公开(公告)号：EP4425581A1

公开(公告)日：2024-09-04

申请号：EP24159110.6

申请日：2024-02-22

Applicant: AIT Austrian Institute of Technology GmbH

Inventor： SCHRENK, Bernhard Dr. ,  HÜBEL, Hannes Dr.

IPC: H01L31/12 ,  G02B6/12 ,  H04B10/43

CPC classification number: H01L31/125 ,  H04B10/43 ,  G02B6/12004

Abstract: Die Erfindung betrifft eine auf einem Silizium-Chip integrierbare optoelektronische Sendevorrichtung (T1), umfassend
a) einen elektronischen Eingang (TX),
b) einen optischen Wellenleiter-Anschluss (O) zur Abgabe von optischen Signalen,
c) eine Diode (D) in Form einer wellenleitergebundenen Silizium-Germanium pin-Photodiode mit zwei Elektroden (A, K), wobei der der optische Wellenleiter-Anschluss (O) am photosensitiven Bereich der Diode (D) mündet, und
d) einen dem elektronischen Eingang (TX) nachgeschalteten Datentreiber (DRV), der dazu ausgebildet ist, am elektronischen Eingang (TX) anliegende elektronische Signale in Form von elektrischen Strom- und/oder Spannungssignalen an der Diode (D) anzulegen, sodass sich abhängig von dem am Dateneingang (TX) anliegenden Signal ein Stromfluss in Durchlassrichtung der Diode (D) ausbildet, sodass die Diode daraufhin über ihren photosensitiven Bereich elektromagnetische Wellen über den Wellenleiter-Anschluss (O) abgibt.

公开(公告)号：EP3308405A1

公开(公告)日：2018-04-18

申请号：EP16729834.8

申请日：2016-06-07

Applicant: Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V.

Inventor： RICHTER, Bernd ,  WARTENBERG, Philipp ,  FEHSE, Karsten ,  JAHNEL, Matthias

IPC: H01L31/101 ,  H01L27/144 ,  H01L27/32 ,  H01L31/12

CPC classification number: H01L27/307 ,  H01L27/1443 ,  H01L27/281 ,  H01L27/286 ,  H01L27/288 ,  H01L31/1013 ,  H01L31/125

Abstract: The invention relates to a component (10; 30) having a first functional layer (12; 32), which is deposited on a first side of a substrate (11; 31), and having a second functional layer (13; 33), which is deposited on a side of the substrate (11; 31) opposite the first side. At least one first element is formed inside the first functional layer (12; 32) and can be used to detect electromagnetic radiation (14; 34) from a first wavelength range. At least one second element is formed inside the second functional layer (13; 33) and, in a first embodiment of the component, can be used to detect electromagnetic radiation (15) from a second wavelength range, wherein the first functional layer (12) and the substrate (11) are transparent with respect to electromagnetic radiation (15) from the second wavelength range. In an alternative embodiment of the component, the at least second element can be used to emit electromagnetic radiation (35) from a second wavelength range. The functional layers can consist of an organic material. The component according to the invention can be used to implement multispectral sensors (10) and sensor/emitter systems (30). Such sensor/emitter systems have a high degree of filling with respect to the function of detecting electromagnetic radiation and with respect to the function of emitting electromagnetic radiation.

公开(公告)号：EP3057138A1

公开(公告)日：2016-08-17

申请号：EP16153317.9

申请日：2016-01-29

Applicant: Taiwan Biophotonic Corporation

Inventor： CHU, Chang-Sheng ,  LI, Yu-Tang ,  LEE, Yeh-Wen ,  FAN, Chih-Hsun ,  CHUNG, Lung-Pin ,  CHEN, Jyh-Chern ,  CHUNG, Shuang-Chao

IPC: H01L31/173 ,  H01L31/0232 ,  H01L31/0203 ,  A61B5/1455 ,  A61B5/00

CPC classification number: G01J1/0459 ,  A61B5/14552 ,  A61B5/681 ,  A61B2560/0443 ,  A61B2562/0233 ,  A61B2562/164 ,  A61B2562/227 ,  G01J1/0271 ,  G01J1/0437 ,  G01J1/08 ,  G01J1/4228 ,  G01J1/44 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/125 ,  H01L31/173 ,  H01L33/54 ,  H01L33/58 ,  H04B10/071

Abstract: The present disclosure relates to a reflective optical sensor module, an optical sensing accessory, and an optical sensing device. A reflective optical sensor module comprises a light source (110) and a first encapsulant (111), a photodetector (120) and a second encapsulant (121), and a substrate (140). The light source (110) is configured to convert electric power into radiant energy and to emit light to an object surface. The photodetector (120) is configured to receive the light from an object surface and to convert radiant energy into electrical current or voltage. A partition (130) is located between the light source(110) and the photodetector (120). At least one medial surface of the encapsulants (111, 121) forms an optical directional component (113, 123) which may be an inclined plane or a lens. Optical directional components (113, 123) facilitate light extraction efficiency and light receiving efficiency, respectively. In particular, light emitted from the light source (110) can be more concentrated above the partition (130), and is less shed on partition (130). The optical sensing accessory and the optical sensing device comprise the reflective optical sensor module and other electronic modules to have further applications.

