公开(公告)号：JP2019090756A

公开(公告)日：2019-06-13

申请号：JP2017221143

申请日：2017-11-16

Applicant: DENSO CORP ,  SOKEN INC

Inventor： HARADA TOSHIICHI ,  YAZAKI YOSHITARO ,  SHIRAISHI YOSHIHIKO ,  MATSUI HIROHITO

IPC: G01K17/00 ,  G01N25/18

Abstract: 【課題】計測対象物から放出される熱量を高精度に計測することができる熱流束センサを提供する。【解決手段】熱流束センサは、第1センサ部4と第2センサ部5とを備える。第1センサ部4は、複数の熱電部材のそれぞれが互いに電気的に接続された第1熱電変換部7を有する。第1熱電変換部7は、計測対象物から第1センサ部4を通過して放出される熱流束に応じた電気的な出力を発生させる。第2センサ部5は、複数の熱電部材のそれぞれが互いに電気的に接続され、かつ、第1熱電変換部7と電気的に接続されていない第2熱電変換部8を有する。第2熱電変換部8は、計測対象物から第2センサ部5を通過して放出される熱流束に応じた電気的な出力を発生させる。第2センサ部5の表面の放射率は、第1センサ部4の表面の放射率と異なる。【選択図】図1

公开(公告)号：JP2015014584A

公开(公告)日：2015-01-22

申请号：JP2013220112

申请日：2013-10-23

Applicant: 株式会社デンソー ,  Denso Corp

Inventor： SAITO KEITA ,  SHIRAISHI YOSHIHIKO ,  YAZAKI YOSHITARO ,  TANAKA YASUHIRO ,  MIYAGAWA EIJIRO ,  SHIMIZU MOTONORI ,  HARADA TOSHIICHI ,  SAKAIDA ATSUSUKE ,  TANIGUCHI TOSHIHISA ,  GOKO MICHIHISA

IPC: G01V9/00 ,  A47C7/62 ,  B60N2/90 ,  G01K17/08

CPC classification number: B60R22/48 ,  B60N2/002 ,  B60R21/01512 ,  B60R2022/4808 ,  G01K17/00 ,  G01K17/20 ,  G01K2205/00 ,  G01V9/005

Abstract: 【課題】従来よりも正確な生体の検知を可能とする。【解決手段】検知対象位置に存在する生体からの熱流束を検出できるように熱流束センサ10を配置する。そして、熱流束センサの検出結果と、検知対象位置に生体が存在する場合に検出されうる熱流束に応じて予め設定された判定基準とを比較して、生体の有無を判定する。そして、検出結果が判定基準を満たす場合、すなわち、熱流束センサで検出した熱流束が生体からの熱流束である場合に、生体有りと判定することで、従来よりも正確な生体の検知が可能となる。【選択図】図1

Abstract translation: 要解决的问题：比常规方法更准确地检测生物体。解决方案：热通量传感器10被布置成检测存在于检测对象位置的生物体的热通量。 然后，将热通量传感器的检测结果与当生物存在于检测对象位置时可以检测到的热通量预先设定的确定基准进行比较，从而确定生物体的存在/不存在。 然后，当检测结果满足判定基准时，即，当由热通量传感器检测到的热通量是来自生物体的热通量时，确定存在生物体。 因此，可以比常规方式更准确地检测生物体。

公开(公告)号：JP2010058341A

公开(公告)日：2010-03-18

申请号：JP2008225112

申请日：2008-09-02

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KONDO KOJI ,  YAZAKI YOSHITARO

