720130101 , H01L2224/0560920130101 , H01L2224/0561120130101 , H01L2224/0561620130101 , H01L2224/0562420130101 , H01L2224/0563920130101 , H01L2224/0564420130101 , H01L2224/0564720130101 , H01L2224/0565520130101 , H01L2224/0568420130101 , H01L2224/1146220130101 , H01L2224/1146420130101 , H01L2224/114720130101 , H01L2224/1300720130101 , H01L2224/1301920130101 , H01L2224/1310520130101 , H01L2224/1310920130101 , H01L2224/1311120130101 , H01L2224/1311620130101 , H01L2224/1312420130101 , H01L2224/1313920130101 , H01L2224/1314420130101 , H01L2224/1314720130101 , H01L2224/1315520130101 , H01L2224/1318420130101 , H01L2224/1356220130101 , H01L2224/1356420130101 , H01L2224/1365520130101 , H01L2224/1368420130101 , H01L2224/1380920130101 , H01L2224/1381120130101 , H01L2224/1384720130101 , H01L2224/1605820130101 , H01L2224/1614820130101 , H01L2224/291920130101 , H01L2224/8089520130101 , H01L2224/8089620130101 , H01L2224/8106520130101 , H01L2224/8107520130101 , H01L2224/8109120130101 , H01L2224/8119320130101 , H01L2224/8120320130101 , H01L2224/818120130101 , H01L2224/818420130101 , H01L2225/105820130101 , H01L2924/1531120130101 , H01L2224/810920130101 , H01L2224/0556820130101 , H01L2224/0391220130101 , H01L2224/8109920130101 , H01L2224/1100920130101 , H01L2225/0651320130101 , H01L2224/1650320130101 , H01L2224/0300920130101 , H01L2224/1380520130101 , H01L2224/8108520130101 , H01L2224/8035720130101 , H01L2224/055820130101 , H01L2224/0556220130101 , H01L2224/0556420130101 , H01L2224/0557120130101 , H01L2224/0557220130101 , H01L23/552 , H01L2224/8385620130101 , H01L2224/8386220130101 , H01L2224/9212520130101 , H01L2224/808120130101 , H01L2224/8098620130101 , H01L2224/1623720130101 , H01L2224/1614720130101 , H01L2224/0823720130101 , H01L2224/0514720130101 , H01L2224/0558220130101 , H01L2224/0558320130101 , H01L2224/0584720130101 , H01L2224/0584420130101 , H01L2224/0585520130101 , H01L2224/7310420130101 , H01L2224/7320420130101 , H05K3/4007 , H05K3/3436 , H05K2201/1024220130101 , H01L2224/803420130101 , H01L2224/8014120130101 , H01L2224/0814520130101 , C25D7/123 , C25D5/022 , C23C18/1653 , C25D5/48 , C25D5/10 , C25D5/18 , C25D3/38 , C25D5/605 , C25D5/12 , C23C18/1658

摘要： A bonded structure, comprising a first component including a first substrate having a first dielectric surface and a first conductive feature at the first dielectric surface; and a second component including a second substrate having a second dielectric surface and a second conductive feature at the second dielectric surface. The first dielectric surface is directly bonded to the second dielectric surface without an underfill. The first conductive feature is bonded to second conductive feature by way of a conductive bond region between the first and second conductive features, wherein the bond region comprises structural evidence of conductive nanoparticles employed in bonding the first conductive feature to the second conductive feature.

2.

发明授权
METHOD OF BONDING AN ELECTRONIC COMPONENT TO A SUBSTRATE BY SOLDERING USING AN SN-AG-CU-SB-NI OR AN SN-AG-CU-SB-NI-(CO,FE) SOLDER ALLOY AND CORRESPONDING SOLDERED ASSEMBLY 有权

