公开(公告)号：JP2003110243A

公开(公告)日：2003-04-11

申请号：JP2001338119

申请日：2001-11-02

Applicant: DENSO CORP

Inventor： YAZAKI YOSHITARO ,  SHIRAISHI YOSHIHIKO ,  KONDO KOJI ,  HARADA TOSHIICHI ,  YOKOCHI TOMOHIRO

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board that can prevent reliability in interlayer connection from deteriorating, and to provide a method for manufacturing the printed circuit board. SOLUTION: As shown in (a), an insulating base 23 is suitably laminated for performing heating press from both surfaces, where the insulating base 23 has a copper pattern 22 in which a conductive paste 50 containing a tin particle 61 and a silver particle 62 is filled in a via hole 24, thus achieving a conductive composition 51 by melting the tin particle 61 for alloying with the silver particle 62 and at the same time by sintering in one piece. Additionally, a tin constituent in the conductive composition 51 and the copper pattern 22 are subjected to solid phase diffusion mutually for forming a solid phase diffusion layer 52, and the layers of a plurality of conductor patterns 22 (the lower conductor pattern is not illustrated) are electrically connected by highly reliable junction that does not depend on contact conduction.

公开(公告)号：JP2015013636A

公开(公告)日：2015-01-22

申请号：JP2013222261

申请日：2013-10-25

Applicant: 株式会社デンソー ,  Denso Corp

Inventor： SHIMIZU MOTONORI ,  YAZAKI YOSHITARO ,  SHIRAISHI YOSHIHIKO ,  TANAKA YASUHIRO ,  HARADA TOSHIICHI ,  SAITO KEITA ,  SAKAIDA ATSUSUKE ,  TANIGUCHI TOSHIHISA ,  GOKO MICHIHISA

IPC: B60H1/22 ,  G01K3/14

CPC classification number: B60N2/5678 ,  A47C7/748 ,  B60H1/00742 ,  B60N2/5642 ,  B60N2/5685 ,  G01K17/20

Abstract: 【課題】乗員に快適な温度環境を提供できる車両用の快適温調制御装置を提供する。【解決手段】通電されることによって温度が変化する温度変化体20と、熱流束に応じたセンサ信号を出力する熱流束センサ10と、熱流束センサ10上に配置された熱拡散層40と、温度変化体20に通電して温度変化体20の温度を調整する制御部2とを備える。そして、車室内に備えられた座席200の内部において、乗員が座席200に着座している際に乗員が接触する座席200の表皮201a側から順に、熱拡散層40、熱流束センサ10、温度変化体20を配置すると共に、熱流束センサ10から表皮201aと温度変化体20との間の熱流束に応じたセンサ信号を出力させる。また、制御部2に、熱流束センサ10から出力されるセンサ信号に基づき、表皮201aと温度変化体20との間の熱流束が所定値となるように温度変化体20への通電を調整させる。【選択図】図1

Abstract translation: 要解决的问题：提供一种车辆舒适的温度控制装置，能够为乘员提供舒适的温度环境。解决方案：一种车辆舒适的温度控制装置，包括：温度变化体20，通过通电而改变温度; 用于根据热通量输出传感器信号的热通量传感器10; 设置在热通量传感器10上的热扩散层40; 以及控制部分2，用于通过激活温度变化体20来调节温度变化体20的温度。在设置在机舱中的座位200中，热扩散层40，热通量传感器10和温度变化体20是 当乘员坐在座位200上时，座椅200的与皮肤201a侧的皮肤201a侧接触，并且根据皮肤201a与皮肤201A之间的热通量，从热通量传感器10输出传感器信号。 温度变化体20.控制部分2调节对温度变化体20的通电，使得基于从热通量输出的传感器信号，皮肤201a和温度变化体20之间的热通量可以是规定值 传感器10。

公开(公告)号：JP2014220428A

公开(公告)日：2014-11-20

申请号：JP2013099586

申请日：2013-05-09

Applicant: 株式会社デンソー ,  Denso Corp

Inventor： HARADA TOSHIICHI ,  YOKOCHI TOMOHIRO ,  HASEGAWA KENICHIRO ,  KASAMA YASUNORI

IPC: H05K3/46

CPC classification number: H05K3/46

Abstract: 【課題】電子部品と基板内の配線との接続信頼性を向上させる。【解決手段】積層された複数の樹脂フィルム10と、複数の樹脂フィルム10のうち一部の樹脂フィルム10c〜10eが有する貫通孔11に挿入された電子部品20と、一部の樹脂フィルム10c〜10eに隣接する樹脂フィルム10fに設けられ、電子部品20の主面20aと接続された導電性の接続部材40fとを備える多層基板1において、貫通孔11を有する樹脂フィルム10d、10eの表面上であって、貫通孔11の隣の位置に、電子部品20の側面20cと接触するとともに、接続部材40fと導通する導体パターン30d、30eを設ける。【選択図】図1