IPC: B29C43/24 ,  B29C43/28 ,  B32B27/04 ,  B32B27/12

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a base material for a printed board suitable for the printed board of multilayer structure collectively formed by heating while pressurized. SOLUTION: The method of manufacturing the base material 40 for the printed board, which is formed by integrating resin base materials 10, 11, 12 comprising a thermoplastic resin and a fabric base material 20 comprising a material having a melting point higher than that of the thermoplastic resin, and is used in the printed board of multilayer structure collectively formed by heating while pressurized, includes an integration process wherein the resin base materials and the fabric base material are supplied to paired rolls 60, 61, a laminate including the resin base materials and the fiber base material is sandwiched by the rolls in its laminating direction while the thermoplastic resin is softened by heating, the thermoplastic resin is impregnated into the fiber base material, so that the base material for the printed board in which the resin base material and the fiber base material are integrated. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种制造适合于通过在加压下加热而共同形成的多层结构的印刷电路板的印刷电路板的基材的方法。 解决方案：制造用于印刷电路板的基材40的方法，其通过将包括热塑性树脂的树脂基材10,11,12和织物基材20整合而形成，该基材20包括熔点高于 热塑性树脂用于通过加压而加热共同形成的多层结构的印刷电路板，包括将树脂基材和织物基材供给到成对辊60,61的一体化工序， 树脂基材和纤维基材在层压方向上被辊夹持，同时通过加热软化热塑性树脂，将热塑性树脂浸渍到纤维基材中，使得其中树脂的基材 基材和纤维基材一体化。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009266966A

公开(公告)日：2009-11-12

申请号：JP2008112988

申请日：2008-04-23

Applicant: Denso Corp ,  株式会社デンソー

Inventor： TAKEUCHI SATOSHI ,  SAKAIDA ATSUSUKE ,  TANIGUCHI TOSHIHISA ,  HARADA TOSHIICHI ,  CHIBA MAKI

IPC: H05K3/46

CPC classification number: B30B15/061 ,  B30B15/024 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2203/065 ,  H05K2203/068

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a printed circuit board that improves the number of times for reuse of a buffer member, which is provided to reduce variations of pressure applied to each part of a laminate.
SOLUTION: In the apparatus, a pressing die includes a lower pressing part wherein a buffer member is disposed between the surface of a laminate and the lower pressing part, an upper pressing part which has a portion facing the other surface of the laminate and a portion facing the buffer member and is away from the buffer member at least in pre-heat-pressing state, and a circular frame which surrounds a whole area of a side surface of the buffer member and is integrated with only the lower pressing part at least upon heat pressing. Before pressing and heating, the laminate, a second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member. A lip is arranged on a surface facing the surface of the laminate while protruding from the frame toward the laminate, and it is deformed following the deformation of the buffer member caused by pressing and comes in contact with the upper pressing part facing the buffer member.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于制造印刷电路板的装置，其提高缓冲构件的再利用次数，其用于减少施加到层压体的每个部分的压力的变化。 解决方案：在该装置中，压模包括下压部，其中缓冲部件设置在层叠体的表面和下挤压部之间，上压部，其具有面向层叠体的另一表面的部分 以及面向缓冲构件并且至少在预热状态下远离缓冲构件的部分，以及围绕缓冲构件的侧表面的整个区域的圆形框架，并且仅与下部按压部分 至少在热压时。 在加压和加热之前，层压体，第二按压部分和缓冲部件在其间限定了用于逸出缓冲部件的逸出空间。 在从框架朝向层叠体突出的同时，在与层压体的表面相对的表面上设置有唇部，并且随着缓冲构件由于按压而变形而变形，并且与上部按压部件面向缓冲构件接触。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2005053076A

