SENSOR
    1.
    发明授权
    SENSOR 有权

    公开(公告)号:EP4235098B1

    公开(公告)日:2024-10-09

    申请号:EP23151731.9

    申请日:2023-01-16

    IPC分类号: G01C19/5712

    CPC分类号: G01C19/5712

    MICROELECTROMECHANICAL GYROSCOPE WITH OUT-OF-PLANE DETECTION MOVEMENT HAVING IMPROVED ELECTRICAL CHARACTERISTICS

    公开(公告)号:EP4212824A1

    公开(公告)日:2023-07-19

    申请号:EP23150057.0

    申请日:2023-01-02

    IPC分类号: G01C19/5712 B81B7/00 B81B7/02

    摘要: A microelectromechanical gyroscope (10) is provided with a detection structure (11) having: a substrate (14) with a top surface (14a) parallel to a horizontal plane (xy); a mobile mass (12), suspended above the substrate to perform, as a function of a first angular velocity (Ω x ) around a first axis (x) of the horizontal plane (xy), at least a first detection movement of rotation around a second axis (y) of the horizontal plane; and a first and a second stator elements (28a, 28b) integral with the substrate and arranged underneath the mobile mass to define a capacitive coupling, a capacitance value thereof is indicative of the first angular velocity (Ω x ). The detection structure has a single mechanical anchorage structure for anchoring both the mobile mass and the stator elements to the substrate, arranged internally with respect to the mobile mass, which is coupled to this single mechanical anchorage structure by coupling elastic elements (18) yielding to torsion around the second axis; the stator elements are integrally coupled to the single mechanical anchorage structure in an arrangement suspended above the top surface of the substrate.

    MEMS GYROSCOPE HAVING 2-DEGREE-OF-FREEDOM SENSING MODE
    10.
    发明公开
    MEMS GYROSCOPE HAVING 2-DEGREE-OF-FREEDOM SENSING MODE 审中-公开
    MEMS陀螺仪具有2自由度的感应模式

    公开(公告)号:EP3296691A1

    公开(公告)日:2018-03-21

    申请号:EP16792949.6

    申请日:2016-05-10

    IPC分类号: G01C19/5712 B81B7/02

    摘要: Provided is an MEMS gyroscope, which is resistant against external environmental changes such as a microfabrication process error, a vacuum package process error and a temperature change. The MEMS gyroscope comprises: a frame arranged parallel to a bottom wafer substrate; a sensor mass body excited at one degree of freedom in an excitation mode, and of which the displacement is sensed at two degrees of freedom by Cori-olis force in a sensing mode when an external an-gular velocity is inputted into the frame; and at least two sensing electrodes for sensing the dis-placement of the sensor mass body, the displace-ment being sensed at the two degrees of freedom, wherein the sensor mass body comprises an inner mass body and an outer mass body encompassing the inner mass body, the outer mass body and the frame are connected by a first support spring, and the outer mass body and the inner mass body are connected by a second support spring.

    摘要翻译: 本发明提供一种能够抵抗微加工工艺误差,真空封装工艺误差和温度变化等外部环境变化的MEMS陀螺仪。 MEMS陀螺仪包括:平行于底部晶圆衬底布置的框架; 在激励模式下以一个自由度激励的传感器质量体,并且当外部转动速度输入到所述框架中时,在感测模式下通过科里奥利力以两个自由度感测所述位移; 以及至少两个感测电极,用于感测所述传感器质量体的位移,所述位移在所述两个自由度处被感测,其中所述传感器质量体包括内部质量体和包围所述内部质量体的外部质量体, 所述外部质量体和所述框架通过第一支撑弹簧连接,并且所述外部质量体和所述内部质量体通过第二支撑弹簧连接。