Fuse device
    24.
    发明专利
    Fuse device 有权
    保险丝装置

    公开(公告)号:JP2011175957A

    公开(公告)日:2011-09-08

    申请号:JP2010185682

    申请日:2010-08-21

    摘要: PROBLEM TO BE SOLVED: To improve characteristics at the time of over-current while improving productivity of a fuse device. SOLUTION: The fuse device includes a ceramic structure 1 and a conductor pattern 2 for a fuse element. The ceramic structure 1 includes a base part 11, a frame part 12 provided on the base part 11, and a cover part 13 provided on the frame part 12. The base part 11, the frame part 12, and the cover part 13 are formed integrally by calcination. The conductor pattern 2 for a fuse element is formed on the upper side of the base part 11 by calcination. COPYRIGHT: (C)2011,JPO&INPIT

    摘要翻译: 要解决的问题:提高过电流时的特性,同时提高保险丝装置的生产率。 熔丝器件包括陶瓷结构1和用于熔丝元件的导体图案2。 陶瓷结构体1包括基部11,设置在基部11上的框架部分12和设置在框架部分12上的盖部分13.基部11,框架部分12和盖部分13形成 通过煅烧一体化 用于熔丝元件的导体图案2通过煅烧形成在基部11的上侧。 版权所有(C)2011,JPO&INPIT

    Production method of plated copper alloy material for fuse
    26.
    发明专利
    Production method of plated copper alloy material for fuse 有权
    用于保险丝的铜合金材料的生产方法

    公开(公告)号:JP2010242220A

    公开(公告)日:2010-10-28

    申请号:JP2010107259

    申请日:2010-05-07

    摘要: PROBLEM TO BE SOLVED: To provide a copper alloy material for a fuse, which is used for electronic parts of automobiles or home electric appliances and excellent in fusing characteristics to an overcurrent and has a function of preventing burnout of devices or parts.
    SOLUTION: A Ni-plating layer having a thickness of 0.01 to 20 μm is formed on the surface of a copper alloy substrate; a Sn-plating layer having a thickness of 0.1 to 30 μm is formed thereon; and the substrate is subjected to a reflow treatment or heat treatment to form an alloy layer containing Ni and Sn while eliminating the Ni-plating layer. Hot-dip Sn-plating may be applied in exchange for the Sn-plating and the subsequent reflow treatment or the heat treatment. Thus, the alloy layer 3 containing Ni and Sn, comprising a Ni-Sn alloy or a Ni-Cu-Sn alloy or both of them, is formed on the surface of the copper alloy substrate 1; and a pure Sn layer 4 as the outermost surface layer is formed thereon to obtain a plated copper alloy material for a fuse.
    COPYRIGHT: (C)2011,JPO&INPIT

    摘要翻译: 要解决的问题:提供一种用于汽车或家用电器的电子部件的保险丝用铜合金材料,并且具有优异的熔断特性与过电流,并且具有防止器件或部件烧毁的功能。 解决方案:在铜合金基板的表面上形成厚度为0.01〜20μm的镀Ni层; 在其上形成厚度为0.1〜30μm的Sn镀层; 对基板进行回流处理或热处理,形成含有Ni和Sn的合金层,同时除去Ni镀层。 可以应用热浸镀锡以换取Sn镀层和随后的回流处理或热处理。 因此,在铜合金基板1的表面上形成有包含Ni-Sn合金或Ni-Cu-Sn合金的Ni和Sn的合金层3, 并且在其上形成作为最外表面层的纯Sn层4,以获得用于熔丝的镀铜铜合金材料。 版权所有(C)2011,JPO&INPIT

    Conductive member and a method of manufacturing the same

    公开(公告)号:JP4372835B1

    公开(公告)日:2009-11-25

    申请号:JP2009127085

    申请日:2009-05-26

    摘要: 【課題】安定した接触抵抗を有するとともに、剥離し難く、また、コネクタとして用いる場合に挿抜力を小さくかつ安定させ、しかもヒューズとして用いた場合にも良好な溶断特性を有する。
    【解決手段】Cu系基材1の上に形成したNi系下地層3と、表面を形成するSn系表面層5との間に、Cu−Sn金属間化合物層4が形成されるとともに、Cu−Sn金属間化合物層4は、さらに、Ni系下地層3の上に配置されるCu
    3 Sn層6と、Cu
    3 Sn層6の上に配置されるCu
    6 Sn
    5 層7とからなり、Cu
    3 Sn層6及びCu
    6 Sn
    5 層7を合わせたCu−Sn金属間化合物層4のSn系表面層5と接する面の表面粗さが、算術平均粗さRaで0.05〜0.25μmであり、かつ、粗さ曲線の最大谷深さRvで0.05〜1.00μmであり、また、Cu
    3 Sn層はNi系下地層を覆っており、その面積被覆率が60〜100%である。
    【選択図】 図1

    Fuse
    29.
    发明专利
    Fuse 审中-公开
    保险丝

    公开(公告)号:JP2009032567A

    公开(公告)日:2009-02-12

    申请号:JP2007196165

    申请日:2007-07-27

    发明人: YOSHIDA SHIZUYASU

    IPC分类号: H01H85/06 H01H85/18

    摘要: PROBLEM TO BE SOLVED: To suppress temperature-rising in a rated current and reduce a cut-off current at the time of fusion by maintaining a current-limiting performance. SOLUTION: A linear or belt-like fuse-element 3 is wound around the outer periphery of an inner cylinder 1, and an integrated body of the inner cylinder 1 and the fuse-element 3 is housed in an insulator cylindrical body 6, while an arc extinguishing sand 7 is filled between the outer wall of the inner cylinder 1 and the inner wall of the cylindrical body 6, and both end apertures of the cylindrical body 6 are sealed with terminals 5. The fuse-element 3 has a structure in which on the outer peripheral face of a round wire 10 or belt-like wires 20 composed of high melting point metal materials and metal covering materials 11, 21 composed of low melting point metal materials are covered. As the high melting point metal material, tungsten or molybdenum is used, and as the low melting point material, lead, zinc, tin, cadmium, aluminum, copper, silver, or alloy of these is used. COPYRIGHT: (C)2009,JPO&INPIT

    摘要翻译: 要解决的问题:为了抑制额定电流的温度上升,并且通过维持限流性能来降低熔断时的截止电流。 解决方案:线性或带状保险丝元件3缠绕在内筒1的外周,并且内筒1和保险丝元件3的一体被容纳在绝缘体圆筒体6中 同时在内筒1的外壁和筒体6的内壁之间填充消弧砂7,并且用端子5密封圆柱体6的两个端部孔。熔丝元件3具有 覆盖由低熔点金属材料构成的圆线10的外周面或由高熔点金属材料构成的带状电线20和金属覆盖材料11,21的外周面的结构。 作为高熔点金属材料,使用钨或钼,作为低熔点材料,使用铅,锌,锡,镉,铝,铜,银或它们的合金。 版权所有(C)2009,JPO&INPIT