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    Cable and connector assembly apparatus and method of use
    1.
    发明公开
    Cable and connector assembly apparatus and method of use 有权
    Vorrichtung zur Kabel- und Steckverbinderanordnung und Verfahren zur Verwendung

    公开(公告)号：EP2101377A1

    公开(公告)日：2009-09-16

    申请号：EP09001432.5

    申请日：2009-02-03

    Applicant: Andrew LLC

    Inventor： Ng, Raymond H. ,  Davis, James B. ,  Carlock, Jim ,  Quinlan, Mike ,  Gudgel, Rich

    IPC: H01R43/02

    CPC classification number: H01R9/05 ,  H01R4/024 ,  H01R43/0207 ,  Y10T29/49123 ,  Y10T29/49126 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49204 ,  Y10T29/53039 ,  Y10T29/5313 ,  Y10T29/53213 ,  Y10T29/53265 ,  Y10T29/53383 ,  Y10T403/7015

    Abstract: A cable assembly apparatus for coupling a connector to a cable having a base supporting an interface pedestal dimensioned to receive the connector; an inductor coil coupled to an inductor coil actuator operable to move the inductor coil between a load position and an operation position proximate the interface pedestal; a grip clamp operable by a clamp actuator to move between an open position and a closed position above the interface pedestal; and a temperature sensor configured to read a temperature proximate the interface pedestal. A method for using the apparatus retains the preassembled connector and cable in an aligned orientation for controlled heating by the induction heater to heat a solder preform to solder the connector to an outer conductor of the cable.

    Abstract translation: 一种用于将连接器耦合到电缆的电缆组合装置，所述电缆具有支撑界面基座的基座，所述接口基座的尺寸被设计成接收连接器; 耦合到电感线圈致动器的电感线圈，其可操作以在负载位置和靠近接口基座的操作位置之间移动电感线圈; 夹紧夹具可由夹紧致动器操作以在接口基座上方的打开位置和闭合位置之间移动; 以及温度传感器，被配置为读取接近基座附近的温度。 使用该装置的方法将预组装的连接器和电缆保持在对准的方位，以便通过感应加热器进行控制加热，以加热焊料预制件以将连接器焊接到电缆的外部导体。

    SOLDER-ON CONNECTOR FOR COAXIAL CABLE
    3.
    发明公开
    SOLDER-ON CONNECTOR FOR COAXIAL CABLE 审中-公开
    用于同轴电缆的焊接连接器

    公开(公告)号：EP1451903A1

    公开(公告)日：2004-09-01

    申请号：EP02784089.1

    申请日：2002-10-11

    Applicant: Corning Gilbert Inc.

    Inventor： KOOIMAN, John, A.

    IPC: H01R9/05

    CPC classification number: H01R24/564 ,  H01R4/023 ,  H01R4/024 ,  H01R2103/00

    Abstract: A solder-on connector (6) for a coaxial cable (8) includes a body (12) having a bore (19) for receiving the outer conductor (30) of the cable, a center pin (20) for connection with the center conductor (30) of the cable, an insulator (22) disposed within the bore of the body for supporting the center pin, and a nut (14) or similar fastener for securing the connector to a mating connector. The insulator extends rearwardly within the body to abut the both the inner wall of the body and the inserted end of the outer conductor (26) of the cable. The rearmost portion (34) of the insulator serves as a solder dam to prevent excess solder (27) form flowing into the bore of the body beyond the end of the outer conductor of the cable. The rearmost end (13) of the body includes an enlarged diameter region (48) for receiving a portion of the cable jacket (24). An inwardly-directed annular shoulder (54) formed upon such enlarged diameter region captivated melted portions (52) of the cable jacket when the outer conductor is soldered to the body.

