Abstract:
Embodiments of the invention are directed to an improved device for sensing infrared (IR) radiation with upconversion to provide an output of electromagnetic radiation having a shorter wavelength than the incident IR radiation, such as visible light. The device comprises an anode, a hole blocking layer to separate an IR sensing layer from the anode, an organic light emitting layer that is separated from the anode by the IR sensing layer, and a cathode. The hole blocking layer assures that when a potential is applied between the anode and the cathode the organic light emitting layer generates electromagnetic radiation only when the IR sensing layer is irradiated with IR radiation.
Abstract:
The present invention provides a germanium photodetector which reduces a dark current without degradation of a photocurrent. The germanium photodetector includes: a silicon substrate; a lower clad layer formed on the silicon substrate; a core layer (210) formed on the lower clad layer; a p-type silicon slab (211) formed in a part of the core layer (210) and doped with a p-type impurity ion; p++ silicon electrode sections (212, 213) that are highly-doped with a p-type impurity and act as an electrode; and germanium layers (241, 242) which absorb light. The germanium photodetector further includes an upper clad layer, an n-type germanium region doped with an n-type impurity above the germanium layer, and an electrode. According to the present invention, two germanium layers (241, 242) are provided on the p-type silicon slab (211) so as to miniaturize the area of the surface of the individual germanium layer in contact with the p-type silicon slab (211), so that the dark current due to threading dislocation can be reduced.
Abstract:
The invention relates to a semiconductor structure (100, 100a, 100b) able to receive electromagnetic radiation and convert it into an electrical signal, such a structure (100, 100a, 100b) comprising a semiconductor substrate (150) having a first surface (151) defining a longitudinal plane, and a first zone (110, 110a, 110b) of a first conductivity type housed in the substrate (150) with a second zone (120, 120a, 120b) of a second, opposite conductivity type, in order to form a semiconductor junction. A means for limiting lateral current is provided and comprises a third zone (130) housed in the substrate and making lateral contact with the second zone (120, 120a, 120b), said third zone (130) being of the second conductivity type, the majority carriers of which are electrons. The third zone (130) has a sufficiently high majority carrier concentration to increase the bandgap via the Moss-Burstein effect.
Abstract:
Laser power conversion with multiple stacked junctions or subcells are disclosed to produce increased output. Both vertical and horizontal integration are disclosed for flexible, efficient, and cost-effective laser power conversion. One embodiment of a laser power converter includes at least a first or top subcell that receives incident laser light, a second subcell below the first subcell that subsequently receives the laser light, and a tunnel junction between the first and second subcells.
Abstract:
Die Erfindung betrifft einen Photodioden-Chip hoher Grenzfrequenz mit einem Leitungsübergang vom aktiven Photodiodenbereich eines Photodioden-Mesas zum Ausgangs-Pad des Hochfrequenzausgangs des Photodioden-Chips. Es bestand Bedarf, beim Bandbreitefaktor von Photodioden-Chips nach weiteren Steigerungen zu suchen. Vorgeschlagen wird hierzu, dass die Verbindung vom Photodioden-Mesa zum Ausgangs-Pad mit einer hochohmigen Leitung mit über deren Länge verteilter Impedanz (Z leitung ) realisiert ist, die mindestens so hoch ist wie die am Ausgangs-Pad wirksame Lastimpedanz (Z last ). Die hochohmige Leitung besitzt eine Länge, die über das technologische Mindestmaß von etwa 30μm hinausgeht.
Abstract:
Die vorliegende Erfindung betrifft eine Vorrichtung mit einem flächig ausgebildetem Trägermaterial (10), welches über zumindest einen Oberflächenbereich verteilt eine Vielzahl von Poren (11) aufweist, welche sich von einer Oberfläche (12) des Trägermaterials zu der gegenüberliegenden Oberfläche (13) durchgängig erstrecken, wobei
die Poren jeweils durch eine Porenbegrenzungsfläche (14) der in dem Trägermaterial ausgebildeten Porenwände (15) begrenzt sind, zumindest ein Teil der Porenwände mindestens bereichsweise einen Schichtaufbau mit einem ersten dotierten Halbleiterbereich (20) und einem von der Porenbegrenzungsfläche beabstandeten zweiten, komplementär dotierten Halbleiterbereich (30) unter Bildung eines p-noder eines p-i-n-Übergangs aufweist, und der erste (20) und der zweite (30) Halbleiterbereich jeweils getrennt voneinander mit einem Anschlußkontakt zur Verschaltung des p-n- bzw. des p-i-n-Übergangs als Photodiode versehen sind. Die erfindungsgemäße Vorrichtung eignet sich als optoelektronischer Biosensor in Verfahren zum Nachweis biochemischer Reaktionen und/oder Bindungen sowie hierfür insbesondere zur Untersuchung von enzymatischen Reaktionen, Nukleinsäure-Hybridisierungen, Protein-Protein-Wechselwirkungen und Protein-Liganden-Wechselwirkungen.
Abstract:
The present invention relates to an array substrate and a fabricating method thereof, a display panel, a display apparatus, an electronic device, a computer program and a recording medium. The array substrate comprises: a base; a thin film transistor provided in a first region on a side of the base; a photoelectric sensor, provided in a second region on the side of the base, for fingerprint identification; and a passivation layer provided on a side of both the thin film transistor and the photoelectric sensor away from the base. According to technical solutions of the present invention, by disposing a photoelectric sensor on a base of an array substrate, the photoelectric sensor can be integrated in the array substrate. In a display apparatus manufactured by using the array substrate, it is possible to place a finger at a position corresponding to a second region of the array substrate for fingerprint identification. Thus, there is no need to set an extra fingerprint identification sensor in the display apparatus, thereby simplifying the manufacturing process and improving the stability and integration of the overall structure.
Abstract:
The invention relates to a UV photodetector having high sensitivity and a low dark current. The aim of the invention is to specify a UV photodetector that has high sensitivity and a low dark current. According to the invention, the fingers (18) of the first electrode structure (14) and the fingers (24) of the second electrode structure (20) comprise a cover layer (30) made of a second semiconducting material, wherein the cover layer (30) is arranged on the absorber layer (12) and directly contacts the absorber layer (12) in the region of the fingers (18, 24), and the first semiconducting material and the second semiconducting material are designed in such a way that a two-dimensional electron gas (2DEG) is formed at the boundary layer between the absorber layer (12) and the cover layer (30) in the region of the fingers (18, 24).