Abstract translation: 要解决的问题：提高电子部件和电路基板中的布线的连接可靠性。解决方案：多层电路板1包括多个层压树脂膜10，插入到形成在一些树脂中的通孔11中的电子部件20 多个树脂膜10中的膜10c-10e以及设置在与一些树脂膜10c-10e相邻的树脂膜10f上并与电子部件20的主表面20a连接的导电连接部件40f。导体图案30d 在与通孔11相邻的位置处，在与电子部件20的侧面20c接触并与连接部件40f导通的30e设置在具有通孔11的树脂膜10d，10e的表面上。

公开(公告)号：JP2011187843A

公开(公告)日：2011-09-22

申请号：JP2010053782

申请日：2010-03-10

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KONDO KOJI ,  YAZAKI YOSHITARO ,  WATABE KAZUMASA ,  MIYAGAWA EIJIRO

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer circuit board in which heat resistance is not deteriorated, and deformation and position shifting of a conductor pattern and formation of a gap at a periphery of the conductor pattern are unlikely to occur.
SOLUTION: In the method of manufacturing the multilayer circuit board 100 in which a laminate of resin films made of thermoplastic resin are heated and pressed to be stuck together, the resin films include first resin films 10a and 10b each including a crystalline first base material 10 and having conductor patterns P formed thereupon, and second resin films 30a and 30c each comprising an amorphous second base material 30 whose elastic modulus has a minimum along with crystallization transition, and having no conductor patterns P formed, the second resin films 30a to 30c are laminated and arranged opposite the surfaces of the first resin films 10a and 10b where the conductor patterns P are formed, and the first resin films 10a and 10b and the second resin films 30a to 30c are heated and pressed to be stuck together.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种制造耐热性不劣化的多层电路板的方法，并且导体图案的变形和位置偏移以及在导体图案的周边形成间隙不太可能 发生。 解决方案：在将由热塑性树脂制成的树脂膜的层压体加热压制粘贴在一起的多层电路板100的制造方法中，树脂膜包括第一树脂膜10a和10b，每个树脂膜包括晶体第一 基材10，其上形成有导体图案P，第二树脂膜30a和30c各自包含非晶的第二基材30，其弹性模量随着结晶转变而最小并且不形成导体图案P，第二树脂膜30a 30c与形成导体图案P的第一树脂膜10a和10b的表面相对地层叠并布置，并且第一树脂膜10a和10b以及第二树脂膜30a至30c被加压并粘合在一起。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010147419A

公开(公告)日：2010-07-01

申请号：JP2008326080

申请日：2008-12-22

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TAKEUCHI SATOSHI ,  SAKAIDA ATSUSUKE ,  TADA KAZUO ,  HARADA TOSHIICHI ,  WATABE KAZUMASA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer circuit board with high reliability, in which even if the number of laminations of resin films increases, displacement of conductor patterns, an interlayer connection failure of connecting conductors and adhesion lack of adjacent resin films are hard to occur.
SOLUTION: This invention relates to the method of manufacturing the multilayer circuit board manufactured by: laminating resin films 22 consisting of thermoplastic resin 1, in which conductor patterns P are formed at one side; carrying out a heating pressurization with heat press boards 11a, 11b; and collectively pasting a lamination S22 of the resin films 22. When the heating pressurization is carried out, glass fiber nonwoven fabrics 30a, 30b are made to intervene between the heat press boards 11a, 11b and the lamination S22, and resin sheets 40a, 40b are made to intervene between the glass fiber nonwoven fabrics 30a, 30b and the lamination S22. This invention is based on the method of manufacturing the multilayer circuit board by which the heating pressurization of the lamination S22 is carried out, while grinding glass fibers G30 of the glass fiber nonwoven fabrics 30a, 30b.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种制造高可靠性的多层电路板的方法，其中即使树脂膜的叠片数量增加，导体图案的位移，连接导体的层间连接故障和粘合缺陷 的相邻树脂膜难以发生。 制造多层电路板的方法本发明涉及通过以下步骤制造多层电路板的方法：将由热塑性树脂1组成的树脂膜22层叠，其中导体图案P在其一侧形成; 用加热板11a，11b进行加热加压; 并且共同地粘贴树脂膜22的层压体S22。当进行加热加压时，制成玻璃纤维无纺布30a，30b以夹在热压板11a，11b和层压体S22之间，树脂片40a，40b 在玻璃纤维无纺布30a，30b和层叠体S22之间进行介入。 本发明是基于对玻璃纤维无纺布30a，30b的玻璃纤维G30进行研磨的多层电路板的制造方法，其中进行层叠S22的加热加压。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010062468A

