VERFAHREN ZUR PROZESSZEITVERKÜRZUNG BEIM LÖTEN ELEKTRISCHER ODER ELEKTRONISCHER BAUTEILE MITTELS ELEKTROMAGNETISCHER INDUKTIONSERWÄRMUNG
    1.
    发明公开
    VERFAHREN ZUR PROZESSZEITVERKÜRZUNG BEIM LÖTEN ELEKTRISCHER ODER ELEKTRONISCHER BAUTEILE MITTELS ELEKTROMAGNETISCHER INDUKTIONSERWÄRMUNG 审中-公开
    VERFAHREN ZURPROZESSZEITVERKÜRZUNGBEIMLÖTENELEKTRISCHER ODER ELEKTRONISCHER BAUTEILE MITTELS ELEKTROMAGNETISCHERINDUKTIONSERWÄRMUNG

    公开(公告)号:EP3191249A1

    公开(公告)日:2017-07-19

    申请号:EP15763876.8

    申请日:2015-09-10

    Inventor: JENRICH, André

    Abstract: The invention relates to a method for shortening the process time during the soldering of electric or electronic components by means of electromagnetic induction heating, in particular the soldering of electric contact elements to solder connection surfaces that are applied to a non-metallic substrate, in particular a pane of glass. According to the invention, an electric contact element is first produced, designed as a solder foot, made of a material with an iron-nickel or iron-chromium alloy base. Subsequently, a lead-free connecting material is applied to the solder foot. After the solder foot has been positioned on the respective solder connection surface, the solder foot is inductively heated by means of high frequency energy with increased heating of the solder foot material and reduced heating of the silver-containing material of the respective solder connection surface. The soldering stage is completed after a time of

    Abstract translation: 本发明涉及一种用于通过电磁感应加热来缩短电气或电子部件焊接过程中的处理时间的方法,特别是电接触元件焊接到施加到非金属衬底的焊接连接表面的焊接,特别是 一片玻璃。 根据本发明,首先制造电接触元件,其设计为焊脚,由具有铁 - 镍或铁 - 铬合金基底的材料制成。 随后,将无铅连接材料施加到焊脚。 在焊脚已经定位在相应的焊料连接表面上之后,通过高频能量对焊脚进行感应加热,同时增加焊脚材料的加热并且减少相应焊料连接表面的含银材料的加热。 焊接阶段在<10s的时间内完成,特别是在<4s至6s的时间内完成。 本发明还涉及特殊焊脚形式的接触元件。

    VERFAHREN UND VORRICHTUNG ZUM GLEICHMÄSSIGEN BESCHICHTEN EINES METALLISCHEN ODER METALLISIERTEN GEWEBESCHLAUCHES
    2.
    发明公开
    VERFAHREN UND VORRICHTUNG ZUM GLEICHMÄSSIGEN BESCHICHTEN EINES METALLISCHEN ODER METALLISIERTEN GEWEBESCHLAUCHES 审中-公开
    方法和装置均匀涂层的金属或金属夹布胶管

    公开(公告)号:EP3119554A1

    公开(公告)日:2017-01-25

    申请号:EP15708161.3

    申请日:2015-02-26

    Abstract: The invention relates to a method for uniformly coating a metallic or metallized braided hose (2), in particular a stranded strip tube (2) with a solder (5) or a soldering agent and flux. According to the invention, the solder (5) is provided in rod or tube form, wherein the outside diameter or the cross-sectional area of the rod or the tube is chosen to be less than the inside diameter or the inner cross-sectional area of the braided hose. Furthermore, the solder (5) is pushed into at least one longitudinal portion of the braided hose (2) and the solder is fixed in the braided hose cavity. Further processing of the braided hose, in particular heating to the melting point of the solder introduced, can then be performed in a way known per se.

    Abstract translation: 本发明涉及一种用于用焊料或钎焊和助熔剂涂覆金属或金属化一致编织软管,特别是绞合编织软管。 。根据本发明,焊料以现金或管状的形状提供,worin外径或棒的横截面面积或管被选择为小于内径或编织的内径截面积 裤子。 进一步,焊料被推入编织软管中的至少一个纵向部分和焊料被固定在空腔编织软管。 软管编织的进一步加工,特别是加热到介绍了焊料的熔点,然后可以在一个基因的反弹公知的方式进行。

    VERFAHREN ZUM TECHNOLOGISCH OPTIMIERTEN AUSFÜHREN VON LÖTVERBINDUNGEN
    3.
    发明公开
    VERFAHREN ZUM TECHNOLOGISCH OPTIMIERTEN AUSFÜHREN VON LÖTVERBINDUNGEN 审中-公开
    方法技术进行了优化RUNNING焊点

    公开(公告)号:EP2817120A1

    公开(公告)日:2014-12-31

    申请号:EP13706488.7

    申请日:2013-02-21

    Inventor: JENRICH, Andrè

    Abstract: The invention relates to a method for carrying out solder connections in a technologically optimized manner, in particular lead-free solder connections. At least one of the joining partners provides the solder required for the connection. A flux is used in order to activate the solder, and the electric and mechanical connection is carried out by means of a soldering process under the effect of heat and by melting the solder/flux mixture with the inclusion of a subsequent cooling phase. According to the invention, the joining partners and the solder are heated to a temperature below the activation temperature of the solder and the flux in a first temperature treatment phase. Another heating process is then carried out to a temperature above the activation temperature of the flux up to the upper melting range of the solder in a second temperature treatment phase, wherein the solder melts and begins to connect to the respective joining partners. Furthermore, the thermal output previously applied is increased by an additional 5% to 30% in a third temperature treatment phase in order to accelerate the adhesion behavior of the joining partners.

