公开(公告)号：JP2002344092A

公开(公告)日：2002-11-29

申请号：JP2001148405

申请日：2001-05-17

Applicant: DENSO CORP

Inventor： AKITA NAOYUKI ,  ECHIGO SUSUMU

IPC: H05K1/02 ,  H05K7/14

Abstract: PROBLEM TO BE SOLVED: To provide a printed board, capable of suppressing travel of the shock at the time of fall, etc., to a mounting section for mounting components, without increasing the size of the case for housing the printed board. SOLUTION: An arcuate slit section 21 is formed between a fixing section 2 for fixing a printed board on a case and a wiring section 5, on which mounting components 7, etc., are mounted, and the sections 2 and 5 are connected by a connecting section 22 between the section 21. Accordingly, without having provide to a shock-absorbing member separately from the printed board 1, the shock propagating to the section 2 from the case due to a fall is absorbed by the deformation of the section 22, having rigidity lower than that of the section 2 or 5, and thereby suppressing the propagation of the shock to the section 5.

公开(公告)号：JPH1050896A

公开(公告)日：1998-02-20

申请号：JP6630497

申请日：1997-03-19

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU ,  YAMAKAWA HIROYUKI

IPC: H01L23/28 ,  H01L21/56 ,  H01L21/58 ,  H01L23/31 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To realize good adhesion of sealing resin by a novel method and ensure a long-term reliability of an electronic part. SOLUTION: A printed board 1 is prepared and the printed board 1 is coated with solder resist 2. In detail, after liquid-like resist material is applied to the board 1, it is set by ultraviolet ray or heating. A silicone surfactant 8 whose content is at most 1wt.% and at least 0.2wt.% is added to the solder resist 2. An electronic part 3 is mounted on the solder resist 2 by an adhesive 4, and is further subjected to wire bonding. The electronic part 3 is sealed by sealing resin (epoxy resin or phenolic resin) 7 and a resin-sealed electronic device is obtained.

公开(公告)号：JPH09246300A

公开(公告)日：1997-09-19

申请号：JP5473396

申请日：1996-03-12

Applicant: DENSO CORP

Inventor： SAITO ATSUSHI ,  ECHIGO SUSUMU ,  KASUGAI HIROSHI

IPC: H01L23/28 ,  H01L21/56

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device having high reliability, which has a strong adhesive strength at the interface between laminated sealing resin layers. SOLUTION: A flip chip 4 is provided, with a cavity, on a circuit board 1. Liquid epoxy resin is injected into the cavity between the flip chip 4 and the circuit board 1, and the epoxy resin is heated for a 15 minutes or shorter until it is in a half-set state where 30% of the initial epoxy radical remains. Liquid epoxy resin 10 is extended over the entire flip chip 4 then heated for 2 hours, thus, both laminated resins are completely set. As a result, a lower-layer sealing resin 7 is formed at the cavity between the flip chip 4 and the circuit board 1, and the overall flip chip 4 is covered with an upper-layer sealing resin 8.

公开(公告)号：JP2014192447A

公开(公告)日：2014-10-06

申请号：JP2013068411

申请日：2013-03-28

Applicant: Denso Corp ,  株式会社デンソー

Inventor： YOSHIDA AKIKAZU ,  ECHIGO SUSUMU

IPC: H01L21/56 ,  H01L25/04 ,  H01L25/18

Abstract: PROBLEM TO BE SOLVED: To provide an electronic control unit which is manufactured at low costs and prevents burrs from occurring in a fastening hole, and to provide a manufacturing method of the electronic control unit.SOLUTION: The invention relates to an electronic control unit 1 including a circuit board 2 and a resin sealing material 3 which covers the circuit board 2 excluding a fastening part 21 and a manufacturing method of the electronic control unit 1. In the manufacturing of the electronic control unit 1, an electronic circuit pattern 23 of the circuit board 2 is formed and a dike pattern 24 is formed at the fastening part 21. In the resin molding process, a resin material is injected to a mold 5 while the mold 5 is being placed in contact with the dike pattern 24 to form the resin sealing material 3.

