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公开(公告)号：EP3241417A1
公开(公告)日：2017-11-08
申请号：EP15875363.2
申请日：2015-11-11
申请人： Elbit Systems Ltd.
CPC分类号： H05K1/0271 , D03D1/0082 , D03D11/00 , D03D15/0011 , D03D25/005 , D10B2101/06 , H05K1/0201 , H05K1/0366 , H05K1/09 , H05K1/115 , H05K1/18 , H05K3/0011 , H05K3/42 , H05K3/429 , H05K7/1422 , H05K7/20163 , H05K7/20563 , H05K7/207 , H05K2201/029 , H05K2201/068
摘要： A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.
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公开(公告)号：EP2894524A4
公开(公告)日：2016-08-31
申请号：EP12884059
申请日：2012-09-04
申请人： FUJITSU LTD
发明人： OGAWA MASATOSHI , ENDO HIROSHI , FUKUDA HIROYUKI , KONDO MASAO
CPC分类号： G06F1/206 , G01K13/02 , G06F11/3051 , H05K7/20136 , H05K7/207 , H05K7/20836 , Y02B60/1275 , Y02D10/16
摘要： [Problem] There is provided a temperature management system capable of suppressing deterioration in control performance attributed to reset windup, and efficiently cooling an electronic device such as a computer. [Solution] A temperature management system includes: temperature detection units (32) which individually detect temperatures of a plurality of electronic devices each changing an amount of heat generation depending on its operational state; a cooling device (12) which cools the electronic devices; and a control unit (30) which controls the cooling device (12) depending on outputs from the temperature detection units (32). The control unit (30) includes: an idle state determination unit (44) which determines whether or not the electronic devices are in an idle state; a manipulated variable calculation unit (40) which has an integrator (50) and calculates a manipulated variable by using a difference between a target value and a controlled variable; and an accumulation value correction unit (45) which corrects an accumulation value of the integrator (50) with a predetermined value when the idle state determination unit (44) determines that the electronic devices are in the idle state.
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3.发明公开METHOD AND APPARATUS TO MANAGE COOLANT PRESSURE AND FLOW FOR AN ARRAY OF LIQUID SUBMERGED ELECTRONIC DEVICES 审中-公开用于管理在液体阵列中的冷却剂压力和-FLUSSES METHOD AND DEVICE浸渍电子器件
公开(公告)号：EP2901829A4
公开(公告)日：2016-05-11
申请号：EP13842213
申请日：2013-09-25
发明人： REGIMBAL LAURENT , ARCHER SEAN , SHAFER STEVE , TUFTY LYLE R
IPC分类号： H05K7/20
CPC分类号： H05K7/20636 , H05K7/20236 , H05K7/20272 , H05K7/207 , H05K7/20772 , H05K7/20781
摘要： A fluid delivery system configuration is described for use with an array of liquid submersion cooled electronic devices disposed in a rack, such as an array of liquid submerged servers. The fluid delivery system allows for the pumping system to generate pressure and flow of the cooling system fluid at slightly higher levels than is necessary for the worst case device/position within the array and to provide for uniformity of delivery pressure and coolant flow to each and every device within the array.
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公开(公告)号：EP2416637B1
公开(公告)日：2016-03-16
申请号：EP10075338.3
申请日：2010-08-05
发明人： Skrobek Norbert , Alfakhrany, Tarek , Munn, Derek
CPC分类号： H05K7/2059 , H05K7/20618 , H05K7/207
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公开(公告)号：EP2947329A4
公开(公告)日：2016-02-24
申请号：EP13874149
申请日：2013-09-18
申请人： ZTE CORP
发明人： CHEN JIN
CPC分类号： F04D27/004 , F04D25/166 , H05K7/20563 , H05K7/20572 , H05K7/207
摘要： Disclosed are a method and an apparatus for controlling subrack fans. The method comprises: by installing multiple boards installed with high-power components in different areas of a subrack respectively, forming multiple heat dissipation air channels corresponding to the multiple boards respectively; installing a fan group comprising multiple heat dissipation fans on the subrack; dividing the fan group into multiple fan areas corresponding to the multiple heat dissipation air channels respectively, so that each fan area blows air to a corresponding board through a corresponding heat dissipation air channel; detecting temperature of each board and a rotating speed of a corresponding fan area in real time; adjusting the rotating speed of the fan area according to a detection result, so that the rotating speed of the fan area increases or decreases as the temperature of the corresponding board increases or decreases. Also disclosed is the apparatus for controlling subrack fans. According to the present invention, power consumption and noise of fans can be reduced effectively while ensuring system heat dissipation and a rotating speed of each fan can be displayed correctly.
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公开(公告)号：EP2986097A1
公开(公告)日：2016-02-17
申请号：EP14855250.8
申请日：2014-05-09
发明人： LIU, Yunju , LU, Quanming , XIAO, Tanfu
IPC分类号： H05K7/20
CPC分类号： H05K7/20281 , H05K7/20254 , H05K7/20263 , H05K7/20272 , H05K7/207
摘要： The present invention discloses a liquid cooling system and a control method thereof. The liquid cooling system includes at least two second-level liquid circulation loops and a cooling control apparatus. One second-level liquid circulation loop is provided with a circulating pump configured to control a liquid flow and a sensing apparatus configured to acquire liquid sample data. The control method includes: acquiring liquid sample data by using sensing apparatuses of a liquid cooling system; implementing sharing of the liquid sample data of the sensing apparatuses by using a cooling control apparatus, performing analytical processing on the liquid sample data, and calculating a circulation regulation value of circulating pumps; and sending the circulation regulation value to the circulating pumps by using the cooling control apparatus, so that the circulating pumps run according to the circulation regulation value. In this way, all second-level liquid circulation loops run in a same running state, and when a liquid condition in one second-level liquid circulation loop changes, the circulating pumps on all the second-level liquid circulation loops can be adjusted simultaneously, so as to achieve system balance.