公开(公告)号：EP3706161B1

公开(公告)日：2024-10-09

申请号：EP18873077.4

申请日：2018-10-30

IPC分类号： H01L23/488 , H01L23/482 , H01L21/60 , B23K35/26 , C22C13/02 , B23K1/20

CPC分类号： B23K1/008 , C22C13/02 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/8381520130101 , H01L2224/838120130101 , H01L2224/3250320130101 , H01L2924/35120130101 , H01L2924/351220130101 , H01L24/05 , H01L2224/0402620130101 , H01L23/4827 , H01L2224/0508320130101 , H01L2224/034520130101 , H01L2224/034620130101 , H01L2224/3222720130101 , H01L2224/3224520130101 , H01L2224/8320420130101 , H01L2224/8321120130101 , H01L2224/8307520130101 , H01L2224/8306520130101 , H01L2224/8302220130101 , H01L2224/8302420130101 , H01L2224/8304820130101 , H01L2224/29320130101 , H01L2224/29120130101 , H01L2224/2929420130101 , H01L2224/8310120130101 , H01L2224/2911120130101 , H01L2224/8345520130101 , H01L2224/0507320130101 , H01L2224/0508220130101 , H01L2224/0508420130101 , H01L2224/0564420130101 , H01L2224/0563920130101 , H01L2224/0565520130101 , H01L2224/0516620130101 , H01L2224/0512420130101 , H01L2224/0515520130101 , H01L2224/0513920130101 , H01L2224/0514720130101 , H01L2224/0511120130101 , H01L2224/3250720130101 , H01L24/03 , B23K1/0016 , B23K2101/3620180801 , B23K1/203 , B23K1/206 , B23K35/262 , C22C19/03 , B23K35/025 , H01L2224/0564720130101 , H01L2224/0517220130101 , H01L2224/0517120130101 , H01L2224/0561120130101 , H01L2224/0514420130101

3.

发明授权
SEMICONDUCTOR DEVICE AND METHOD OF FORMING A PACKAGE OF THE TYPE DIRECT CHIP ATTACH LAND GRID ARRAY (DCALGA) USING A EMICONDUCTOR DIE WITH MICRO PILLARS 有权

公开(公告)号：EP3163613B1

公开(公告)日：2024-08-21

申请号：EP16188869.8

申请日：2016-09-15

IPC分类号： H01L23/485 , H01L21/60 , H01L25/065 , H01L23/31 , H01L23/433 , H01L23/552 , H01L21/98

CPC分类号： H01L2224/0556920130101 , H01L2224/1300520130101 , H01L2224/8101120130101 , H01L23/295 , H01L23/3121 , H01L23/3192 , H01L23/4334 , H01L21/561 , H01L23/552 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/97 , H01L2224/0500820130101 , H01L2224/0554820130101 , H01L2224/0556720130101 , H01L2224/0561120130101 , H01L2224/0562420130101 , H01L2224/0563920130101 , H01L2224/0564420130101 , H01L2224/0564720130101 , H01L2224/0565520130101 , H01L2224/0566420130101 , H01L2224/113220130101 , H01L2224/114520130101 , H01L2224/1145220130101 , H01L2224/114620130101 , H01L2224/114720130101 , H01L2224/1301320130101 , H01L2224/1301420130101 , H01L2224/1302220130101 , H01L2224/1308220130101 , H01L2224/1311120130101 , H01L2224/1311320130101 , H01L2224/1311620130101 , H01L2224/1312420130101 , H01L2224/1313920130101 , H01L2224/1314420130101 , H01L2224/1314720130101 , H01L2224/1315520130101 , H01L2224/1318420130101 , H01L2224/1605720130101 , H01L2224/1623820130101 , H01L2224/3224520130101 , H01L2224/7325320130101 , H01L2224/8102420130101 , H01L2224/8119120130101 , H01L2224/8181520130101 , H01L2224/9420130101 , H01L2224/9720130101 , H01L2924/384120130101 , H01L2224/1316620130101 , H01L23/49827 , H01L2924/18120130101 , H01L25/0655

4.