公开(公告)日：2010-03-18

申请号：JP2008228876

申请日：2008-09-05

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  SAKAIDA ATSUSUKE ,  TANIGUCHI TOSHIHISA ,  ISHIKAWA TOMIICHI ,  OKAMOTO KEIJI

IPC: H05K3/46 ,  H05K3/40

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer substrate for manufacturing a highly accurate multilayer substrate with high manufacturing efficiency by suppressing hydrolysis reaction of a thermosetting resin even if a laminated material is heated quickly. SOLUTION: In the method of manufacturing the multilayer substrate, the heating process of a laminated material of a resin film formed of a thermosetting resin includes a first heating step constituted with a first temperature raising process and a first temperature holding process and a second heating step constituted with a second temperature raising process to be executed after the first heating step and a second temperature holding process, the maximum temperature raising rates of the laminated material in the first and second temperature raising processes are respectively 20°C/min or more, the holding temperature in the first temperature holding process is 150°C or more and 250°C or less, the temperature holding time in the first temperature holding process is one minute or more and 10 minutes or less, and the holding temperature in the second temperature holding process is identical to the fusing temperature of the thermosetting resin. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：即使层压材料被快速加热，提供一种通过抑制热固性树脂的水解反应来制造制造具有高制造效率的高精度多层基板的多层基板的方法。 解决方案：在制造多层基板的方法中，由热固性树脂形成的树脂膜的层压材料的加热过程包括由第一升温过程和第一温度保持过程构成的第一加热步骤，以及 第二加热步骤由在第一加热步骤和第二温度保持过程之后执行的第二升温过程构成，第一和第二升温过程中层压材料的最高升温速率分别为20℃/ min或 此外，第一温度保持过程中的保持温度为150℃以上且250℃以下，第一温度保持过程中的保温时间为1分钟以上且10分钟以下，保持温度为 第二温度保持过程与热固性树脂的定影温度相同。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2007201371A

公开(公告)日：2007-08-09

申请号：JP2006021044

申请日：2006-01-30

Applicant: Airex Inc ,  Denso Corp ,  株式会社アイレックス ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KONDO KOJI ,  YOKOCHI TOMOHIRO ,  TANAKA YASUHIRO

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer circuit board for hardly generating the deformation or mutual position deviation of a conductor pattern, and for suppressing manufacture failure or manufacture costs due to buffer materials to be used in the case of hot press.
SOLUTION: A laminate 10 where an axial section 71x of a positioning pin 71 is put through a positioning hole 1h formed in each resin film 10a to 10f is arranged between hot press boards 60a and 60b, by using the positioning pin 71 having a fringe 71t at one end of the axial section 71x; and a buffer member 31 is interposed between an end face 10sb of the laminate 10 at the fringe 71t side of the positioning pin 71 and the hot press board 60b. A smoothing board 50 has a positioning hole 50h between an end face 10sa of the laminate 10 at the opposite side of the fringe 71t of the positioning pin 71 and the hot press board 60a, and heated and pressurized by the hot press boards 60a and 60 so that the resin films 10a to 10f can be bonded to each other.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于制造难以产生导体图案的变形或相互位置偏离的多层电路板的方法，并且为了抑制由于在壳体中使用的缓冲材料而导致的制造故障或制造成本 的热压。 解决方案：通过使用定位销71将定位销71的轴向部分71x穿过形成在每个树脂膜10a至10f中的定位孔1h的层压体10布置在热压板60a和60b之间， 在轴向部分71x的一端处的边缘71t; 并且在定位销71的边缘71t侧的层压体10的端面10sb和热压板60b之间插入有缓冲部件31。 平滑板50在位于定位销71的边缘71t的相反侧的层叠体10的端面10sa与热压板60a之间具有定位孔50h，并且被热压板60a和60加热和加压 使得树脂膜10a至10f可以彼此结合。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2007189035A