摘要翻译： 本发明公开了一种液体冷却系统及其控制方法。 液体冷却系统包括至少两个第二级液体循环回路和冷却控制装置。 一个第二级液体循环回路设置有构造成控制液体流量的循环泵和构造成获取液体样本数据的传感装置。 该控制方法包括：利用液体冷却系统的感测装置获取液体样本数据; 利用冷却控制装置实现感测装置的液体样本数据的共享，对液体样本数据进行分析处理，并计算出循环泵的循环调节值; 并通过所述冷却控制装置将所述循环调节值发送给所述循环泵，使所述循环泵按照所述循环调节值运行。 这样，所有的二级液体循环回路都处于相同的运行状态，当一个二级液体循环回路中的液体状态发生变化时，所有二级液体循环回路上的循环泵都可以同时调节， 以达到系统平衡。
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公开(公告)号：EP2894524A1
公开(公告)日：2015-07-15
申请号：EP12884059.2
申请日：2012-09-04
申请人： Fujitsu Limited
CPC分类号： G06F1/206 , G01K13/02 , G06F11/3051 , H05K7/20136 , H05K7/207 , H05K7/20836 , Y02D10/16
摘要： [Problem]
There is provided a temperature management system capable of suppressing deterioration in control performance attributed to reset windup, and efficiently cooling an electronic device such as a computer.
[Solution]
A temperature management system includes: temperature detection units (32) which individually detect temperatures of a plurality of electronic devices each changing an amount of heat generation depending on its operational state; a cooling device (12) which cools the electronic devices; and a control unit (30) which controls the cooling device (12) depending on outputs from the temperature detection units (32). The control unit (30) includes: an idle state determination unit (44) which determines whether or not the electronic devices are in an idle state; a manipulated variable calculation unit (40) which has an integrator (50) and calculates a manipulated variable by using a difference between a target value and a controlled variable; and an accumulation value correction unit (45) which corrects an accumulation value of the integrator (50) with a predetermined value when the idle state determination unit (44) determines that the electronic devices are in the idle state.摘要翻译： [问题]提供了一种温度管理系统，其能够抑制归因于复位结束的控制性能的劣化，并且有效地冷却诸如计算机的电子设备。 [解决方案]温度管理系统包括：温度检测单元（32），其单独地检测根据其操作状态改变发热量的多个电子设备的温度; 冷却装置（12），其冷却电子装置; 以及根据来自温度检测单元（32）的输出来控制冷却装置（12）的控制单元（30）。 控制单元（30）包括：空闲状态确定单元（44），确定电子设备是否处于空闲状态; 具有积分器（50）并通过使用目标值和受控变量之间的差来计算操作变量的操作变量计算单元（40） 以及当空闲状态确定单元（44）确定电子设备处于空闲状态时，以预定值校正积分器（50）的累积值的累加值校正单元（45）。
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公开(公告)号：EP2591647A1
公开(公告)日：2013-05-15
申请号：EP11730634.0
申请日：2011-07-05
发明人： HOLZMANN, Gottfried , MITTERMAIER, Werner , JELEN, Matthias , ROTH, Martin , OETJEN, Martin , MOSER, Albert , MAHR, Roland
IPC分类号： H05K7/20
摘要： The invention relates to an electronic apparatus having a plurality of electronic assemblies (2.1, 2.2, 2.3, 2.4) and a cooling apparatus (3) for cooling the electronic assemblies (2.1, 2.2, 2.3, 2.4). The cooling apparatus (3) has a cooling power distribution apparatus (6). The cooling power distribution apparatus (6) can be used to individually control a cooling power of the cooling apparatus (3) for each assembly (2.1, 2.2, 2.3, 2.4). The apparatus also has a temperature detection means (10, 11.1, 11.2, 11.3, 11.4) for each assembly in order to detect a temperature of each assembly and a loading determination apparatus (12) for determining a characteristic variable for each assembly (2.1, 2.2, 2.3, 2.4), said characteristic variable describing the loading experienced by an assembly (2.1, 2.2, 2.3, 2.4) on the basis of the detected temperature of this assembly (2.1, 2.2, 2.3, 2.4). A control apparatus (7) controls the cooling power distribution apparatus (6) on the basis of the determined characteristic variables of the assemblies (2.1, 2.2, 2.3, 2.4).
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公开(公告)号：EP2351474B1
公开(公告)日：2013-04-17
申请号：EP08876275.2
申请日：2008-11-03
发明人： HEDBERG, Klas , JONSSON, Fredrik
IPC分类号： H05K7/20
CPC分类号： H05K7/207 , H05K7/206 , H05K7/20609
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10.发明授权
公开(公告)号：EP2347642B1
公开(公告)日：2013-04-17
申请号：EP08876277.8
申请日：2008-11-03
发明人： HEDBERG, Klas
CPC分类号： F28D15/0266 , F28D15/06 , H05K7/20609 , H05K7/20681 , H05K7/207
摘要： A system in a radio network node for regulating temperature of electronic equipment comprises the electronic equipment and a heat exchanger unit (200), comprising an evaporator unit (202), a condenser unit (203), and a first pipe (204). The first pipe (204) is arranged to connect the evaporator unit (202) and the condenser unit (203). A second fluid is flowable from the condenser unit (203) to the evaporator unit (202) in the first pipe (204). Furthermore, the system comprises a heater unit (201) arranged at the first pipe (204) and arranged to heat the second fluid in the first pipe (204) such that flow in the first pipe (204) is restricted. Furthermore, an arrangement (160) for restricting flow in a heat exchanger unit is provided.
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