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    Electrolytic copper foil and method for producing the same
    31.
    发明专利
    Electrolytic copper foil and method for producing the same 有权
    电解铜箔及其制造方法

    公开(公告)号：JP2011174146A

    公开(公告)日：2011-09-08

    申请号：JP2010040030

    申请日：2010-02-25

    Applicant: Fukuda Metal Foil & Powder Co Ltd ,  福田金属箔粉工業株式会社

    Inventor： SANO KYOJI ,  MANABE HISATOKU ,  AKAMINE HISASHI ,  OKAMOTO TAKESHI

    IPC: C25D1/04

    Abstract: PROBLEM TO BE SOLVED: To provide an electrolytic copper foil having a low roughness surface which is suitable for an electrolytic copper foil material used for a Tape Automated Bonding method and does not substantially have an uneven shape formed in a rough surface side, has high tensile strength, and does not cause the peeling of a tin plating film. SOLUTION: This method for producing the electrolytic copper foil includes: using an aqueous solution of sulfuric acid and copper sulfate as an electrolytic solution; using an insoluble anode made from a platinum group element or titanium covered with an oxide of the platinum group element, and a cathode drum made from titanium opposing to the anode; and passing a direct current between both of the electrodes, wherein the electrolytic solution contains a non-ionic water-soluble polymer, a sulfonate of an active organosulfur compound, a thiourea-based compound and a chlorine ion existing therein. Thereby obtained electrolytic copper foil has: a rough surface of which the roughness is 2.0 μm or less; a crystal structure on the rough surface side, in which the orientation index determined from a relative intensity in a 220 copper diffraction line measured with an X-ray diffraction technique is 5.0 or more; and tensile strength of 500 MPa or more after having been heated at 180°C for 1 hour. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种低粗糙度表面的电解铜箔，其适用于用于带自动接合方法的电解铜箔材料，并且基本上不具有形成在粗糙表面侧的不均匀形状， 拉伸强度高，不会引起镀锡膜的剥离。 解决方案：该电解铜箔的制造方法包括使用硫酸水溶液和硫酸铜作为电解液; 使用由铂族元素制成的不溶性阳极或用铂族元素的氧化物覆盖的钛以及与阳极相对的钛制成的阴极鼓; 并且在两个电极之间通过直流电流，其中电解液含有非离子水溶性聚合物，活性有机硫化合物的磺酸盐，存在于其中的硫脲类化合物和氯离子。 由此得到的电解铜箔的粗糙面粗糙度为2.0μm以下的粗糙面; 粗糙表面侧的晶体结构，其中由用X射线衍射技术测量的220铜衍射线中的相对强度确定的取向指数为5.0以上; 在180℃下加热1小时后的拉伸强度为500MPa以上。 版权所有（C）2011，JPO＆INPIT

    Radiation shield, radiation shield storage employing the same, and molded product of radiation shield
    35.
    发明专利
    Radiation shield, radiation shield storage employing the same, and molded product of radiation shield 审中-公开
    辐射屏蔽，使用其的辐射屏蔽存储和辐射屏蔽的模制产品

    公开(公告)号：JP2011007510A

    公开(公告)日：2011-01-13

    申请号：JP2009148722

    申请日：2009-06-23

    Applicant: Fukuda Metal Foil & Powder Co Ltd ,  Shinsho Lead Engineering Co Ltd ,  新昭鉛工業株式会社 ,  福田金属箔粉工業株式会社

    Inventor： KITO SHIGERU ,  SHIN MUTSUMI ,  MIYAMOTO KEIICHI ,  OKUDA NARIAKI

    IPC: G21F3/00 ,  G21F1/10

    Abstract: PROBLEM TO BE SOLVED: To provide a material for a radiation shield which has a satisfactory shielding performance in radiation facilities where both neutrons and gamma rays exist and can furnish a working environment that allows health care professionals to work safely even especially in a medical front where low-level neutrons are anticipated.SOLUTION: In the radiation shield, the surface of globular lead powder that has a diameter of 0.2 to 2 mm is coated with boride such as boron oxide and boric acid. The radiation shield may be housed in an ejectable container after being put into a bag made of a woven cloth, a nonwoven cloth or a resin film, being molded into an arbitrary form such as a brick and a plate through the mixing of the radiation shield and resin and mixing the radiation shield and the resin. Epoxy resin, a mixture of silicone resin and epoxy resin, silicone resin and the like are preferable as a resin used in this occasion.