公开(公告)日：2007-07-26

申请号：JP2006005332

申请日：2006-01-12

Applicant: Denso Corp ,  Noda Screen:Kk ,  株式会社デンソー ,  株式会社野田スクリーン

Inventor： HARADA TOSHIICHI ,  HATTORI ATSUNORI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer substrate, and a manufacturing device of a multilayer substrate which can control the deviation of position of a land, when manufacturing the multilayer substrate containing a thermoplastic resin film.
SOLUTION: The manufacturing method of a multilayer substrate serves for the lamination of two or more thermoplastic resin films 100 including the thermoplastic resin film 100 wherein an interlayer connection member 110 and a land 120 are formed. The method comprises a lamination process for laminating two or more thermoplastic resin films 100, an installation process for installing a land position correcter material 200 for correcting the position of the land 120 in at least one surface of the thermoplastic films 100 laminated at the lamination process, and a pressurization heating process for heating and the pressurizing together the thermoplastic resin film 100 and the land position correction material 200.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：制造含有热塑性树脂膜的多层基板时，提供一种多层基板的制造方法以及能够控制台阶位置的偏移的多层基板的制造装置。 解决方案：多层基板的制造方法用于层压包含热塑性树脂膜100的两种或多种热塑性树脂膜100，其中形成层间连接构件110和焊盘120。 该方法包括用于层压两种或更多种热塑性树脂膜100的层压方法，用于安装用于校正层压过程中层压的热塑性膜100的至少一个表面中的焊盘120的位置的焊盘位置校正器200的安装过程 ，以及加热和加热热塑性树脂膜100和焊盘位置校正材料200的加压加热方法。（C）2007，JPO＆INPIT

公开(公告)号：JP2006319071A

公开(公告)日：2006-11-24

申请号：JP2005139104

申请日：2005-05-11

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KONDO KOJI ,  YOKOCHI TOMOHIRO

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer circuit board, suppressing the deformation of a conductor pattern and the displacement of mutual positions, also suppressing inter-layer separation in an outer periphery, manufacturing with high yield the multi-layer circuit board by heating the lamination body of resin films including a thermoplastic resin where the conductor pattern is formed, performing bonding by pressurization, segmenting a prescribed area from a bonded body to obtain the multi-layer circuit board.
SOLUTION: In the multi-layer circuit board manufacturing method, a space ks for segmenting is arranged in the respective resin films 10a-10f which constitute the lamination body by enclosing the prescribed area. When heating and pressurizing are performed by thermal press boards Pa, Pb, a frame shape pressurizing board 20 to be abutted in the space ks for segmenting is held between the thermal press boards Pa, Pb and the lamination body, and pressed.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种制造多层电路板的方法，抑制导体图案的变形和相互位置的位移，也抑制了外周的层间分离，高产率的制造 通过加热包含形成导体图案的热塑性树脂的树脂膜层叠体，通过加压进行结合，从接合体分割规定区域，得到多层电路基板。 解决方案：在多层电路板制造方法中，通过封闭规定区域，在构成层叠体的各树脂膜10a-10f中设置用于分割的空间ks。 在通过热压板Pa，Pb进行加热加压的同时，在热压板Pa，Pb和层压体之间保持与要分割的空间ks抵接的框架状的加压板20并被按压。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005039044A

公开(公告)日：2005-02-10

申请号：JP2003274255

申请日：2003-07-14

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KONDO KOJI ,  HATTORI ATSUNORI ,  KUBO SHIGEHIRO

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board whose connection reliability is enhanced and to provide a manufacturing method thereof.
SOLUTION: The printed circuit board is a multilayer printed circuit board 50 provided with first via-holes 13 each formed with a penetrated conductor pattern 12a, and second via-holes 23a opposite to the first via-holes 13. The opening of each second via-hole 23a is opposed to an opening of each penetrated conductor pattern 12a and its surrounding parts, and conductive paste 24 filled in each second via-hole 23a is joined with conductive paste 14 filled in each first via-hole 13 and the surrounding of the opening of each penetrated conductor pattern 12a. Since each penetrated conductor pattern 12a exists in the surrounding of the joining parts while adopting a structure wherein the conductive pastes 14, 24 are joined, the joining area can be ensured in spite of occurrence of positional deviation or the like. Moreover, the conductive paste 24 is also joined with the surrounding of the opening of each penetrated conductor pattern 12a. Thus, the connection reliability of the printed circuit board 50 can be enhanced.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种其连接可靠性提高的印刷电路板，并提供其制造方法。 解决方案：印刷电路板是设置有各自形成有穿透导体图案12a的第一通孔13和与第一通孔13相对的第二通孔23a的多层印刷电路板50。 每个第二通孔23a与每个穿透的导体图案12a及其周围部分的开口相对，并且填充在每个第二通孔23a中的导电膏24与填充在每个第一通孔13中的导电浆料14接合， 围绕每个穿透的导体图案12a的开口。 由于每个穿透的导体图案12a都存在于接合部分的周围，同时采用导电浆料14,24接合的结构，所以可以确保接合面积，尽管发生位置偏差等。 此外，导电膏24也与每个穿透的导体图案12a的开口的周围连接。 因此，可以提高印刷电路板50的连接可靠性。 版权所有（C）2005，JPO＆NCIPI