    KONTAKTIERUNGSANORDNUNG FÜR AUF FLÄCHIGEN GEBILDEN, NÄMLICH GLASSCHEIBEN, VORHANDENE LEITER
    4.
    发明公开
    KONTAKTIERUNGSANORDNUNG FÜR AUF FLÄCHIGEN GEBILDEN, NÄMLICH GLASSCHEIBEN, VORHANDENE LEITER 审中-公开
    有关表面结构接触布置,玻璃,AVAILABLE HEAD

    公开(公告)号:EP2641453A1

    公开(公告)日:2013-09-25

    申请号:EP11779677.1

    申请日:2011-11-09

    Abstract: The invention relates to a contacting arrangement for conductors provided on flat structures, namely glass panes, the conductors having a contact point in their connecting section, wherein one end of a connecting cable or another connection device is electrically and mechanically connected with a pad including a conductive fleece or double-sided conductive adhesive tape, wherein the connecting cable configured in this way is introduced into an encasement block which is open at one side and which includes a frame which surrounds the fleece or the conductive adhesive tape and which is provided with adhesive, wherein the surface of the conductive fleece which is laterally defined by the frame is matched to the area of the contact point in order to provide a contact connection between the contact point and the fleece surface through an adhesive joint between the frame and the flat structure, wherein the frame with the encasement element closes off the contact point in sealing fashion towards the ambient and a portion of the frame is usable as a sealing lip for preventing adhesives from spreading out when the glass pane is fitted.

    KONTAKTIERUNGSANORDNUNG FÜR AUF FLÄCHIGEN GEBILDEN, INSBESONDERE GLASSCHEIBEN, VORHANDENE LEITER
    5.
    发明公开
    KONTAKTIERUNGSANORDNUNG FÜR AUF FLÄCHIGEN GEBILDEN, INSBESONDERE GLASSCHEIBEN, VORHANDENE LEITER 有权
    接触装置有关的表面结构,特别是玻璃,AVAILABLE HEAD

    公开(公告)号:EP2430877A1

    公开(公告)日:2012-03-21

    申请号:EP11708275.0

    申请日:2011-03-15

    CPC classification number: H05B3/86 H01R4/04 H05B2203/016 Y10S439/919

    Abstract: The present invention relates to a contacting assembly for conductors that are present on flat structures, in particular glass panels, and have a contact point in the connection section. According to the invention, an end of a connecting cable or of another connecting means, for example, a connecting plug, is connected electrically and mechanically to a pad made of a conductive nonwoven fabric. The connecting cable thus assembled is introduced into a casting block which is open on one side and which has a frame that is provided with adhesive and encloses the nonwoven fabric. The surface of the conductive nonwoven fabric which is delimited laterally by the frame is matched to the area of the contact point, in order to produce, via an adhesive bond between the frame and the flat structure, a contacting connection created by surface pressing between the contact point and the nonwoven fabric surface, wherein the frame together with the casting body seals the contact point with respect to the surrounding area.

    KONTAKTIERUNGS- UND VERBINDUNGSANORDNUNG AUF DER BASIS VON IN EINEM GEHÄUSE EINGEBRACHTEN FOLIENLEITERN
    9.
    发明公开
    KONTAKTIERUNGS- UND VERBINDUNGSANORDNUNG AUF DER BASIS VON IN EINEM GEHÄUSE EINGEBRACHTEN FOLIENLEITERN 有权
    基于在一个壳体接触,并连接装置已经提升电影导演

    公开(公告)号:EP2532051A1

    公开(公告)日:2012-12-12

    申请号:EP11722341.2

    申请日:2011-04-29

    Inventor: JENRICH, André

    CPC classification number: H01R4/04 H01R12/613 Y10S248/906

    Abstract: The invention relates to a contact-making and connection arrangement on the basis of film conductors introduced in a housing, wherein ends of the film conductors have a contact-making section and at least partly lie one above another. According to the invention, a double-sided self-adhesive or adhesive-coated conductive nonwoven material is situated between the contact-making sections facing one another, said material mechanically and electrically connecting the ends of the film conductors. Furthermore, the housing is embodied such that it is divided in the plane of the film conductors that have been introduced or are to be introduced, wherein the housing parts form half-shells and, in at least one half-shell, stamp-like projections are provided which lead to a deformation of the contact-making layer in such a way that a reduction of the electrical contact resistance of the connection occurs.

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