    Abstract translation: 要解决的问题：提供一种辐射屏蔽材料，其在存在中子和γ射线的辐射设施中具有令人满意的屏蔽性能，并且可以提供使医疗保健专业人员安全工作的工作环境，甚至特别是在医疗前沿中 低级中子是预期的。解决方案：在辐射屏蔽中，直径为0.2至2mm的球形铅粉末的表面涂有硼化物，如氧化硼和硼酸。 辐射屏蔽体可以放入由织布，无纺布或树脂膜制成的袋中，通过辐射屏蔽的混合而被模制成任意形式如砖和板 树脂和混合辐射屏蔽和树脂。 优选环氧树脂，有机硅树脂和环氧树脂的混合物，有机硅树脂等作为此时使用的树脂。

    Composite metal foil, method for producing the same, and printed wiring board
    37.
    发明专利
    Composite metal foil, method for producing the same, and printed wiring board 有权
    复合金属箔，其制造方法和印刷线路板

    公开(公告)号：JP2010201805A

    公开(公告)日：2010-09-16

    申请号：JP2009050365

    申请日：2009-03-04

    Applicant: Fukuda Metal Foil & Powder Co Ltd ,  福田金属箔粉工業株式会社

    Inventor： OSHIRO YUKIHIRO ,  HASEGAWA HIROICHI

    IPC: B32B15/04 ,  B32B15/01 ,  H05K1/09

    Abstract: PROBLEM TO BE SOLVED: To provide composite metal foil which can directly transfer very thin copper foil subjected to treatment for preventing the reflection of laser beams to a base material, a method for producing the composite metal foil, and a printed wiring board with the copper foil transferred by the composite metal foil.
    SOLUTION: In the composite metal foil having a support 2 made of metal foil, a release layer 3 laminated on the support, and a copper foil layer 4 laminated on the release layer, the copper foil layer is formed by a first copper foil layer 5 which is electrodeposited on the surface of the release layer by a copper citrate aqueous solution and a second copper foil layer 6 which is electrodeposited on the surface of the first copper foil layer by a copper sulfate aqueous solution.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供可以直接转移经受处理的非常薄的铜箔以防止激光束反射到基材的复合金属箔，复合金属箔的制造方法和印刷线路板 铜箔由复合金属箔转移。 解决方案：在具有由金属箔制成的支撑体2，层压在支撑体上的剥离层3和层压在剥离层上的铜箔层4的复合金属箔中，铜箔层由第一铜 箔层5，其通过柠檬酸铜水溶液电沉积在剥离层的表面上;以及第二铜箔层6，其通过硫酸铜水溶液电沉积在第一铜箔层的表面上。 版权所有（C）2010，JPO＆INPIT

    Electromagnetic wave suppression sheet and method of manufacturing the same
    39.
    发明专利
    Electromagnetic wave suppression sheet and method of manufacturing the same 审中-公开
    电磁波抑制片及其制造方法

    公开(公告)号：JP2010153542A

    公开(公告)日：2010-07-08

    申请号：JP2008329250

    申请日：2008-12-25

    Applicant: Ado Union Kenkyusho:Kk ,  Fukuda Metal Foil & Powder Co Ltd ,  株式会社アドユニオン研究所 ,  福田金属箔粉工業株式会社

    Inventor： KAJITA MITSURU ,  KAJITA HISANAGA ,  KAJITA OSAMU ,  WADA HITOSHI ,  TANIGAWA RYUICHI

    IPC: H05K9/00 ,  B32B7/02

    CPC classification number: H05K9/0088

    Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing an electromagnetic wave suppression sheet for further providing a light-weight and flexible noise suppression membrane that can easily cope with a complicated shape only within a small space as a more simplified means for preventing not only the self-poisoning, shielding and suppression of noise to the outside of an electronic apparatus but also an interference phenomenon by self-poisoning within the electronic apparatus.
    SOLUTION: The method of manufacturing the electromagnetic wave noise suppression sheet includes steps of forming a conductor layer 2 by coating a conductive painting material on a base material 1 and forming a magnetic layer 3 by coating a magnetic painting material on the conductor layer 2.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种制造电磁波抑制片的方法，用于进一步提供轻量且柔性的噪声抑制膜，其能够容易地在小空间内处理复杂的形状，作为更简单的装置 防止电子设备外部的自身中毒，屏蔽和抑制噪声，同时也防止电子设备内的自身中毒的干扰现象。 解决方案：制造电磁波噪声抑制片的方法包括以下步骤：通过在基材1上涂覆导电涂料并形成磁性层3，通过在导体层上涂覆磁性涂料来形成导体层2 2.版权所有（C）2010，JPO＆INPIT

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