公开(公告)号：JPH1154553A

公开(公告)日：1999-02-26

申请号：JP20472997

申请日：1997-07-30

Applicant: DENSO CORP

Inventor： KONDO KOJI ,  AOYAMA MASAYUKI ,  TAKEMOTO MASANORI

IPC: H01L21/60 ,  H01L23/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To prevent a defective contact of an electronic part and a mounting substrate by preventing the stripping of a solder bump from an electrode. SOLUTION: An outermost surface of a circuit wiring 6 formed on the surface of an interposer 5 bonded to a solder bump 9 is formed of ductility metal. That is to say, when the junction interface of the circuit wiring 6 and the solder bump 9 is formed of an alloy layer comprising metal having ductility, the alloy at the junction interface of the circuit wiring 6 and the solder bump 9 is not broken by stress, and the stripping of the solder bump 9 from the junction interface can be prevented. Thus, the defective contact between a BGA(ball grid array) package 1 and a multi-layer printed wiring substrate 3 can be prevented. In detail, in the circuit wiring 3, the part in junction with the solder bump 9 is constituted of copper, tin or palladium.

公开(公告)号：JPH10112581A

公开(公告)日：1998-04-28

申请号：JP15850697

申请日：1997-06-16

Applicant: DENSO CORP

Inventor： TAKEMOTO MASANORI ,  OSHIRO MASARU ,  AOYAMA MASAYUKI ,  KONDO KENJI ,  YOSHINO MUTSUMI

IPC: H05K3/34 ,  H05K3/30

Abstract: PROBLEM TO BE SOLVED: To make possible soldering of all the leads of an electronic component by surely absorbing the variations of its leads, even when there exist the variations in the heights of its leads for its soldering to a board. SOLUTION: Interposing an adsorbent between an electronic part 100, its main body 101 and a board 200, the viscosity of the adsorbent is made reductive when heating the solder. That is, in the case of soldering, expanding the adsorbent along the whole surface of the board 200 and electronic component 100, as a result, the electronic component 100 is attracted to the side of the board 200 by the capillary force of the adsorbent to deform leads 102 by this attractive force and absorb the variations in the heights of the leads 102.

公开(公告)号：JPH1146054A

公开(公告)日：1999-02-16

申请号：JP20175197

申请日：1997-07-28

Applicant: DENSO CORP

Inventor： KONDO KENJI ,  AOYAMA MASAYUKI ,  TAKEMOTO MASANORI ,  KONDO KOJI

IPC: H05K1/18 ,  H01L23/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a package structure, capable of preventing defective contact between a BGA package and a multilayered printed wiring board, even if it is due to an external impact. SOLUTION: When a solder bump 7 is jointed with the outer peripheral part out of multiple electrodes 2 matrix-arrayed on a multilayered printed wiring board 3, the whole junction part of the solder bump 7 is terminated at the outer peripheral part of the electrode 2a. In other words, when a leading- out wiring which exposes the surface of the substrate 3 is eliminated from the electrode 2a, a crack-starting point can is eliminated, thereby enabling the solder bump 7 to be hardy released from the outermost peripheral electrode 2a, even if it is caused by an external impact. Through these procedures, the defective contact between a BGA package 1 and the multilayered printed wiring board 3 can be avoided.

公开(公告)号：JPH1146053A

公开(公告)日：1999-02-16

申请号：JP19882997

申请日：1997-07-24

Applicant: DENSO CORP

Inventor： AOYAMA MASAYUKI ,  KONDO KENJI ,  TAKEMOTO MASANORI ,  KONDO KOJI

IPC: H01L21/60 ,  H01L23/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To avoid a defective contact between an electronic component and a package substrate by a method, wherein the cracking in a packaging substrate caused due to external impacts is avoided for avoiding the disconnection in a leading out wiring arranged in the packaging substrate. SOLUTION: In order to terminate the whole terminal end of the junction of solder bumps 7 with an outermost peripheral electrode 2a at the inner peripheral part of the electrode 2a positioned on the outer periphery from among multiple electrodes 2 arrayed on a multilayered printed wiring board 3, the outer peripheral part of the electrode 2a is covered with a solder resist 10. Through these procedures, since the end part of the outermost peripheral electrode 2a which is most likely to cause crackings does not coincide with the stress concentration point in an external impact time, the cracking in the multilayered printed wiring board 3 is avoided, thereby enabling the defective contact between a BGA package 1 and the multilayered printed wiring board 3 to be prevented.