Abstract translation: 本发明涉及一种反射式光学传感器模块，光学感测附件和光学感测装置。 反射型光学传感器模块包括光源（110）和第一密封剂（111），光电检测器（120）和第二密封剂（121）以及基板（140）。 光源（110）被配置为将电力转换为辐射能并将光发射到物体表面。 光电检测器（120）被配置为从物体表面接收光并将辐射能转换成电流或电压。 分隔件（130）位于光源（110）和光电检测器（120）之间。 密封剂（111,121）的至少一个内表面形成可以是倾斜平面或透镜的光学方向分量（113,123）。 光学方向分量（113,123）分别促进光提取效率和光接收效率。 特别地，从光源（110）发射的光可以更集中在分隔物（130）上方，并且在分隔物（130）上较少脱落。 光学传感附件和光学感测装置包括反射式光学传感器模块和其它电子模块以进一步应用。

公开(公告)号：EP2985593A1

公开(公告)日：2016-02-17

申请号：EP15002391.9

申请日：2015-08-11

Applicant: Optolane Technologies Inc.

Inventor： LEE, Do Young ,  JEON, In Gyun

IPC: G01N21/64

CPC classification number: G01N21/6428 ,  G01N21/6454 ,  G01N2201/062 ,  H01L31/125 ,  H01L31/18

Abstract: The present disclosure is directed to a biochip (200) including a side emitting-type light-emitting device (211), the bio-chip comprising: a bio-layer (210) having formed therein a plurality of reaction regions (212) in which a biochemical reaction between a reference sample and a target sample occurs; and an image sensor layer (220) formed under the bio-layer und having formed therein a plurality of photodetectors (221), wherein the side emitting-type light-emitting device is disposed in the bio-layer, and light emitted from the sides of the side emitting-type light-emitting device is incident to the plurality of reaction reagions.

Abstract translation: 本公开涉及包括侧发射型发光器件（211）的生物芯片（200），所述生物芯片包括：生物层（210），其中形成有多个反应区域（212），其中 发生参考样品和目标样品之间的生化反应; 以及形成在所述生物层之下并且在其中形成有多个光电检测器（221）的图像传感器层（220），其中所述侧面发射型发光器件设置在所述生物层中，并且从侧面发射的光 侧发光型发光装置入射到多个反应重复。

公开(公告)号：EP2445349A4

公开(公告)日：2012-12-05

申请号：EP10792599

申请日：2010-06-23

Applicant: ROMARK LAB LC

Inventor： ROSSIGNOL JEAN-FRANCOIS ,  SEMPLE J EDWARD

IPC: A61K31/425 ,  A61P31/12 ,  A61P31/16

CPC classification number: A61K31/426 ,  A61K9/0053 ,  A61K9/2086 ,  A61K31/215 ,  A61K31/351 ,  A61K31/454 ,  A61K31/496 ,  A61K31/675 ,  A61K31/7105 ,  A61K45/06 ,  A61K2300/00 ,  H01L31/125

Abstract: This invention is directed to methods for treating and preventing influenza infection by inhibiting influenza virus HA maturation processes employing compounds of formula I. It is also directed to combinations for treating and preventing influenza infection comprising compounds of formula I and other agents.

公开(公告)号：EP2409395A2

公开(公告)日：2012-01-25

申请号：EP10717667.9

申请日：2010-03-18

Applicant: Oksanen, Jani ,  Tulkki, Jaakko

Inventor： Oksanen, Jani ,  Tulkki, Jaakko

IPC: H02N6/00 ,  H01L31/04 ,  H01L31/12 ,  F25B21/00 ,  F25B23/00

CPC classification number: H01L31/0406 ,  F25B21/00 ,  H01L31/125 ,  H02S10/30 ,  Y02B30/66

Abstract: A method and device for generating electrical energy in a thermophotonic generator, where electroluminescence and heat energy absorbed from the environment is used to generate light or other electromagnetic radiation that transfers energy from the emitting element to the absorbing element, where a part of the energy of the absorbed radiation generates electrical energy.

