公开(公告)号：EP2906024B1

公开(公告)日：2017-07-26

申请号：EP15150673.0

申请日：2015-01-09

申请人： Hitachi, Ltd.

发明人： Inoue, Takeshi ,  Okamoto, Takeshi ,  Horino, Masaya

IPC分类号： H05K1/02 ,  H04B1/3822 ,  H05K3/28 ,  H05K5/06 ,  G06K19/077 ,  H01Q1/00 ,  H01Q1/32 ,  H01Q1/40 ,  H05K1/16 ,  H05K1/18

CPC分类号： H05K3/284 ,  H01Q1/002 ,  H01Q1/3225 ,  H01Q1/40 ,  H05K1/0209 ,  H05K1/023 ,  H05K1/0239 ,  H05K1/165 ,  H05K1/181 ,  H05K5/064 ,  H05K2201/10098 ,  H05K2201/2045 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1327

公开(公告)号：EP1875504B1

公开(公告)日：2017-03-08

申请号：EP06758855.8

申请日：2006-05-01

申请人： Finisar Corporation

发明人： ICE, Donald, A. ,  DOUMA, Darin, J. ,  KIELY, Phillip, Anthony

IPC分类号： H01L23/495

CPC分类号： H01R13/6608 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4279 ,  G02B6/428 ,  H01L23/495 ,  H01L2924/0002 ,  H01R12/7082 ,  H01R13/405 ,  H05K1/023 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2203/302 ,  H01L2924/00

公开(公告)号：EP2237649A3

公开(公告)日：2012-10-31

申请号：EP10003032.9

申请日：2010-03-23

申请人： Phoenix Contact GmbH & Co. KG

发明人： Kiefer, Arno

IPC分类号： H05K1/02 ,  H03H1/00

CPC分类号： H03H7/427 ,  H03H1/0007 ,  H05K1/023 ,  H05K1/0233 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/09954 ,  H05K2201/1003 ,  H05K2201/1006

摘要： Beschrieben und dargestellt ist ein Filter, insbesondere zur Filterung von elektromagnetischen Störungen, mit einem Basiselement (2), mit mindestens einem elektrischen Filterbauelement (3, 4) und mit mindestens zwei Eingangs-Anschlusskontakten (5) und mindestens zwei Ausgangs-Anschlusskontakten (6) zum Anschluss der Leiter einer elektrischen Leitung, wobei die Eingangs-Anschlusskontakte (5) über auf dem Basiselement (2) angeordnete Leiterpfade (7) mit den Ausgangs-Anschlusskontakten (6) verbunden sind.
Bei dem erfindungsgemäßen Filter ist eine einfache Konfiguration und eine flexible Anwendung dadurch sichergestellt, dass in jedem Leiterpfad (7) mindestens zwei Längskontakte (8) vorgesehen sind, über die ein Filterbauelement (3, 4) derart mit einem Leiterpfad (7) elektrisch verbindbar ist, dass die elektrische Verbindung des Leiterpfades (7) zwischen den beiden Längskontakten (8) über das Filterbauelement (3, 4) führt, und dass in den Leiterpfaden (7) jeweils mindestens ein Querkontakt (9) vorgesehen ist, so dass zwei Leiterpfade (7) über ein Filterbauelement (3, 4) elektrisch miteinander verbunden sind, wenn das Filterbauelement (3, 4) mit den Querkontakten (9) der beiden Leiterpfade (7) elektrisch verbunden ist.

公开(公告)号：EP2246884A1

公开(公告)日：2010-11-03

申请号：EP09706773.0

申请日：2009-01-30

申请人： Kyocera Corporation

发明人： SHIRASAKI, Takayuki

IPC分类号： H01L23/12 ,  H01L23/02

CPC分类号： H01L23/047 ,  H01L23/49838 ,  H01L23/647 ,  H01L23/66 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19051 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/023 ,  H05K1/0237 ,  H05K9/0064 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A high frequency wiring board (4) includes a dielectric substrate (4a), a line conductor (4b) for high frequency signal transmission formed on a first surface of the dielectric substrate (4a) from a connection end (4bc) to an end (4ba), a ground conductor (4c) which is disposed aligned with one side (4bb) of the line conductor (4b) with a distance therebetween, and is disposed so as to cross over a hypothetical extension line extending from the end (4ba) in parallel with a line direction of the line conductor (4b), and a terminating resistor (4d) configured to electrically connect an end portion of the line conductor (4b) and the ground conductor (4c).

摘要翻译： 高频布线板（4）包括电介质基板（4a），用于高频信号传输的线路导体（4b），其形成在电介质基板（4a）的第一表面上，从连接端（4bc）到端部 4ba），与线路导体（4b）的一侧（4bb）对准地设置在其间的距离的接地导体（4c），并且设置成跨越从端部（4ba）延伸的假想延长线， 与线路导体（4b）的线方向平行的端子电阻器（4d），以及将线路导体（4b）的端部与接地导体（4c）电连接的端接电阻器（4d）。

公开(公告)号：EP1914798A3

公开(公告)日：2009-07-29

申请号：EP07118576.3

申请日：2007-10-16

申请人： Panasonic Corporation

发明人： Kimura, Junichi ,  Niimi, Hideki ,  Fuwa, Yuji ,  Sakaue, Tsuyoshi

IPC分类号： H01L21/56 ,  H01L23/31

CPC分类号： H01L21/563 ,  H01L23/3135 ,  H01L23/3142 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/023 ,  H05K3/305 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor mounting substrate according to the present invention comprises: a substrate; a semiconductor device, mounted on this substrate; solder bumps, which connect the semiconductor device and the substrate; a first resin, filled in a space between the semiconductor device and the substrate; and electronic components, mounted on a face side of the semiconductor device where the semiconductor device is mounted, wherein bond strength reinforcing resin section is provided at least between a side face in the vicinity of a corner part of the semiconductor device and a substrate surface of the substrate in a position corresponding to the corner part.