公开(公告)日：2005-03-03

申请号：JP2003286145

申请日：2003-08-04

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI

IPC: B29C43/02 ,  B29C43/52 ,  B29C65/02 ,  B29L9/00 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayered substrate capable of shortening a heating time, and a hot press.
SOLUTION: A laminate 50, which is obtained by laminating an insulating layer and a conductor layer, is arranged between a pair of the hot press plates 20a and 20b of the hot press 10 and heated and pressed from both upper and under surfaces thereof by the hot press plates 20a and 20b to manufacture the multilayered substrate. At this time, the laminate 50 is heated and pressed in a state that an auxiliary plate 30, which is excellent in heat conductivity and has length not obstructing the pressure to the laminate 50 by the hot press plates 20a and 20b, is arranged to the side surface of the laminate 50 and first cushioning materials 40, which are excellent in heat conductivity and can be deformed upon the reception of the pressure from the hot press plates 20a and 20b, are arranged between the end surfaces of the auxiliary plate 30 and the hot press plates 20a and 20b. By this constitution, the heat of the hot press plates 20a and 20b is transmitted to the laminate 50 from the side surface thereof through the first cushioning materials 40 and the auxiliary plate 30 to shorten a heating time.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供能够缩短加热时间的多层基板的制造方法和热压机。 解决方案：通过层叠绝缘层和导体层获得的层压体50被布置在热压机10的一对热压板20a和20b之间，并从上表面和下表面 通过热压板20a和20b制造多层基板。 此时，层压体50被加热并按照热传导性优异的辅助板30，其长度不会受到热压板20a，20b的阻碍层压体50的压力的状态而被设置在 在辅助板30的端面和辅助板30的端面之间配置有导热性优异且受热压板20a，20b接收压力而变形的层叠体50的侧面和第一缓冲材料40 热压板20a和20b。 通过这种结构，热压板20a和20b的热量从其侧表面通过第一缓冲材料40和辅助板30传递到叠层50，以缩短加热时间。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005019474A

公开(公告)日：2005-01-20

申请号：JP2003178603

申请日：2003-06-23

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  SHIN KEIICHI ,  MORI TAKAYUKI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of producing a multilayer substrate in which positional shift of a conductor pattern accompanying the flowing of a resin in the plane direction can be reduced, and to provide a multilayer substrate being formed by that method.
SOLUTION: A laminate 10 of a plurality of a single side conductor pattern films 1 is heated and pressed and bonded to a resin film 2 thus forming a multilayer substrate 20. In the hot press process, a second cushion member 50 of a specified thickness exhibiting cushion effect is interposed between the peripheral part 11 of the laminate 10 and a hot press plate 30. The peripheral part 11 is pressed earlier than the central part 12 and compressed with a higher pressure as compared with the central part 12. Consequently, the flow of softened resin in the direction from the central part 12 to the peripheral part 11 can be controlled and positional shift of the conductor pattern 3 can be reduced.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 解决问题的方案：提供一种制造多层基板的方法，其中可以减少伴随树脂在平面方向上的流动的导体图案的位置偏移，并且提供通过该方法形成的多层基板 。 解决方案：多个单侧导体图案膜1的层压体10被加热并粘合到树脂膜2上，从而形成多层基板20.在热压过程中，第二缓冲构件50 在层叠体10的周缘部11和热压板30之间插入具有缓冲效果的规定厚度。周边部11比中央部12稍早压制，与中央部12相比被压缩。因此， 可以控制从中心部分12到周边部分11的方向上的软化树脂的流动，并且可以减少导体图案3的位置偏移。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2003347738A

公开(公告)日：2003-12-05

申请号：JP2002158040

申请日：2002-05-30

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  HASE FUMIO ,  AZUMA MASANAO ,  OKADA MASAO ,  SAEGUSA HISAMI

IPC: H05K3/46 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer wiring board which ensures reliability in interlayer connection, while achieving high density in a wiring pattern, and provide a method for its manufacturing. SOLUTION: The multilayer wiring board 101 has an arrangement wherein resin films 23 and wiring patterns 22 are alternately stacked. In order to establish an electrical connection between the wiring patterns 22 which are adjacent to each other in the stacking direction, via holes 24 provided in the resin film 23 are filled with conductive compositions 51. In connecting the conductive compositions 51 through lands 22a in the wiring patterns 22 throughout a plurality of the resin films 23, a limit is set in the number of the conductive compositions 51 to be formed coaxially, and when the number exceeds the limit, the excess conductive compositions 51 are formed at positions deviated from the coaxially positioned conductive compositions 51. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供确保层间连接的可靠性的同时在布线图案中实现高密度的多层布线板，并提供其制造方法。 解决方案：多层布线板101具有树脂膜23和布线图案22交替堆叠的布置。 为了在层叠方向上彼此相邻的布线图案22之间建立电连接，在树脂膜23中设置的通孔24被导电组合物51填充。在将导电组合物51通过 在多个树脂膜23中的布线图案22，设定同时形成的导电性组合物51的数量的限制，当数量超过极限时，过量的导电性组合物51形成在同轴的位置 导电组合物51.版权所有（C）2004，JPO

