专利检索 cpc:"H01L2224/0514420130101" 第 1 页

1.

发明授权
Method for fabricating printable semiconductor elements 有权

公开(公告)号：EP2650906B1

公开(公告)日：2024-10-09

申请号：EP13003427.5

申请日：2005-06-02

IPC分类号： H01L21/308 , H01L21/208 , H01L21/326 , H01L21/4763 , H01L23/48 , H01L27/01 , H01L29/06 , H01L29/08 , H01L23/00 , H01L29/786 , H01L27/12 , H01L31/18 , H01L21/683

CPC分类号： B81C2201/018520130101 , B82Y10/00 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/1804 , H01L2924/1204120130101 , Y10S977/724 , Y10S977/707 , Y02E10/547 , H01L2224/8300520130101 , H01L2224/0361420130101 , H01L2224/8086220130101 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L21/6835 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L2221/6836820130101 , H01L2221/6838120130101 , H01L2224/033220130101 , H01L2224/034520130101 , H01L2224/036220130101 , H01L2224/0507320130101 , H01L2224/0508220130101 , H01L2224/0512420130101 , H01L2224/0514420130101 , H01L2224/0515520130101 , H01L2224/0516620130101 , H01L2224/0555220130101 , H01L2224/0555320130101 , H01L2224/0555420130101 , H01L2224/0555520130101 , H01L2224/0564420130101 , H01L2224/0566620130101 , H01L2224/0822520130101 , H01L2224/291920130101 , H01L2224/3222520130101 , H01L2224/8000620130101 , H01L2224/8012120130101 , H01L2224/8089520130101 , H01L2224/8312120130101 , H01L2224/8319220130101 , H01L2224/8319320130101 , H01L2224/838520130101 , H01L2224/8386220130101 , H01L2224/920220130101 , H01L2224/9420130101 , H01L2224/9720130101 , H01L2924/1025320130101 , H01L2924/1032920130101 , H01L2924/1515920130101 , H01L2924/1516220130101 , H01L2924/157920130101 , H01L27/1285 , H01L27/1292 , H01L2924/1309120130101 , H01L2924/130620130101 , H01L2924/146120130101 , H01L21/02628 , H01L2924/130520130101 , H01L2924/1203220130101 , H01L2924/1578820130101 , H01L31/03926 , H01L31/1864 , H01L31/1896 , H01L2924/1204220130101 , H01L2924/1204420130101 , H01L2924/1203620130101 , H01L2924/1204320130101 , H01L2224/9520130101 , H01L2924/1306320130101 , H01L2924/1420130101 , H01L2924/1305520130101 , H01L21/02603 , Y02P70/50

2.

发明公开
METHOD OF REMOVING A SUBSTRATE 审中-公开

公开(公告)号：EP4411843A2

公开(公告)日：2024-08-07

申请号：EP24169398.5

申请日：2018-05-07

申请人： The Regents of the University of California

发明人： KAMIKAWA, Takeshi , GANDROTHULA, Srinivas , LI, Hongjian , COHEN, Daniel A.

IPC分类号： H01L33/20

CPC分类号： H01L33/0075 , H01L33/20 , H01S5/0217 , H01S5/34333 , H01S2304/1220130101 , H01L33/0093 , H01L21/02389 , H01L21/0254 , H01L21/02647 , H01L21/02458 , H01L2224/3224520130101 , H01L2224/8319220130101 , H01L2224/8389520130101 , H01L2224/3222520130101 , H01L2224/8344420130101 , H01L2224/8320320130101 , H01L2224/0561120130101 , H01L2224/0564420130101 , H01L2924/1574720130101 , H01L2924/103320130101 , H01L2224/0402620130101 , H01L24/05 , H01L24/29 , H01L24/32 , H01L2224/8380520130101 , H01L24/83 , H01L2224/8301320130101 , H01L2224/8302220130101 , H01L2224/2911120130101 , H01L2224/2914420130101 , H01L2224/8344720130101 , H01L2224/8044420130101 , H01L2224/8001320130101 , H01L2224/8020320130101 , H01L2224/8089520130101 , H01L24/80 , H01L2224/0824520130101 , H01L2224/0822520130101 , H01L24/08 , H01L2224/0420130101 , H01L2224/034520130101 , H01L24/03 , H01L2224/8000620130101 , H01L2224/8300520130101 , H01L2224/0823820130101 , H01L2224/0825820130101 , H01L2224/0555820130101 , H01L21/6835 , H01L24/06 , H01L2224/0618120130101 , H01L2924/1204220130101 , H01L2224/920220130101 , H01L2224/9420130101 , H01L24/94 , H01L24/92 , H01L2224/9214220130101 , H01L2224/921220130101 , H01L2221/6838120130101 , H01L2221/6831820130101 , H01L2221/683520130101 , H01L2221/6836320130101 , H01L2224/80420130101 , H01L2224/804920130101 , H01L2224/051820130101 , H01L2224/0514420130101 , H01L2224/0566920130101 , H01L2224/0518420130101 , H01L2224/0513920130101 , H01L2224/0566420130101 , H01L2224/0565520130101 , H01L2224/0563920130101 , H01L2224/0516420130101 , H01L2224/0516620130101 , H01L2224/0516920130101 , H01L2224/056820130101 , H01L2224/0568420130101 , H01L2224/0566620130101 , H01L2224/0515520130101 , H01S5/0203 , H01L2224/29120130101