    Abstract translation: 用于同轴电缆（8）的焊接连接器（6）包括具有用于接收电缆的外导体（30）的孔（19）的主体（12），用于与中心连接的中心销（20） 电缆的导体（30），设置在主体的孔内用于支撑中心销的绝缘体（22），以及用于将连接器固定到配合连接器的螺母（14）或类似紧固件。 绝缘体在本体内向后延伸以邻接本体的内壁和电缆的外导体（26）的插入端。 绝缘体的最后部分（34）用作焊料挡板，以防止过量的焊料（27）形成超过电缆的外导体的端部流入本体的孔中。 本体的最后端（13）包括用于接收电缆套（24）的一部分的直径扩大区域（48）。 当外导体焊接到主体上时，在这种直径扩大的区域上形成的向内指向的环形肩部（54）将电缆护套的熔化部分（52）捕捉到。

    Connection structure of wire and terminal, connecting method therefor and a terminal
    4.
    发明公开
    Connection structure of wire and terminal, connecting method therefor and a terminal 失效
    一导线和一端子，以及用于Verbindugsverfahren终端之间的连接结构

    公开(公告)号：EP0881708A3

    公开(公告)日：1999-10-20

    申请号：EP98109738.9

    申请日：1998-05-28

    Applicant: YAZAKI CORPORATION

    Inventor： Shinchi, Akira, Yazaki Parts Co., Ltd.

    IPC: H01R4/02 ,  H01R13/405 ,  H01R43/02

    CPC classification number: H01R43/0207 ,  H01R4/024 ,  H01R13/405

    Abstract: A soldering material (28) is joined to a surface (13a) of a terminal (13). The terminal (13) is incorporated in a groove (18) of a connector housing (11) so that a covered wire (19) is made into contact with the terminal (13). A cover (12) is mounted so as to insert protrusions (22) into the grooves (18). By carrying out ultrasonic vibration while applying a pressure by a ultrasonic horn, a covering portion of the covered wire is melted and removed. The soldering material (28) is melted by heat generated when the covering portion is melted so that the soldering material (28) is made into contact with the cores thereby the cores and terminal (13) being connected with each other through the soldering material (28). As a result, the soldering material (28) makes a firm contact with the cores.

    Abstract translation: 一种焊接材料（28）被接合到终端（13）的一个面（13a）。 终端（13）在连接器壳体（11），所以没有被覆线（19）被制作成与所述终端（13）相接触的一个沟槽（18）被引入。 一个盖（12）被安装成插入凸（22）进入槽（18）。 通过进行超声波振动，同时用超声波喇叭施加压力，被覆线的包覆部分被熔化和除去。 焊接材料（28）由所产生的热量熔化，当该覆盖部分被熔化，以便做的焊接材料（28）制成与从而芯和终端（13）通过焊接材料相互连接的芯接触（ 28）。 其结果是，钎焊材料（28）与所述核的稳定的接触。

    Lead frame for electroacoustic transducer and electroacoustic transducer
    5.
    发明公开
    Lead frame for electroacoustic transducer and electroacoustic transducer 失效
    Wandler und elektroakustischer Wandler

    公开(公告)号：EP0762800A2

    公开(公告)日：1997-03-12

    申请号：EP96306415.9

    申请日：1996-09-04

    Applicant: STAR MICRONICS CO., LTD.

    Inventor： Ono, Jun c/o Nippon Mining & Metals Co. Ltd. ,  Kubo, Masayoshi c/o Nippon Mining & Metals Co. Ltd ,  Sone, Takahiro c/o Star Micronics Co. Ltd. ,  Suzuki, Kazushi c/o Star Micronics Co. Ltd.

    IPC: H04R1/06

    CPC classification number: C23C28/021 ,  C23C28/023 ,  H01R4/024 ,  H01R13/03 ,  H04R1/06

    Abstract: A lead frame (1) for an electroacoustic transducer, forming leads of the electroacoustic transducer, comprising a metal sheet (2) made of a metal having elongation 20% or higher, a nickel undercoat deposit (3) of a thickness in the range from 0.01 to 2.0 µm formed on the metal sheet (2) by plating in a nickel plating bath containing no brightening agent, and a solder deposit (4) of a thickness in the range from 1.0 to 10 µm formed on the surface of the nickel undercoat deposit (3) by plating in a tin-lead plating bath containing no brightening agent. With the lead frame (1) formed by plating the metal sheet (2) as stated above, micro-cracking occurring in the bent corners of the metal sheet (2) and the solder deposit (4), when the outer leads of the lead frame (1) are bent at an angle of 90°, can be prevented.