公开(公告)号：EP1625680A4

公开(公告)日：2009-04-08

申请号：EP03816274

申请日：2003-03-06

申请人： SANMINA SCI CORP

发明人： GISIN FRANZ ,  PANOS WILLIAM ,  KHANDOKAR MAHAMUD

IPC分类号： G06F17/50 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00

CPC分类号： G06F17/5036 ,  G06F17/5068 ,  H05K1/023 ,  H05K1/0237 ,  H05K1/115 ,  H05K3/0005 ,  H05K2203/163

摘要： A method for enhancing the high frequency signal integrity performance of a printed circuit board (PCB) (10) or backplane is provided. The method involves the use of S-parameters as the primary cost factors associated with an iterative process to optimize the physical dimensions and shape of a single or a collection of vias (12) within the PCB or backplane. Such process involves the representation of the via components as equivalent lumped series admittances and impedances, as well as, RLGC sub-circuits upon which basic circuit analysis is performed to optimize secondary characteristics, for example, the maximization of the sub-circuit's resistance and/or the minimization of the sub-circuit's capacitance. The iterative process involves the alteration of physical dimensions and the shape of the via components such that the secondary characteristics are optimized.

公开(公告)号：EP1568099B1

公开(公告)日：2008-04-16

申请号：EP03781616.2

申请日：2003-10-31

申请人： Intel Corporation

发明人： TRIPATHI, Alok ,  MILLER, Dennis

IPC分类号： H01P5/02 ,  H01P5/18

CPC分类号： H05K1/0245 ,  H05K1/023 ,  H05K1/0239 ,  H05K2201/09236 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/10022

摘要： An apparatus that includes a first conducting strip having a narrowed width where the first conducting strip also acts as a first electrode for a first tapping capacitance. The first tapping capacitance has a second electrode that is: 1) parallel to the first conducting strip; and 2) closer to the first conducting strip than a second conducting strip. The second conducting strip is parallel to the first conducting strip and has a narrowed width where the second conducting strip also acts as a first electrode for a second tapping capacitance. The second tapping capacitance has a second electrode that is: 1) parallel to the second conducting strip; and 2) closer to the second conducting strip than the first conducting strip.

公开(公告)号：EP1098368A4

公开(公告)日：2007-08-15

申请号：EP00915469

申请日：2000-04-11

申请人： MATSUSHITA ELECTRIC IND CO LTD

发明人： KIMURA SUZUSHI ,  HIMORI TSUYOSHI ,  HASHIMOTO KOJI

IPC分类号： H01L23/538 ,  H01L25/16 ,  H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  H05K3/46 ,  H01L25/00 ,  H01L21/56 ,  H01L23/12 ,  H05K3/00

CPC分类号： H05K1/184 ,  H01L23/5383 ,  H01L23/5386 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/19103 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4046 ,  H05K3/4602 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10204 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  H05K2203/161 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49172

摘要： A module component in which chip parts are embedded in a circuit board and a method of manufacturing of the same. The module component can have desired circuit characteristics and functions stably even if the size of a part is miniaturized, is produced with high efficiency, and suitable for mechanical mounting. Since a desired circuit is formed by arranging a prescribed number of parts according to a prescribed rule, no heat treatment of embedded parts is required when making a module. Since each chip part has values conforming to the specifications, the circuit characteristic, functions and dimensional accuracy or the like can be stably obtained as designed. Since the chip parts are arranged according to the prescribed rule, insertion of the chip parts can be easily automated and speeded up, and miniaturization of the chip parts is coped with sufficiently. Moreover, the circuit structure can be changed flexibly and easily only by changing the insertion positions and types of chip parts.

公开(公告)号：EP0923277B1

公开(公告)日：2007-04-11

申请号：EP98304966.9

申请日：1998-06-24

申请人： FUJITSU LIMITED

发明人： Yamada, Jun

IPC分类号： H05K1/02 ,  H05K1/18

CPC分类号： H05K1/023 ,  H05K1/025 ,  H05K2201/10022 ,  H05K2201/1053 ,  H05K2201/10689

公开(公告)号：EP1402629A2

公开(公告)日：2004-03-31

申请号：EP02766676.7

申请日：2002-04-25

申请人： Koninklijke Philips Electronics N.V.

发明人： LUO, Sifen

IPC分类号： H03F3/195

CPC分类号： H03F3/191 ,  H03F3/195 ,  H03J3/20 ,  H05K1/023

摘要： A tuning circuit (28) for compensating an inter-stage matching network (38) included in an integrated multistage radio frequency (RF) amplifier (22) includes one or more capacitors (30,32) connected in shunt between ground and a voltage supply to the amplifier (22). The capacitors (30,32) have values selected to effectively compensate the inductance from a pull-up inductor (42) included in the inter-stage matching network (38) to provide improved inter-stage matching when inductance and capacitance values of the inter-stage matching network deviate from their desired values due to parasitics and/or when other components, such as input-stage and output-stage transistors of the amplifiers deviate from their pre-fabrication simulation models.