摘要： A method of removing a substrate, comprising: forming a growth restrict mask with a plurality of striped opening areas directly or indirectly upon a GaN-based substrate; and growing a plurality of semiconductor layers upon the GaN-based substrate using the growth restrict mask, such that the growth extends in a direction parallel to the striped opening areas of the growth restrict mask, and growth is stopped before the semiconductor layers coalesce, thereby resulting in island-like semiconductor layers. A device is processed for each of the island-like semiconductor layers. Etching is performed until at least a part of the growth restrict mask is exposed. The devices are then bonded to a support substrate. The GaN-based substrate is removed from the devices by a wet etching technique that at least partially dissolves the growth restrict mask. The GaN substrate that is removed then can be recycled.

3.

发明授权
INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING 有权转让

公开(公告)号：EP3391409B1

公开(公告)日：2024-05-22

申请号：EP16876775.4

申请日：2016-12-16

IPC分类号： H01L23/485 , H01L21/48 , H01L21/60 , H01L25/065

CPC分类号： H01L25/0657 , H01L2225/0655520130101 , H01L25/50 , H01L2225/0651320130101 , H01L2225/0659320130101 , H01L2224/0823820130101 , H01L2224/0823720130101 , H01L24/05 , H01L24/08 , H01L24/80 , H01L2224/0554120130101 , H01L2224/0555120130101 , H01L2224/0555220130101 , H01L2224/0557120130101 , H01L2224/0557320130101 , H01L2224/0557820130101 , H01L2224/05620130101 , H01L2224/0563920130101 , H01L2224/0564420130101 , H01L2224/0564720130101 , H01L2224/0565520130101 , H01L2224/0568420130101 , H01L2224/080720130101 , H01L2224/0814620130101 , H01L2224/8089520130101 , H01L2224/8089620130101 , H01L2224/0811120130101 , H01L2224/0812120130101 , H01L2224/0814820130101 , H01L2224/8003520130101 , H01L2224/8093520130101 , H01L2224/0420130101 , H01L2224/0566420130101 , H01L2224/8001320130101 , H01L2224/0512420130101 , H01L2224/0507320130101 , H01L2224/8001120130101 , H01L2224/0560920130101 , H01L2224/0561120130101 , H01L2224/8081520130101 , H01L2224/0568720130101 , H01L2224/0568820130101 , H01L2224/0341620130101 , H01L2224/03520130101 , H01L24/03 , H01L2224/0360220130101 , H01L2224/0361620130101 , H01L2224/0346420130101 , H01L2224/0361220130101 , H01L2224/0515520130101 , H01L2924/38120130101 , H01L2924/351220130101 , H01L2224/0566920130101 , H01L2224/0514420130101 , H01L2224/803420130101 , H01L2224/8098620130101 , H01L2224/0556920130101 , H01L2224/0814520130101

4.

发明授权
METHOD OF BONDING AN ELECTRONIC COMPONENT TO A SUBSTRATE BY SOLDERING USING AN SN-AG-CU-SB-NI OR AN SN-AG-CU-SB-NI-(CO,FE) SOLDER ALLOY AND CORRESPONDING SOLDERED ASSEMBLY 有权

公开(公告)号：EP3706161B1

公开(公告)日：2024-10-09

申请号：EP18873077.4

申请日：2018-10-30

IPC分类号： H01L23/488 , H01L23/482 , H01L21/60 , B23K35/26 , C22C13/02 , B23K1/20

CPC分类号： B23K1/008 , C22C13/02 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/8381520130101 , H01L2224/838120130101 , H01L2224/3250320130101 , H01L2924/35120130101 , H01L2924/351220130101 , H01L24/05 , H01L2224/0402620130101 , H01L23/4827 , H01L2224/0508320130101 , H01L2224/034520130101 , H01L2224/034620130101 , H01L2224/3222720130101 , H01L2224/3224520130101 , H01L2224/8320420130101 , H01L2224/8321120130101 , H01L2224/8307520130101 , H01L2224/8306520130101 , H01L2224/8302220130101 , H01L2224/8302420130101 , H01L2224/8304820130101 , H01L2224/29320130101 , H01L2224/29120130101 , H01L2224/2929420130101 , H01L2224/8310120130101 , H01L2224/2911120130101 , H01L2224/8345520130101 , H01L2224/0507320130101 , H01L2224/0508220130101 , H01L2224/0508420130101 , H01L2224/0564420130101 , H01L2224/0563920130101 , H01L2224/0565520130101 , H01L2224/0516620130101 , H01L2224/0512420130101 , H01L2224/0515520130101 , H01L2224/0513920130101 , H01L2224/0514720130101 , H01L2224/0511120130101 , H01L2224/3250720130101 , H01L24/03 , B23K1/0016 , B23K2101/3620180801 , B23K1/203 , B23K1/206 , B23K35/262 , C22C19/03 , B23K35/025 , H01L2224/0564720130101 , H01L2224/0517220130101 , H01L2224/0517120130101 , H01L2224/0561120130101 , H01L2224/0514420130101