    Abstract translation: 一种用于电声换能器的引线框架（1），其形成所述电声换能器的引线，所述引线框架（1）包括由具有伸长率为20％或更高的金属制成的金属片（2），镍底涂层沉积物（3） 通过在不含增亮剂的镍电镀液中电镀而在金属片（2）上形成的0.01〜2.0μm的厚度的焊料沉积物（4），形成在表面上的厚度为1.0〜10μm的焊料沉积物 镍底涂层沉积物（3）通过镀在不含增亮剂的锡铅镀浴中。 通过如上所述通过电镀金属片（2）形成的引线框架（1），当引线的外引线（2）的外引线发生在金属片（2）的弯曲角部和焊料沉积物（4）上的微裂纹 框架（1）以90°的角度弯曲，可以防止。

    Coaxial connector for soldering to semirigid cable
    6.
    发明公开
    Coaxial connector for soldering to semirigid cable 失效
    Koaxialverbinder zumlötenan ein halbsteifes Kabel。

    公开(公告)号：EP0576785A2

    公开(公告)日：1994-01-05

    申请号：EP93103248.6

    申请日：1993-03-01

    Applicant: THE WHITAKER CORPORATION

    Inventor： Leibfried, Richard Glenn, Jr.

    IPC: H01R17/12 ,  H01R13/622 ,  H01R4/02

    CPC classification number: H01R24/40 ,  H01R4/024 ,  H01R13/622 ,  H01R43/0242 ,  H01R2103/00

    Abstract: A retention sleeve (150) is placed over the rearward end (134) of the outer conductive shell (120) of a coaxial plug connector (100), providing a rearward stop for retaining the coupling nut (12) on the shell. The retention sleeve can include an inwardly directed flange (158) at its rearward end for retention of an annular solder preform (132) within the cable-receiving bore (136) of the outer conductive shell. The retention sleeve (150) can be of low resistance copper having a thin outer layer (170) of magnetic high resistance metal, defining a self-regulating temperature source when subjected to RF current, to reflow the solder of the preform (132) and thus solder the outer conductive shell (120) to the semirigid outer conductor (82) of the coaxial cable end inserted into the cable-receiving bore (136) providing for automated soldering.

    Abstract translation: 保持套筒（150）放置在同轴插头连接器（100）的外导电壳体（120）的后端（134）之上，提供用于将联接螺母（12）保持在壳体上的后挡块。 保持套筒在其后端可以包括向内指向的凸缘（158），用于将环形焊料预制件（132）保持在外导电壳体的电缆接收孔（136）内。 保持套筒（150）可以是具有薄的磁性高电阻金属外层（170）的低电阻铜，当受到RF电流时限定自调节温度源，以回流预成型件（132）的焊料和 从而将外导电壳（120）焊接到插入到电缆接收孔（136）中的同轴电缆端的半刚性外导体（82），从而提供自动焊接。

    VERFAHREN ZUM TECHNOLOGISCH OPTIMIERTEN AUSFÜHREN VON LÖTVERBINDUNGEN
    9.
    发明公开
    VERFAHREN ZUM TECHNOLOGISCH OPTIMIERTEN AUSFÜHREN VON LÖTVERBINDUNGEN 审中-公开
    方法技术进行了优化RUNNING焊点

    公开(公告)号：EP2817120A1

    公开(公告)日：2014-12-31

    申请号：EP13706488.7

    申请日：2013-02-21

    Applicant: FEW Fahrzeugelektrikwerk GmbH & Co. KG

    Inventor： JENRICH, Andrè

    IPC: B23K1/00 ,  B23K1/19 ,  H01R43/02 ,  H01R4/02

    CPC classification number: B23K1/0016 ,  B23K1/19 ,  B23K1/203 ,  H01L24/83 ,  H01L2224/8321 ,  H01L2224/83815 ,  H01L2924/0002 ,  H01R4/024

    Abstract: The invention relates to a method for carrying out solder connections in a technologically optimized manner, in particular lead-free solder connections. At least one of the joining partners provides the solder required for the connection. A flux is used in order to activate the solder, and the electric and mechanical connection is carried out by means of a soldering process under the effect of heat and by melting the solder/flux mixture with the inclusion of a subsequent cooling phase. According to the invention, the joining partners and the solder are heated to a temperature below the activation temperature of the solder and the flux in a first temperature treatment phase. Another heating process is then carried out to a temperature above the activation temperature of the flux up to the upper melting range of the solder in a second temperature treatment phase, wherein the solder melts and begins to connect to the respective joining partners. Furthermore, the thermal output previously applied is increased by an additional 5% to 30% in a third temperature treatment phase in order to accelerate the adhesion behavior of the joining partners.

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