公开(公告)号：JP2001251044A

公开(公告)日：2001-09-14

申请号：JP2000060227

申请日：2000-03-06

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU ,  MIKURA HIDEHIRO ,  AOYAMA MASAYUKI

IPC: H05K3/34

Abstract: PROBLEM TO BE SOLVED: To reduce stress applied to a solder-bonded portion to improve reliability in connecting a surface-mounting component to a wiring board by reflowing solder. SOLUTION: A surface-mounting component 12 has an array of many bumps 13 on the outer peripheral side of the bottom of a rectangular package 12a. Lands 14 corresponding to the bumps 13 are made at the portion, where the surface-mounting component 12 is mounted, of the wiring pattern on the surface of a wiring board 11 and a portion to be coated with a film is formed in a square region inside the array of the lands 14 independently of the electric connection of a circuit. A solder paste is applied to the lands 14 and the portion to be coated with a film on the surface of the wiring board 11. The surface- mounting component 12 is positioned and mounted so that the bumps 13 are mounted on the lands 14. Then, the wiring board is put into a reflow furnace and is heated for reflow. This cures the solder paste applied to portion to be coated with a film to form a solder-coated film 15.

公开(公告)号：JP2000013033A

公开(公告)日：2000-01-14

申请号：JP17881098

申请日：1998-06-25

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU ,  AOYAMA MASAYUKI ,  NUMATA AKISHI

IPC: C08G59/02 ,  H05K3/28 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board in which the elastic modulus of an insulation layer can be made low and which is excellent in mechanical property such as drop impact resistance, etc., and thermal impact resistance and an electronic device using the same. SOLUTION: A printed wiring board 7 is provided with insulation layers 11a to 11e made of polyglycidyl ester of fatty acid and bisphenol type epoxy resin. It also is preferably provided with a solder resist layer 11f having the same composition as the insulation layer. The polyglycidy ester is preferably 10-80 wt.% in the resin matrix of the insulation layer. The insulation layer preferably contains 10-90 wt.% resin filler of 100 kgf/mm2 in elastic modulus.

公开(公告)号：JPH11243114A

公开(公告)日：1999-09-07

申请号：JP4351998

申请日：1998-02-25

Applicant: DENSO CORP

Inventor： KONDO KENJI ,  KONDO KOJI ,  AOYAMA MASAYUKI ,  SUZUKI TADAO

IPC: H05K1/18 ,  H01L21/60 ,  H05K3/06

Abstract: PROBLEM TO BE SOLVED: To provide a surface-mounting component mounting system which is capable of high-density mounting without causing increase in the number of processes. SOLUTION: An opening 4 is formed in a solder resist layer 3, which covers a part where no solder is stuck on the surface of a wiring board 1, and a solder pad 6 is provided on a conductor pad 5 of the wiring board 1 which is exposed in the opening 4. Furthermore, a chip component 2 is mounted directly on the solder resist layer 3, and only the reverse surface of the electrode plate 21 of the chip component 2 is jointed with the solder pad 6. Consequently, the solder resist layer 3 functions as a spacer which secures necessary height for the solder pad 6.

公开(公告)号：JPH11145596A

公开(公告)日：1999-05-28

申请号：JP30430597

申请日：1997-11-06

Applicant: DENSO CORP

Inventor： KONDO KOJI ,  AOYAMA MASAYUKI

IPC: H05K3/34 ,  H05K3/24

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board and its producing method by which a desired area for pad can be ensured, even when an insulation film for avoiding a bridge between accompanied pads is arranged in parallel at displacement in case where pads are formed in high density. SOLUTION: A conductor pattern 6 is formed on the surface of a board 4 and a part thereof has pad parts 8, and the pad parts 8 are arranged parallel on the board 4 at specified intervals in distance. Furthermore, they are made smaller than the desired area for pad. A solder resist 9 having an opening 9a with the desired area for pad is arranged among the pad parts 8 having a conductor pattern on the board 4. A plating layer 12 is formed on the pad part 8, having the conductor pattern in the opening 9a of the solder resist 9 on the surface of the board 4, and this is turned into a pad for a mounting part.

公开(公告)号：JPH10284846A

公开(公告)日：1998-10-23

申请号：JP8941997

申请日：1997-04-08

Applicant: DENSO CORP

Inventor： HIRAMATSU TOMOYUKI ,  YAMAMOTO AKIYOSHI ,  AOYAMA MASAYUKI ,  NUMATA AKISHI

IPC: H01L21/60 ,  H01L23/12 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To prevent void connection of soldering and improve reliability of the connection. SOLUTION: BGA (Ball Grid Array) component 21 comprises a grid of bump solder and are connected to the first and second pad, 33 and 34, of the multilayer wiring board 22 by the solder connection 25. The first pad 33 positioned in the outside 2 row is connected to the surface conductor pattern 29. The second pad 34 positioned inside of the pad 33 is connected to the concave viahole formed nearby through the connection 36 and connected to the inner layer conductor pattern 30. The viahole 35 is disposed at an angle of 45 deg. from the second pad 34 and disposed between the pad 33 and 34. The periphery of the connection 36 and viahole 35 is covered by the solder resist 37. As the surface of the first and second pad, 33 and 34, are flat no air is left and the cream solder is printed.

公开(公告)号：JPH10270856A

公开(公告)日：1998-10-09

申请号：JP7568697

申请日：1997-03-27

Applicant: DENSO CORP

Inventor： HIRAMATSU TOMOYUKI ,  TAI HIDEKI ,  AOYAMA MASAYUKI ,  YAMAMOTO AKIYOSHI

IPC: H01L21/60 ,  H01L23/12 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To improve the connection reliability of soldered joints by preventing the occurrence of voids in the joints. SOLUTION: BGA(ball grid array) parts 21 on which solder bumps are arranged in a grid-like state are connected to the first and second pads 33 and 34 of a multilayered wiring board 22 through soldered joints 25. The first pads 33 which are arranged in two rows on the outside are constituted in surface solid pads connected to a surface conductor pattern 29. The second pads 34 arranged in two rows on the inside are connected to an internal layer conductor pattern 30 through blind via holes 35 formed through a surface-side insulating layer 27. The sizes of the second pads 34 become larger than those of the first pads 33, but the sizes of the exposed parts of the pads 34 are made equivalent to those of the pads 33 with a solder resist 36. The multilayered wiring board 22 is manufactured by a subtractive method. Since both the first and second pads 33 and 34 have flat surfaces, cream solder can be printed on the pads 33 and 34 without leaving any air in the printed solder.