Abstract:
PROBLEM TO BE SOLVED: To provide an electrodeposition coating apparatus with which the filtration of an electrodeposition liquid is possible without the occurrence of dissolution and swelling even to a soluble type block copolymerization polyimide electrodeposition liquid and metallic ions can be removed and which can be continuously operated. SOLUTION: The continuous electrodeposition coating apparatus has an ultrafiltration filter, a metal ion removing means by chelate fibers composed of cellulose as a base material and a drying and baking means within the same system. The electrodeposition coating apparatus is capable of performing the removal of the metal ions and concentration control within the same apparatus without the occurrence of dissolving and swelling to a polar solvent as compared with the conventional electrodeposition coating apparatus. Consequently, the stable films can be formed under the constant electrodeposition condition without changing the components and composition of the electrodeposition liquid composition and without causing a change in the electrodeposition condition by the metal ion while continuously performing electrodeposition and the soluble type block copolymerization polyimide resin can be electrodeposited. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a dielectric characteristics measuring evaluation method and a dielectric characteristics measuring evaluation system for organic insulation materials which can easily form a measuring sample of organic insulation materials and easily and accurately evaluate the measurement of dielectric characteristics of the organic insulation sample in semi-micro wave band to micro wave band. SOLUTION: The dielectric characteristics measuring evaluation method evaluates relative dielectric constant of the organic insulation materials by using a measuring sample T of the organic insulation materials. It comprises a process for measuring a reference resonance frequency in non-inserted state of a measuring sample T in a hollow resonator 1; a process for measuring the resonance frequency by inserting a standard sample A with a known relative dielectric constant in the hollow resonator 1 and calculating the relative dielectric constant measurement value of the standard sample A from the difference between the measured resonance frequency and the standard resonance frequency; a process for calculating a correction coefficient from the calculated relative dielectric constant value of the standard sample A and the known relative dielectric constant value of the standard sample T; and a process for measuring the resonance frequency by inserting the measuring sample T in the hollow resonator 1 and calculating the relative dielectric constant value of the measuring sample T by using the difference between the measured resonance frequency and the standard resonance frequency, and the correction coefficient. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To obtain a polyimide adhesive which remarkably improves the adhesion of a polyimide film to a metal and other substrates by modifying the surface characteristics of the polyimide film by a simple chemical method and has heat resistance effective for the adhesion of the surface treated polyimide film to the metal or other substrates. SOLUTION: The adhesion of the polyimide film to the metal or a substrate surface is remarkably improved by treating the polyimide surface with a mixed solution of ethanolamine and N-methylpyrrolidone or dimethylformamide. Furthermore, when the polyimide adhesive for the adhesion of the above surface treated polyimide film is a polyimide of a polyimide compound having bicyclo(2,2,2)oct-7-ene-2,3,5,6-tetracarboxylic dianhydride and 3,4-diaminodiphenyl ether as components, a remarkable effect is seen on the adhesiveness of the surface treated polyimide film to the metal. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a new connection method between circuit electrodes wherein metal and metal, and an insulating layer and an insulating layer are directly connected with each other respectively, and it has heat resistance without relying on the use of conventional anisotropic conductive resin. SOLUTION: In a joining method where electrodes oppositely disposed are directly joined for their continuity, thermosetting resin or thermoplastic polyimide resin is applied on insulated portions each having a step part to provide the step of 5 μm or less, and the electrodes are heated and subjected to contact bonding so as to be overlapped vertically. Hereby, metal fractions are self-melted or self-joined, and resin fractions undergo self chemical reaction for joining thereof. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a novel thermosetting polyimide which allows high-speed printing in screen printing, and has excellent adhesiveness, bendability and a low warping property and good storage stability, as well as characteristics such as heat resistance, electric characteristics, mechanical characteristics and incombustibility, and to provide a printing composition including the same, and a method for forming an insulating film, using the composition.SOLUTION: A thermosetting polyimide excellent for use in printing has a repeating unit of a specific structure including a triple bond. A printing ink composition includes the polyimide and an organic solvent for dissolving the polyimide. A method for forming an insulating film includes: applying the composition onto a base layer followed by drying to thereby form an insulating film composed of a polyimide film.