公开(公告)号：JP2003086948A

公开(公告)日：2003-03-20

申请号：JP2001333021

申请日：2001-10-30

Applicant: DENSO CORP

Inventor： KONDO KOJI ,  HARADA TOSHIICHI ,  KAMIYA TETSUAKI ,  ONODA RYUICHI ,  KAMIYA YASUTAKA ,  MASUDA GENTARO ,  YAZAKI YOSHITARO ,  YOKOCHI TOMOHIRO

IPC: H05K3/28 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer substrate having electrodes on both surfaces capable of reducing a manufacturing cost without complicating a processing step. SOLUTION: The method for manufacturing the multilayer substrate comprises the steps of laminating a one-side conductor pattern film 21 (Figs. (a) to (c)) in which a conductor pattern 22 is formed only on one side surface of a resin film 23, a via hole 24 is formed and a conductive paste 50 is charged and a one-side conductor pattern film 31 in which a conductor pattern 22 is formed only on one side surface of the film 23, and the film 23 is perforated and removed so as to expose an electrode 23, laminating a cover layer 36 which is perforated to expose an electrode 37 on a lowermost layer (Fig. (d)), and hot pressing the laminate to thereby manufacture the multilayer substrate 100 having the electrodes on both of the surfaces.

公开(公告)号：JP2002305382A

公开(公告)日：2002-10-18

申请号：JP2001224959

申请日：2001-07-25

Applicant: DENSO CORP

Inventor： YOKOCHI TOMOHIRO ,  HARADA TOSHIICHI ,  NAKAMURA KAZUYOSHI ,  ONODA RYUICHI ,  KONDO KOJI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed board and its manufacturing method, capable of simplifying a structure and a manufacturing process, which has sections with different number of layers of conductor pattern. SOLUTION: Conductor pattern films 21 filled with a conductive paste 50 are laminated in a via hole 24 of a thermo-plastic resin film 23 where a conductor pattern 22 is formed, which is collectively heat-pressed through a buffer material 31, to provide a multilayer printed board 10 having sections of different number of layers of a conductor pattern 22. Since the insulating base materials 23 are all formed of the same themo-plastic resin, it is not required to provide a working process for each material of the insulating base material, resulting in no complicate manufacturing process. Thus a manufacturing cost is lowered.

公开(公告)号：JP2002118350A

公开(公告)日：2002-04-19

申请号：JP2000310945

申请日：2000-10-11

Applicant: DENSO CORP

Inventor： YOKOCHI TOMOHIRO ,  HARADA TOSHIICHI ,  NAKAMURA KAZUYOSHI

IPC: H01R43/00 ,  H01R43/02 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a method for connecting connector to flexible printed circuit board with which production costs can be reduced while securing reliabil ity in an electric connecting part. SOLUTION: First, as shown in Figure (a), a connector 20 is located while being overlapped on a flexible printed circuit board 1 by aligning a land 12a and a lead part 22a. Next, as shown in Figure (b), while pressing the connecting spot of overlapping the flexible printed circuit board 1 and the connector 20 with a thermocompression bonding tool 31, the connecting spot is heated so that a temperature thereof can become higher than the melting temperature of solders 13a and 13b, and can become higher than the softening temperature of an insulating substrate 11a. Thus, the connection of the land 12a and the lead 22a by the solders 13 can be performed simultaneously with the adhesion of an adhesive part 11d and a lower end face 21b.