公开(公告)号：EP2381478A3

公开(公告)日：2011-11-02

申请号：EP10011541.9

申请日：1999-02-03

Applicant: Tessera Technologies Hungary Kft.

Inventor： Badehi, Avner

IPC: H01L21/70 ,  H01L27/146 ,  H01L31/0203

CPC classification number: H01L31/02327 ,  H01L21/56 ,  H01L21/82 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/97 ,  H01L25/105 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14687 ,  H01L27/15 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/02164 ,  H01L31/0232 ,  H01L31/125 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/44 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/56 ,  H01L33/62 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method of producing packaged optronic integrated circuit devices comprises (a) providing a transparent protective layer (26) overlying a first surface of a semiconductor wafer (20) including a plurality of dies; (b) forming notches extending into the wafer (20) from a second surface of the wafer (20), the notches being disposed at dice lanes between the dies; (c) providing an insulating layer (42) overlying the second surface of the wafer (20) and having an outer surface facing away from the wafer (20); (d) forming contacts electrically connected to the dies, the contacts extending outo the outer surface of the insulating layer (42); and then severing the transparent protective layer (26) to separate the dies from one another.

Abstract translation: 一种制造封装的光电集成电路器件的方法包括：（a）提供覆盖在包括多个管芯的半导体晶片（20）的第一表面上的透明保护层（26）; （b）从所述晶片（20）的第二表面形成延伸到所述晶片（20）中的凹口，所述凹口设置在所述模具之间的骰子通道处; （c）提供覆盖在晶片（20）的第二表面上并具有背离晶片（20）的外表面的绝缘层（42）; （d）形成电连接到所述模具的触点，所述触点延伸到所述绝缘层（42）的外表面; 然后切断透明保护层（26）以将模具彼此分开。

公开(公告)号：EP2135302A2

公开(公告)日：2009-12-23

申请号：EP08726516.1

申请日：2008-03-06

Applicant: Sensors For Medicine And Science, Inc.

Inventor： COLVIN, Jason, D. ,  COLVIN, Arthur, E. ,  DEHENNIS, Andrew ,  KRSMANOVIC, Jody, L.

IPC: H01L33/00 ,  H01L25/16 ,  A61B5/00 ,  G01N21/64

CPC classification number: H01L33/483 ,  A61B5/14532 ,  A61B5/1459 ,  G01N21/6428 ,  G01N21/8507 ,  H01L25/167 ,  H01L31/0203 ,  H01L31/125 ,  H01L33/44 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light emitting diode for harsh environments includes a substantially transparent substrate, a semiconductor layer deposited on a bottom surface of the substrate, several bonding pads, coupled to the semiconductor layer, formed on the bottom surface of the substrate, and a micro post, formed on each bonding pad, for electrically connecting the light emitting diode to a printed circuit board. An underfill layer may be provided between the bottom surface of the substrate and the top surface of the printed circuit board, to reduce water infiltration under the light emitting diode substrate. Additionally, a diffuser may be mounted to a top surface of the light emitting diode substrate to diffuse the light emitted through the top surface.

公开(公告)号：EP0779661B1

公开(公告)日：2007-07-18

申请号：EP96119978.3

申请日：1996-12-12

Applicant: Oki Data Corporation

Inventor： Ogihara, Mitsuhiko, c/o Oki Electric Ind. Co. Ltd ,  Nakamura, Yukio, c/o Oki Electric Ind. Co. Ltd ,  Shimizu, Takatoku, c/o Oki Electric Ind. Co. Ltd ,  Taninaka, Masumi, c/o Oki Electric Ind. Co. Ltd

IPC: H01L27/15 ,  B41J2/45

CPC classification number: H01L31/022408 ,  H01L27/1446 ,  H01L27/14601 ,  H01L27/14643 ,  H01L27/14683 ,  H01L27/153 ,  H01L27/156 ,  H01L31/125 ,  H01L33/0008

公开(公告)号：EP1597774A1

公开(公告)日：2005-11-23

申请号：EP03735418.0

申请日：2003-05-19

Applicant: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Inventor： GRÜGER, Heinrich ,  SCHNEIDER, Torsten ,  AMELUNG, Jörg ,  SAUER, Bodo

IPC: H01L31/173 ,  H01L51/20

CPC classification number: H01L27/30 ,  H01L27/1446 ,  H01L31/125 ,  H01L31/153 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48472 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/3011 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic component comprising a substrate (30), a light sensor (34a, …, 34h) and a light-emitting diode (36). The light-emitting diode comprises a light-emitting layer produced from an organic material. The optoelectronic component is characterized in that the light sensor (34a, …, 34h) and the light-emitting diode (36) are monolithically integrated into the substrate (30).