发明授权
METHOD OF REMOVING A SUBSTRATE 有权

公开(公告)号：EP3619748B1

公开(公告)日：2024-04-17

申请号：EP18794585.2

申请日：2018-05-07

IPC分类号： H01L21/683 , H01L23/00 , H01L33/00 , H01S5/02 , H01L21/02 , H01S5/343 , H01L33/46 , H01L33/32 , H01L33/20

CPC分类号： H01L33/0075 , H01L33/20 , H01S5/0217 , H01S5/34333 , H01S2304/1220130101 , H01L33/0093 , H01L21/02389 , H01L21/0254 , H01L21/02647 , H01L21/02458 , H01L2224/3224520130101 , H01L2224/8319220130101 , H01L2224/8389520130101 , H01L2224/3222520130101 , H01L2224/8344420130101 , H01L2224/8320320130101 , H01L2224/0561120130101 , H01L2224/0564420130101 , H01L2924/1574720130101 , H01L2924/103320130101 , H01L2224/0402620130101 , H01L24/05 , H01L24/29 , H01L24/32 , H01L2224/8380520130101 , H01L24/83 , H01L2224/8301320130101 , H01L2224/8302220130101 , H01L2224/2911120130101 , H01L2224/2914420130101 , H01L2224/8344720130101 , H01L2224/8044420130101 , H01L2224/8001320130101 , H01L2224/8020320130101 , H01L2224/8089520130101 , H01L24/80 , H01L2224/0824520130101 , H01L2224/0822520130101 , H01L24/08 , H01L2224/0420130101 , H01L2224/034520130101 , H01L24/03 , H01L2224/8000620130101 , H01L2224/8300520130101 , H01L2224/0823820130101 , H01L2224/0825820130101 , H01L2224/0555820130101 , H01L21/6835 , H01L24/06 , H01L2224/0618120130101 , H01L2924/1204220130101 , H01L2224/920220130101 , H01L2224/9420130101 , H01L24/94 , H01L24/92 , H01L2224/9214220130101 , H01L2224/921220130101 , H01L2221/6838120130101 , H01L2221/6831820130101 , H01L2221/683520130101 , H01L2221/6836320130101 , H01L2224/80420130101 , H01L2224/804920130101 , H01L2224/051820130101 , H01L2224/0514420130101 , H01L2224/0566920130101 , H01L2224/0518420130101 , H01L2224/0513920130101 , H01L2224/0566420130101 , H01L2224/0565520130101 , H01L2224/0563920130101 , H01L2224/0516420130101 , H01L2224/0516620130101 , H01L2224/0516920130101 , H01L2224/056820130101 , H01L2224/0568420130101 , H01L2224/0566620130101 , H01L2224/0515520130101 , H01S5/0203 , H01L2224/29120130101

5.

发明公开
METHOD OF REMOVING A SUBSTRATE 审中-公开

公开(公告)号：EP4411843A2

公开(公告)日：2024-08-07

申请号：EP24169398.5

申请日：2018-05-07

申请人： The Regents of the University of California

发明人： KAMIKAWA, Takeshi , GANDROTHULA, Srinivas , LI, Hongjian , COHEN, Daniel A.

IPC分类号： H01L33/20

CPC分类号： H01L33/0075 , H01L33/20 , H01S5/0217 , H01S5/34333 , H01S2304/1220130101 , H01L33/0093 , H01L21/02389 , H01L21/0254 , H01L21/02647 , H01L21/02458 , H01L2224/3224520130101 , H01L2224/8319220130101 , H01L2224/8389520130101 , H01L2224/3222520130101 , H01L2224/8344420130101 , H01L2224/8320320130101 , H01L2224/0561120130101 , H01L2224/0564420130101 , H01L2924/1574720130101 , H01L2924/103320130101 , H01L2224/0402620130101 , H01L24/05 , H01L24/29 , H01L24/32 , H01L2224/8380520130101 , H01L24/83 , H01L2224/8301320130101 , H01L2224/8302220130101 , H01L2224/2911120130101 , H01L2224/2914420130101 , H01L2224/8344720130101 , H01L2224/8044420130101 , H01L2224/8001320130101 , H01L2224/8020320130101 , H01L2224/8089520130101 , H01L24/80 , H01L2224/0824520130101 , H01L2224/0822520130101 , H01L24/08 , H01L2224/0420130101 , H01L2224/034520130101 , H01L24/03 , H01L2224/8000620130101 , H01L2224/8300520130101 , H01L2224/0823820130101 , H01L2224/0825820130101 , H01L2224/0555820130101 , H01L21/6835 , H01L24/06 , H01L2224/0618120130101 , H01L2924/1204220130101 , H01L2224/920220130101 , H01L2224/9420130101 , H01L24/94 , H01L24/92 , H01L2224/9214220130101 , H01L2224/921220130101 , H01L2221/6838120130101 , H01L2221/6831820130101 , H01L2221/683520130101 , H01L2221/6836320130101 , H01L2224/80420130101 , H01L2224/804920130101 , H01L2224/051820130101 , H01L2224/0514420130101 , H01L2224/0566920130101 , H01L2224/0518420130101 , H01L2224/0513920130101 , H01L2224/0566420130101 , H01L2224/0565520130101 , H01L2224/0563920130101 , H01L2224/0516420130101 , H01L2224/0516620130101 , H01L2224/0516920130101 , H01L2224/056820130101 , H01L2224/0568420130101 , H01L2224/0566620130101 , H01L2224/0515520130101 , H01S5/0203 , H01L2224/29120130101

摘要： A method of removing a substrate, comprising: forming a growth restrict mask with a plurality of striped opening areas directly or indirectly upon a GaN-based substrate; and growing a plurality of semiconductor layers upon the GaN-based substrate using the growth restrict mask, such that the growth extends in a direction parallel to the striped opening areas of the growth restrict mask, and growth is stopped before the semiconductor layers coalesce, thereby resulting in island-like semiconductor layers. A device is processed for each of the island-like semiconductor layers. Etching is performed until at least a part of the growth restrict mask is exposed. The devices are then bonded to a support substrate. The GaN-based substrate is removed from the devices by a wet etching technique that at least partially dissolves the growth restrict mask. The GaN substrate that is removed then can be recycled.

