IMPROVED ELECTRICAL MOTOR ARRANGEMENT
    3.
    发明公开

    公开(公告)号:EP4439941A1

    公开(公告)日:2024-10-02

    申请号:EP23165984.8

    申请日:2023-03-31

    Inventor: MOUNZER, Raid

    CPC classification number: H02K16/005 H02K7/116 H02K7/1021

    Abstract: An electrical motor arrangement for providing rotational movement for a transmission of a vehicle, comprising: a first rotational means (12) for providing a first rotational movement of the electrical motor arrangement (10); and a second rotational means (16) for providing a second rotational movement of the electrical motor arrangement (10); whereby in a first configuration, the first rotational means (12) is configured as a stator of the electrical motor arrangement (10) and the second rotational means (16) is configured as rotor of the electrical motor arrangement (10) and whereby in a second configuration, the first rotational means (12) is configured as a rotor of the electrical motor arrangement (10) and the second rotational means (16) is configured as stator of the electrical motor arrangement (10); whereby the first rotational movement and/or the second rotational movement is provided to a transmission arrangement (30).

    VEHICLE DRIVE DEVICE
    10.
    发明公开

    公开(公告)号:EP4412074A1

    公开(公告)日:2024-08-07

    申请号:EP22876304.1

    申请日:2022-09-28

    CPC classification number: H02M7/48 H02K11/33 B60K1/02 H02K7/116 B60L9/18

    Abstract: A vehicle drive device (10) includes: a motor unit (1) that includes a motor for driving mounted on a vehicle and a gear mechanism that transmits torque of the motor to each of left and right wheels of the vehicle; and an inverter (4) that is arranged over the motor unit (1) and that includes a capacitor (5) smoothing electricity and a semiconductor module (6) including a plurality of switching elements, wherein the inverter (4) includes a tray unit (16) that accommodates the capacitor (5) and the semiconductor module (6), and a cover (15) that is in a flat-plate shape, is attached to the tray unit (16), and covers the capacitor (5) and the semiconductor module (6) from above the capacitor (5) and the semiconductor module (6), the cover(15) is integrated with a cooling unit (20) through which a coolant for cooling the inverter (4) flows, and the capacitor (5) and the semiconductor module (6) are attached to a lower surface (17) of the cover (15).

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