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公开(公告)号：EP3123482B1
公开(公告)日：2018-10-03
申请号：EP15717995.3
申请日：2015-03-19
Applicant: E. I. du Pont de Nemours and Company
Inventor： DORFMAN, Jay Robert , VOULTOS, John D.
IPC: H01B1/22 , H05K1/09 , C08L71/00 , H03K17/96 , C08L75/04 , B29C45/14 , B29K75/00 , B29C51/12 , B29L9/00 , H01B1/20 , H01B3/18 , H05K1/16
CPC classification number: H01B3/18 , B29C45/14639 , B29C51/12 , B29K2075/00 , B29L2009/00 , C08K3/22 , C08K3/2279 , C08K2003/2231 , C08L71/00 , C08L75/04 , C08L101/00 , H01B1/20 , H01B1/22 , H03K17/962 , H03K2217/96019 , H03K2217/96062 , H03K2217/960755 , H05K1/095 , H05K1/16 , H05K2201/0108 , H05K2201/10151 , Y10T428/31605 , Y10T428/31609
Abstract: This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
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公开(公告)号：EP2569645A4
公开(公告)日：2014-09-24
申请号：EP11781173
申请日：2011-05-10
Applicant: PURE IMAGINATION LLC
Inventor： ODOM PHILIP T , WALLACE MICHAEL
IPC: G01R27/26 , H03K17/96 , H03K17/975
CPC classification number: H03K17/975 , H03K17/962 , H03K2017/9602 , H03K2217/96019
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公开(公告)号：EP2051380A3
公开(公告)日：2011-12-07
申请号：EP08166694.3
申请日：2008-10-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ryu, Seung-Woo Samsung Electronics Co., Ltd. , Yun, Heung-Sik Samsung Electronics Co., Ltd.
CPC classification number: H03K17/962 , G06F3/0202 , H03K2217/96019 , H03K2217/960705 , H03K2217/960755
Abstract: An electrostatic discharge apparatus for a touch key. A need for a conductive material or a ground layer included in the touch key is removed and a ground pattern portion is formed to prevent damage caused by static electricity introduced into the touch key. The electrostatic discharge apparatus for a touch key having a touch sensing unit and a connector unit extending from one end of the touch sensing unit includes a ground pattern portion having at least one ground pattern, which is included in the touch key and formed on a static-electricity path of the touch key, and a conduction-processing portion connecting the ground patterns with each other and connected with a main body, thereby removing a need for a ground layer provided along an internal circumference of a conventional touch sensing unit, reducing cost by not including EMI paint on the entire surface of the touch key, and preventing static electricity from being introduced into internal circuits of the touch key by causing static electricity introduced into the ground pattern portion to be discharged without passing through the internal circuits of the touch key, thus improving the stability and durability of the touch key.
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公开(公告)号：EP2286419A4
公开(公告)日：2012-01-11
申请号：EP08873908
申请日：2008-09-17
Applicant: INK LOGIX LLC
Inventor： HAAG RONALD H , ENGEL JEFFREY R , BODDIE WILLIAM W
CPC classification number: H01H11/04 , B29C45/14639 , B29C2045/14237 , B29K2995/0011 , B29L2031/466 , H03K17/962 , H03K17/9622 , H03K2217/96019 , H03K2217/960755 , H03K2217/960785 , H03K2217/96079 , H05K9/0092 , Y10T29/49082
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5.发明公开
公开(公告)号：EP0730813A1
公开(公告)日：1996-09-11
申请号：EP94906259.0
申请日：1994-02-09
Applicant: TACTILIS
Inventor： ANSEL, Daniel , NERI, Christian
CPC classification number: F21V23/04 , H03K17/96 , H03K2017/9609 , H03K2217/96019 , H03K2217/9605 , H05B39/085 , Y10S323/904 , Y10T307/74 , Y10T307/766
Abstract: A system for supplying at least one electrical apparatus provides touch control and can be used in particular in home automation for supplying electrical equipment such as light bulbs, strip lights, electrical power points, motors, etc., or can form part of equipment such as lamps and lamp stands. The system comprises zones (such as continuous strips B1... B4 on partitions) chemically treated to reduce impedance and to allow leakage currents to flow to the detection inputs of static modules ( M1... M4) providing a switching or dimming function. The treated strips (B1... B4) comprise user accessible portions (A1... A4) which, when touched, generate leakage currents and control the electrical equipment.
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Patent Agency Ranking6.发明公开THERMOFORMABLE POLYMER THICK FILM TRANSPARENT CONDUCTOR WITH HAPTIC RESPONSE AND ITS USE IN CAPACITIVE SWITCH CIRCUITS 审中-公开带有触觉反应WÄRMEFORMBARER透明聚合物厚电影导演和用法电容电路
公开(公告)号：EP3123482A1
公开(公告)日：2017-02-01
申请号：EP15717995.3
申请日：2015-03-19
Applicant: E. I. du Pont de Nemours and Company
Inventor： DORFMAN, Jay Robert , VOULTOS, John D.
