摘要:
The present invention relates to a hot melt composition, which is suitable as a damping, preferably a sound deadening, composition comprising i) at least one poly-α-olefin; ii) at least one elastomeric styrene based copolymer; iii) at least one tackifier; iv) at least one macrocycle; and optionally v) at least one additive, preferably selected from fillers; stabilizers; colorants; pigments; waxes; thermoplastic compounds having a melt index of 600 to 5000 at 190℃/2.16 kg (ASTM D1238) selected from ethylene vinyl acetate (EVA), ethylene acrylic acid (EAA), alkyl acrylates, alkyl methylacrylates (EMA), ethylene 2-ethyl hexyl acrylate (EEHA) polymers or combinations thereof; moisture scavengers; or combinations thereof. Furthermore, the present invention relates to a dampening, preferably a sound deadening, article comprising the hot melt composition of the present invention and the use of the hot melt composition of the present invention in dampening, preferably sound deadening.
摘要:
Provided are [1] a furan resin comprising a repeating unit represented by the following general formula (1); and [2] a method for producing a furan resin, comprising reacting a specific furan compound and a specific carbonyl compound in the presence of an acid catalyst: wherein R 1 , R 2 , R 3 and R 4 each independently represent a hydrogen atom, or an organic group having 1 to 8 carbon atoms which may contain a hetero atom; and R 1 and R 2 , and R 3 and R 4 may be connected to each other to form a cyclic structure.
摘要:
The invention relates to epoxy resins having indole structures which are excellent in flame retardance, adhesion, moisture resistance, and heat resistance and favorably usable in lamination, molding, casting, bonding, or the like; indole resins; and resin compositions containing the same. The indole resins of the invention and epoxy resins prepared therefrom are represented by the general formulae (I) and (II): (I) (II) wherein R1 is H, alkyl, or the like; X is a connecting group represented by the formula: -C(R2R3)- or -C(R4R5)-Ar-C(R4R5)- (wherein R2 to R5 are each H, alkyl, or the like; and Ar is a benzene ring or a biphenyl ring); G is glycidyl; and n is an integer of 1 to 20.
摘要:
Compositions for producing aminoplast products by means of melt processing consist of: A) 95 to 99.9 % by mass of solvent-free meltable polycondensates of melamine resins having molar masses ranging from 300 to 300000; A) 0.1 to 5 % by mass of weak acids serving as thermoinducible curing agents consisting of: acidifiers of the blocked sulfonic acid type; aliphatic C4-C18 carboxylic acids; aromatic C7-C18 carboxylic acids; alkali salts or ammonium salts of phosphoric acid; C1-C12 alkyl esters or C2-C8 hydroxyalkyl esters of C7-C14 aromatic carboxylic acids or of inorganic acids; salts of melamine or of guanamines having C1-C18 aliphatic carboxylic acids; anhydrides, half-esters or half-amides of C4-C20 dicarboxylic acids; half-esters or half-amines of copolymers consisting of ethylenically unsaturated C4-C20 dicarboxylic acid anhydrides and ethylenically unsaturated monomers of the C2-C20 olefin type and/or C8-C20 vinyl aromatic compounds; and/or salts of C1-C12 alkyl amines or alkanolamines having C1-C18 aliphatic, C7-C14 aromatic or alkylaromatic carboxylic acids and inorganic acids of the hydrochloric acid, sulfuric acid or phosphoric acid type, and; B) optionally up to 400 % by mass of fillers and or reinforcing fibers, up to 30 % by mass of additional reactive polymers of the ethylene copolymer, maleic anhydride copolymer, modified maleic anhydride copolymer, poly-(meth)acrylate, polyamide, polyester and/or polyurethane type, and up to 4 % by mass, each time with regard to the polycondensates of melamine resins, of stabilizers, UV absorbers and/or auxiliary agents. These inventive compositions can be processed by means of melt processing into products such as panels, coated supporting materials, profiled pieces, pipes, injection-molded articles, fibrous products and laminates.
摘要:
A balance between electrical and thermal properties is achieved via the use of a composition comprising (1) at least one epoxy resin, (2) at least one styrene-maleic anhydride (SMA) copolymer, and (3) at least one bis-maleimide triazine resin. The composition is employed as a prepreg which composes one or more layters of a laminate further containing one or more layers of conducting foil.
摘要:
The present invention provides an amino resin composite particle in which an inorganic compound is fixed (firmly adhered) on a surface of an amino resin particle, for example, an amino resin composite particle, in which a child particle made of the inorganic compound is fixed on a mother particle made of the amino resin particle, and a method of easily and inexpensively producing the amino resin composite particle. After an amino compound such as benzoguanamine is reacted with formaldehyde, so as to prepare a reaction mixture containing an amino resin precursor to be the mother particle, an emulsion of the reaction mixture and an aqueous solution of an emulsifier, and an aqueous dispersion of the inorganic compound, such as silica powder, to be the child particle are mixed with a shear force application, so as to emulsify them to have an emulsion thereof. The emulsion is hardened by adding a catalyst. The thus obtained amino resin composite particle has a firm-adhering ratio of the inorganic compound of 10% or more.