公开(公告)号：JPH10335516A

公开(公告)日：1998-12-18

申请号：JP14400797

申请日：1997-06-02

Applicant: DENSO CORP

Inventor： AOYAMA MASAYUKI ,  SUZUKI TADAO ,  MATSUMURA YASUSHI ,  TAKEMOTO MASANORI

IPC: H01L23/12 ,  H05K1/11 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To improve the fatigue failure life when a multilayer substrate, on which a highly integrated wiring can be provided using recessed type via holes, is used. SOLUTION: A square-shaped ball grid array package 4 is arranged opposing to the surface of a multilayer printed wiring substrate 1. A plane pad is arranged on the four corners of the region where the square-shaped ball grid array package is provided in the multilayer printed wiring substrate 1, and a via hole pad is arranged on the other region. Said plane pad is soldered to the solder balls 3 for the plane pad protruding from the side of the ball grid array package 4, and the via hole pad is soldered to the via hole solder balls 2 protruding from the side of the ball grid array package 4.

公开(公告)号：JPH10256712A

公开(公告)日：1998-09-25

申请号：JP5914297

申请日：1997-03-13

Applicant: DENSO CORP

Inventor： YAMAMOTO AKIYOSHI ,  HIRAMATSU TOMOYUKI ,  AOYAMA MASAYUKI ,  TAKEMOTO MASANORI ,  KONDO KOJI

IPC: H05K3/34 ,  H05K1/11 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To improve the reliability of the connection of a semiconductor part with a board by preventing the generations of the voids of their solder connection portions. SOLUTION: In a multilayer printed circuit board 12 for mounting a ball grid array package type semiconductor part (BGA part) 11 thereon, surface pads 18 for connecting therewith the bumps of the part 11 are provided and recess-form circular via holes 20 are formed to provide therein via hole pads 19 which are connected with an inner layer conductor pattern 15 of the board 12. After printing cream solders on the pads 18, 19, the BGA part 11 is mounted on the board 12 and they are thereafter passed through a reflow furnace to obtain solder connection portions 13 by integrating the solder bumps and cream solders with each other. Diameter dimensions (a) of the openings of the via holes 20 are set to 150-300 μm which are nearly as large as the dimensions required in order that the cream solders flow in their printing directions, accompanied by their printing operations successively to be filled into the via holes 20. Depth dimensions (b) of the via holes 20 are set to 20-70 μm.

公开(公告)号：JP2002043466A

公开(公告)日：2002-02-08

申请号：JP2000231362

申请日：2000-07-26

Applicant: DENSO CORP

Inventor： MATSUNAGA YASUAKI ,  AOYAMA MASAYUKI ,  TAKEMOTO MASANORI ,  MIZUNO SATORU ,  ECHIGO SUSUMU ,  KONDO KOJI

IPC: H05K3/34 ,  H01L21/60 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To prevent the constriction of the ball end of the inside of the opening of an interposer in the package of a ball grid array(BGA). SOLUTION: In the BGA package, a soldering terminal is composed of two kinds or more of materials, and the melting point T1 of the material existing in the opening of the interposer is higher than the melting point T1 of the material existing out of the opening of the interposer.

公开(公告)号：JPH09253884A

公开(公告)日：1997-09-30

申请号：JP6316496

申请日：1996-03-19

Applicant: DENSO CORP ,  HARIMA CHEMICALS INC

Inventor： ITO NAOKI ,  TAKEMOTO MASANORI ,  AIHARA MASAMI ,  ONISHI TATSUJI

IPC: B23K35/363 ,  B23K35/36 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide the flux for soldering capable of suppressing corrosion and insulation deterioration due to precipitation of metallic salt or cracking in the base resin. SOLUTION: The flux contains the activator having the composition consisting of dibasic acid whose molecular weight is =150 to =300 to =150 to =300 to =10,000 and the activator are contained to improve the cracking resistance.