CPC classification number: H01B3/18 , B29C45/14639 , B29C51/12 , B29K2075/00 , B29L2009/00 , C08K3/22 , C08K3/2279 , C08K2003/2231 , C08L71/00 , C08L75/04 , C08L101/00 , H01B1/20 , H01B1/22 , H03K17/962 , H03K2217/96019 , H03K2217/96062 , H03K2217/960755 , H05K1/095 , H05K1/16 , H05K2201/0108 , H05K2201/10151 , Y10T428/31605 , Y10T428/31609
Abstract: This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
Abstract translation: 本发明涉及具有触觉响应能力的聚合物厚膜透明导电性组合物也可在应用中使用的碱的热成形基底上的情况发生时，E. G.，如电容式开关。 聚碳酸酯衬底经常使用作为底物，没有任何阻挡层，可以使用聚合物厚膜导电组合物。 取决于具体设计，所述可热成形透明导体可以是下方或可热成形的银导体的顶部。 热成形的电气电路受益于密封剂层的存在在干燥的聚合物厚膜导电组合物。 该电路随后经受注射模制工艺。
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公开(公告)号：EP2569645A2
公开(公告)日：2013-03-20
申请号：EP11781173.7
申请日：2011-05-10
Applicant: Pure Imagination LLC
Inventor： ODOM, Philip, T. , WALLACE, Michael
IPC: G01R27/26
CPC classification number: H03K17/975 , H03K17/962 , H03K2017/9602 , H03K2217/96019
Abstract: Thin film capacitive touch sensors and applications thereof are described herein. Embodiments include construction of one-sided and two-sided thin film capacitive touch sensors with partial fill patterns, one-sided thin film capacitive touch sensors including conductive ground plane layers, one-sided thin film capacitive touch sensors including air gap layers, one-sided thin film capacitive touch sensors including a combination of both separation layers to create air gap layers and conductive ground plane layers.
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公开(公告)号：EP2286419A1
公开(公告)日：2011-02-23
申请号：EP08873908.1
申请日：2008-09-17
Applicant: Ink-logix, LLC
Inventor： HAAG, Ronald, H. , ENGEL, Jeffrey, R. , BODDIE, William, W.
IPC: H01C1/06
CPC classification number: H01H11/04 , B29C45/14639 , B29C2045/14237 , B29K2995/0011 , B29L2031/466 , H03K17/962 , H03K17/9622 , H03K2217/96019 , H03K2217/960755 , H03K2217/960785 , H03K2217/96079 , H05K9/0092 , Y10T29/49082
Abstract: An article of manufacture having an in-molded resistive and/or shielding element and method of making the same are shown and described. In one disclosed method, a resistive and/or shielding element is printed on a film. The film is formed to a desired shape and put in an injection mold. A molten plastic material is introduced into the injection mold to form a rigid structure that retains the film.
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公开(公告)号：EP3123481B1
公开(公告)日：2018-09-12
申请号：EP15715028.5
申请日：2015-03-19
Applicant: E. I. du Pont de Nemours and Company
Inventor： DORFMAN, Jay Robert , VOULTOS, John D.
IPC: H01B1/22 , H05K1/09 , C08L71/00 , H03K17/96 , C08L75/04 , H01B1/20 , H01B3/18 , H05K1/16 , B29L9/00 , B29C51/12 , B29C45/14 , B29K75/00
CPC classification number: H01B3/18 , B29C45/14639 , B29C51/12 , B29K2075/00 , B29L2009/00 , C08K3/22 , C08K3/2279 , C08K2003/2231 , C08L71/00 , C08L75/04 , C08L101/00 , H01B1/20 , H01B1/22 , H03K17/962 , H03K2217/96019 , H03K2217/96062 , H03K2217/960755 , H05K1/095 , H05K1/16 , H05K2201/0108 , H05K2201/10151 , Y10T428/31605 , Y10T428/31609
Abstract: This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
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10.发明公开THERMOFORMABLE POLYMER THICK FILM TRANSPARENT CONDUCTOR WITH HAPTIC RESPONSE AND ITS USE IN CAPACITIVE SWITCH CIRCUITS 审中-公开具有热敏电阻的热变性聚合物厚膜透明导体及其在电容式开关电路中的应用
公开(公告)号：EP3123481A1
公开(公告)日：2017-02-01
申请号：EP15715028.5
申请日：2015-03-19
Applicant: E. I. du Pont de Nemours and Company
Inventor： DORFMAN, Jay Robert , VOULTOS, John D.
CPC classification number: H01B3/18 , B29C45/14639 , B29C51/12 , B29K2075/00 , B29L2009/00 , C08K3/22 , C08K3/2279 , C08K2003/2231 , C08L71/00 , C08L75/04 , C08L101/00 , H01B1/20 , H01B1/22 , H03K17/962 , H03K2217/96019 , H03K2217/96062 , H03K2217/960755 , H05K1/095 , H05K1/16 , H05K2201/0108 , H05K2201/10151 , Y10T428/31605 , Y10T428/31609
Abstract: This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
Abstract translation: 本发明涉及具有触觉响应能力的聚合物厚膜透明导电组合物，其可用于其中基础衬底的热成形发生的应用中，例如在电容式开关中。 经常使用聚碳酸酯基材作为基材，并且聚合物厚膜导电组合物可以在没有任何阻隔层的情况下使用。 根据具体设计，可热成型透明导体可能位于可热成型银导体的下方或顶部。 可热成形的电路受益于干燥的聚合物厚膜导电组合物上方的密封剂层的存在。 随后使电路经受注塑工艺。
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