6.

发明授权
INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING 有权转让

公开(公告)号：EP3391409B1

公开(公告)日：2024-05-22

申请号：EP16876775.4

申请日：2016-12-16

IPC分类号： H01L23/485 , H01L21/48 , H01L21/60 , H01L25/065

CPC分类号： H01L25/0657 , H01L2225/0655520130101 , H01L25/50 , H01L2225/0651320130101 , H01L2225/0659320130101 , H01L2224/0823820130101 , H01L2224/0823720130101 , H01L24/05 , H01L24/08 , H01L24/80 , H01L2224/0554120130101 , H01L2224/0555120130101 , H01L2224/0555220130101 , H01L2224/0557120130101 , H01L2224/0557320130101 , H01L2224/0557820130101 , H01L2224/05620130101 , H01L2224/0563920130101 , H01L2224/0564420130101 , H01L2224/0564720130101 , H01L2224/0565520130101 , H01L2224/0568420130101 , H01L2224/080720130101 , H01L2224/0814620130101 , H01L2224/8089520130101 , H01L2224/8089620130101 , H01L2224/0811120130101 , H01L2224/0812120130101 , H01L2224/0814820130101 , H01L2224/8003520130101 , H01L2224/8093520130101 , H01L2224/0420130101 , H01L2224/0566420130101 , H01L2224/8001320130101 , H01L2224/0512420130101 , H01L2224/0507320130101 , H01L2224/8001120130101 , H01L2224/0560920130101 , H01L2224/0561120130101 , H01L2224/8081520130101 , H01L2224/0568720130101 , H01L2224/0568820130101 , H01L2224/0341620130101 , H01L2224/03520130101 , H01L24/03 , H01L2224/0360220130101 , H01L2224/0361620130101 , H01L2224/0346420130101 , H01L2224/0361220130101 , H01L2224/0515520130101 , H01L2924/38120130101 , H01L2924/351220130101 , H01L2224/0566920130101 , H01L2224/0514420130101 , H01L2224/803420130101 , H01L2224/8098620130101 , H01L2224/0556920130101 , H01L2224/0814520130101

7.

发明授权
HYBRID UNDER-BUMP METALLIZATION COMPONENT 有权

公开(公告)号：EP3853914B1

公开(公告)日：2024-05-01

申请号：EP19773043.5

申请日：2019-09-18

IPC分类号： H01L23/00 , H10N60/01 , H10N60/80 , H10N60/85

CPC分类号： H01L24/13 , H01L24/05 , H01L24/11 , H01L2224/034520130101 , H01L2224/0362220130101 , H01L2224/036120130101 , H01L2224/114720130101 , H01L2224/1131220130101 , H01L24/03 , H01L2224/040120130101 , H01L2224/0557820130101 , H01L2224/0558220130101 , H01L2224/0558320130101 , H01L2224/0557620130101 , H01L2224/0555220130101 , H01L2224/8119120130101 , H01L2224/1623820130101 , H01L2224/1650320130101 , H01L24/16 , H01L2224/1605820130101 , H01L2224/8181520130101 , H01L2224/0555720130101 , H01L2224/8119320130101 , H01L2224/113420130101 , H01L24/81 , H01L2224/0518320130101 , H01L2224/8148620130101 , H01L2224/0518120130101 , H01L2224/8146920130101 , H01L2224/0516620130101 , H01L2224/8140920130101 , H01L2224/0564420130101 , H01L2224/8148420130101 , H01L2224/1314720130101 , H01L2224/0517920130101 , H01L2224/0566620130101 , H01L2224/8144720130101 , H01L2224/0568420130101 , H01L2224/0566920130101 , H01L2224/0519320130101 , H01L2224/8148120130101 , H01L2224/1310920130101 , H01L2224/0512420130101 , H01L2224/8145520130101 , H01L2224/0566420130101 , H01L2224/0518420130101 , H01L2224/0560920130101 , H01L2224/0562420130101 , H01L2224/0518620130101 , H01L2224/0561120130101 , H01L2224/0568620130101 , H01L2224/8146620130101 , H01L2224/1314420130101 , H01L2224/0568120130101 , H01L2224/1311120130101 , H01L2224/8144420130101 , H01L2224/8141120130101 , H01L2224/1311320130101 , H01L2224/1311620130101 , H01L2224/0564720130101 , H01L2224/8146420130101 , H01L2224/0565520130101 , H10N60/80 , H10N60/85 , H10N60/01