公开(公告)号：JP2004358497A

公开(公告)日：2004-12-24

申请号：JP2003158225

申请日：2003-06-03

Applicant: Denso Corp ,  株式会社デンソー

Inventor： KONDO ATSUSHI ,  OMI YOSHINORI ,  YAMAMOTO AKIYOSHI

IPC: B23K11/36 ,  B23K11/16 ,  B23K11/24 ,  B23K103/04

CPC classification number: B23K11/16 ,  B23K11/24

Abstract: PROBLEM TO BE SOLVED: To provide a method and a device for resistance welding which can prevent a deterioration in toughness of a joining part, cracks at the joining part, and aging cracks even if carbon steel (a metal member) having a carbon content higher than medium carbon steel is joined by the resistance welding.
SOLUTION: A pressure-welding part is joined by making a current to flow into a common rail body 20, which is formed of the carbon steel having a carbon content rate of 0.35 wt.%, and a holder 26. Continuously, annealing treatment for gradually cooling the temperature at the high-temperature joining part 30 is applied by controlling a current value, which is made to flow into the common rail body 20 and the holder 26, and an energization time. Then, the Vickers hardness at the joining part 30 can be set to ≤ 600 HV. A large part of the metal composition at the joining part 30 can be set to the intermediate stage phase. As a result, the toughness at the joining part 30 is improved. Accordingly, it is possible to prevent occurrence of the cracks at the joining part 30 and the aging cracks.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供一种能够防止接合部的韧性劣化，接合部的龟裂和老化裂纹的电阻焊接的方法和装置，即使碳钢（金属构件）具有 碳含量高于中碳钢通过电阻焊接接合。 解决方案：通过使电流流入由碳含量为0.35重量％的碳钢和保持器26形成的共轨体20中来连接压接部。连续地， 通过控制流入共轨体20和保持器26的电流值以及通电时间来施加用于逐渐冷却高温接合部30的温度的退火处理。 然后，接合部30的维氏硬度可以设定为≤600HV。 接合部30的大部分金属成分可以设定为中间阶段。 结果，接合部30的韧性提高。 因此，可以防止接合部30发生裂纹，老化裂纹。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JPH10256712A

公开(公告)日：1998-09-25

申请号：JP5914297

申请日：1997-03-13

Applicant: DENSO CORP

Inventor： YAMAMOTO AKIYOSHI ,  HIRAMATSU TOMOYUKI ,  AOYAMA MASAYUKI ,  TAKEMOTO MASANORI ,  KONDO KOJI

IPC: H05K3/34 ,  H05K1/11 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To improve the reliability of the connection of a semiconductor part with a board by preventing the generations of the voids of their solder connection portions. SOLUTION: In a multilayer printed circuit board 12 for mounting a ball grid array package type semiconductor part (BGA part) 11 thereon, surface pads 18 for connecting therewith the bumps of the part 11 are provided and recess-form circular via holes 20 are formed to provide therein via hole pads 19 which are connected with an inner layer conductor pattern 15 of the board 12. After printing cream solders on the pads 18, 19, the BGA part 11 is mounted on the board 12 and they are thereafter passed through a reflow furnace to obtain solder connection portions 13 by integrating the solder bumps and cream solders with each other. Diameter dimensions (a) of the openings of the via holes 20 are set to 150-300 μm which are nearly as large as the dimensions required in order that the cream solders flow in their printing directions, accompanied by their printing operations successively to be filled into the via holes 20. Depth dimensions (b) of the via holes 20 are set to 20-70 μm.