5.

发明公开
SEMICONDUCTOR DEVICE WITH SOLDERABLE AND WIRE BONDABLE PART MARKING 审中-实审

公开(公告)号：EP4352785A1

公开(公告)日：2024-04-17

申请号：EP22738516.8

申请日：2022-05-26

申请人： MACOM Technology Solutions Holdings, Inc.

发明人： BARTER, Margaret , BOLES, Timothy

IPC分类号： H01L23/544

CPC分类号： H01L23/544 , H01L2223/5443320130101 , H01L2223/544220130101 , H01L2223/5440620130101 , H01L2223/5448620130101 , H01L2224/0618120130101 , H01L2224/0404220130101 , H01L2224/0566420130101 , H01L2224/0565520130101 , H01L2224/0514420130101 , H01L2924/3512120130101 , H01L2224/4501420130101 , H01L24/05 , H01L2224/0513920130101 , H01L2224/0512420130101 , H01L2224/0514720130101 , H01L2224/034520130101 , H01L2224/034620130101 , H01L2224/0556720130101 , H01L2924/120320130101 , H01L2924/130420130101 , H01L2924/130520130101 , H01L2924/130620130101 , H01L2924/130120130101 , H01L2924/1305520130101 , H01L2924/1025320130101 , H01L24/03 , H01L2224/0566620130101

6.

发明授权
METHOD OF REMOVING A SUBSTRATE 有权

公开(公告)号：EP3619748B1

公开(公告)日：2024-04-17

申请号：EP18794585.2

申请日：2018-05-07

IPC分类号： H01L21/683 , H01L23/00 , H01L33/00 , H01S5/02 , H01L21/02 , H01S5/343 , H01L33/46 , H01L33/32 , H01L33/20

CPC分类号： H01L33/0075 , H01L33/20 , H01S5/0217 , H01S5/34333 , H01S2304/1220130101 , H01L33/0093 , H01L21/02389 , H01L21/0254 , H01L21/02647 , H01L21/02458 , H01L2224/3224520130101 , H01L2224/8319220130101 , H01L2224/8389520130101 , H01L2224/3222520130101 , H01L2224/8344420130101 , H01L2224/8320320130101 , H01L2224/0561120130101 , H01L2224/0564420130101 , H01L2924/1574720130101 , H01L2924/103320130101 , H01L2224/0402620130101 , H01L24/05 , H01L24/29 , H01L24/32 , H01L2224/8380520130101 , H01L24/83 , H01L2224/8301320130101 , H01L2224/8302220130101 , H01L2224/2911120130101 , H01L2224/2914420130101 , H01L2224/8344720130101 , H01L2224/8044420130101 , H01L2224/8001320130101 , H01L2224/8020320130101 , H01L2224/8089520130101 , H01L24/80 , H01L2224/0824520130101 , H01L2224/0822520130101 , H01L24/08 , H01L2224/0420130101 , H01L2224/034520130101 , H01L24/03 , H01L2224/8000620130101 , H01L2224/8300520130101 , H01L2224/0823820130101 , H01L2224/0825820130101 , H01L2224/0555820130101 , H01L21/6835 , H01L24/06 , H01L2224/0618120130101 , H01L2924/1204220130101 , H01L2224/920220130101 , H01L2224/9420130101 , H01L24/94 , H01L24/92 , H01L2224/9214220130101 , H01L2224/921220130101 , H01L2221/6838120130101 , H01L2221/6831820130101 , H01L2221/683520130101 , H01L2221/6836320130101 , H01L2224/80420130101 , H01L2224/804920130101 , H01L2224/051820130101 , H01L2224/0514420130101 , H01L2224/0566920130101 , H01L2224/0518420130101 , H01L2224/0513920130101 , H01L2224/0566420130101 , H01L2224/0565520130101 , H01L2224/0563920130101 , H01L2224/0516420130101 , H01L2224/0516620130101 , H01L2224/0516920130101 , H01L2224/056820130101 , H01L2224/0568420130101 , H01L2224/0566620130101 , H01L2224/0515520130101 , H01S5/0203 , H01L2224/29120130101