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公开(公告)号：EP4434096A1
公开(公告)日：2024-09-25
申请号：EP22891254.9
申请日：2022-11-14
申请人： Necula, Robert , Nechache, Riad
发明人： Necula, Robert , Nechache, Riad
IPC分类号： H01L31/18 , G05B19/18 , H01L21/76 , H01L21/304
CPC分类号： H01L31/18 , H01L31/0463 , H10K39/12 , H10K71/20
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公开(公告)号：EP4047669A1
公开(公告)日：2022-08-24
申请号：EP20876244.3
申请日：2020-09-25
发明人： KIM, Jung Bae , KANG, Jun Young , MUN, Hyang Ju , MIN, Seon Ki , SEO, Jeong Ho , SHIN, Won Suk , SHIN, Hyun Kyo , YOON, Young Tae , LIM, Kyoung Jin
IPC分类号： H01L31/042 , H01L31/0224 , H01L31/02 , H01L31/18 , H01L31/0445 , H01L21/76 , H01L21/78
摘要： The present invention relates to a solar cell, a unit cell included in the solar cell, and a method for manufacturing the solar cell, the solar cell comprising: a first unit cell manufactured using any one piece from among a plurality of pieces formed by separating a mother substrate; and a second unit cell coupled to the first unit cell, wherein the first unit cell comprises a first cell electrode provided on a first unit substrate and having conductivity, the second unit cell comprises a second cell electrode provided on a second unit substrate and having conductivity, and the second cell electrode and the first cell electrode are bonded to each other without a bonding material to couple the second unit cell to the first unit cell.
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公开(公告)号：EP3991201A1
公开(公告)日：2022-05-04
申请号：EP20833663.6
申请日：2020-06-23
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公开(公告)号：EP3982425A1
公开(公告)日：2022-04-13
申请号：EP20817652.9
申请日：2020-04-07
发明人： KIM, Jung Bae , KANG, Jun Young , MUN, Hyang Ju , MIN, Seon Ki , SEO, Jeong Ho , SHIN, Won Suk , SHIN, Hyun Kyo , YOON, Young Tae , LIM, Kyoung Jin
IPC分类号： H01L31/18 , H01L31/0445 , H01L21/306 , H01L21/56 , H01L21/78 , H01L21/76
摘要： The present invention relates to a solar cell manufacturing method, a solar cell manufactured thereby, and a substrate for a solar cell. The solar cell manufacturing method involves forming a separating portion for separating a substrate, which is for manufacturing the solar cell, into a plurality of pieces. The solar cell manufacturing method comprises: a step for preparing the substrate; a first substrate etching step for forming a first groove in one surface of the substrate; a second substrate etching step for forming a second groove inside the first groove; and a third substrate etching step for etching the substrate including the second groove, wherein the separating portion includes the first groove and the second groove.
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公开(公告)号：EP3979339A1
公开(公告)日：2022-04-06
申请号：EP20818238.6
申请日：2020-04-07
发明人： KIM, Jung Bae , KANG, Jun Young , MUN, Hyang Ju , MIN, Seon Ki , SEO, Jeong Ho , SHIN, Won Suk , SHIN, Hyun Kyo , YOON, Young Tae , LIM, Kyoung Jin
摘要： The present invention relates to a method for manufacturing a solar cell, comprising: a seating process of seating, in a processing space for manufacturing a solar cell, a cell in which a plurality of thin film layers are formed; a coating process of spraying a conductive material onto the cell; and a scribing process of irradiating a laser toward the cell to form a cell separation unit for separating the cell into a plurality of unit cells.
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公开(公告)号：EP3933927A1
公开(公告)日：2022-01-05
申请号：EP20762172.3
申请日：2020-02-14
IPC分类号： H01L27/146 , H01L21/76 , H01L21/762 , H04N5/369 , H04N9/07
摘要： A solid-state imaging device (1) according to the present disclosure includes a semiconductor layer (20), a plurality of on-chip lenses (50), a first separation region (22), and a second separation region (23). The semiconductor layer (20) is provided with a plurality of photoelectric conversion units. The plurality of on-chip lenses (50) causes light (L) to be incident on the corresponding photoelectric conversion units. The first separation region (22) separates the plurality of photoelectric conversion units on which the light (L) is incident through the same on-chip lens (50). The second separation region (23) separates the plurality of photoelectric conversion units on which light is incident through the different on-chip lenses (50). In addition, the first separation region (22) has a higher refractive index than the second separation region (23).
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公开(公告)号：EP3886173A1
公开(公告)日：2021-09-29
申请号：EP19887869.6
申请日：2019-11-19
发明人： LEE, Jin Woong , KIM, Kyoung Wan
摘要： A light emitting module may include a mounting substrate, a plurality of light emitting chips and a plurality of conductive adhesion parts. Each of the light emitting chips may include: a first substrate; a first light emitting unit; a second substrate isolated from the first substrate; and a second light emitting unit. One side surface of the first substrate may include a first modified surface, and one side surface of the second substrate, facing the one side surface of the first substrate, may include a second modified surface. The first modified surface may include modified regions extended in the thickness direction of the first substrate and ruptured regions disposed between the respective modified regions, and the second modified surface may include modified regions extended in the thickness direction of the second substrate and ruptured regions disposed between the respective modified regions.
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公开(公告)号：EP3108500B1
公开(公告)日：2021-06-23
申请号：EP15759563.8
申请日：2015-02-18
发明人： FEST, Paul
IPC分类号： H01L21/762 , H01L21/76 , H01L21/31 , H01L21/308
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