Abstract translation: 要解决的问题：提供以低成本制造并防止在紧固孔中发生毛刺的电子控制单元，并且提供电子控制单元的制造方法。解决方案本发明涉及一种电子控制单元1 包括电路板2和覆盖除了紧固部21之外的电路板2的树脂密封材料3和电子控制单元1的制造方法。在电子控制单元1的制造中，电子电路图案23 在紧固部21上形成电路基板2，形成堤坝图案24.在树脂成型工序中，将树脂材料注入模具5，同时将模具5与堤坝图案24接触，形成 树脂密封材料3。

公开(公告)号：JP2002344122A

公开(公告)日：2002-11-29

申请号：JP2001148406

申请日：2001-05-17

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU ,  HIRAMATSU TOMOYUKI ,  AKITA NAOYUKI

IPC: H05K3/28

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board and is manufacturing method for preventing cracks at the corner of a rectangular opening of a solder resist film formed on the surface. SOLUTION: The solder resist film 32 has a rectangular opening 33 that exposes a land 21a of a conductive pattern 12. A corner 33a of the opening 33 has almost an arc shape with a curvature radius of 50 μm or more. Even when the printed circuit board 101 is exposed to high-temperature circumstances, the corner 33a of the opening 33 is protected from the concentration of stress. Then, cracks at the corner 33a of the opening 33 can be prevented.

公开(公告)号：JP2002043466A

公开(公告)日：2002-02-08

申请号：JP2000231362

申请日：2000-07-26

Applicant: DENSO CORP

Inventor： MATSUNAGA YASUAKI ,  AOYAMA MASAYUKI ,  TAKEMOTO MASANORI ,  MIZUNO SATORU ,  ECHIGO SUSUMU ,  KONDO KOJI

IPC: H05K3/34 ,  H01L21/60 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To prevent the constriction of the ball end of the inside of the opening of an interposer in the package of a ball grid array(BGA). SOLUTION: In the BGA package, a soldering terminal is composed of two kinds or more of materials, and the melting point T1 of the material existing in the opening of the interposer is higher than the melting point T1 of the material existing out of the opening of the interposer.

公开(公告)号：JP2001217514A

公开(公告)日：2001-08-10

申请号：JP2000026346

申请日：2000-02-03

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU ,  SUZUKI TADAO ,  MATSUNAGA YASUAKI

IPC: H05K3/34 ,  H01L23/12 ,  H05K1/03 ,  H05K3/18 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To improve the connection reliability of a solder joint part by suppressing curvature deformation accompanying heating and cooling as to a multi-layered wiring board having surface-mounted components soldered on its mount surface. SOLUTION: The multi-layered wiring board 11 has on both the top and reverse sides of a core base material 14 a built-up layer formed by stacking two insulating layers 15a and 15b, and a built-up layer 16 formed by stacking two insulating layers 16a and 16b. A conductor pattern 17 is provided between both the top and reverse sides of the multi-layered wiring board 11 and the insulating layers and lands 17a corresponding to solder bumps 13 of a surface- mounted component 12 are provided on the mount surface. The surface-mounted component 12 is mounted on the lands 17a coated with solder paste so that the solder bumps 13 are mounted, and then soldered by solder flow heating. At this time, the insulating layers 15a and 15b on the mount surface side are formed of resin materials which have a larger modulus of elasticity or a smaller coefficient of thermal expansion than the insulating layers 16a and 16b on the opposite surface side.

公开(公告)号：JP2001060755A

公开(公告)日：2001-03-06

申请号：JP26260599

申请日：1999-09-16

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU ,  NOMOTO KAORU ,  AOYAMA MASAYUKI ,  SUZUKI TADAO

IPC: H05K3/28 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board which can be improved in both thermal shock resisting characteristic and drop impact resisting characteristic. SOLUTION: In a printed wiring board, at least one of a solder resist layer 13, first resist layer L1R, first insulating layer L1i, solder resist layer 17, sixth resist layer L6R, and sixth insulating layer L6i is formed by using a resin material, having a tensile breaking strain of 1% or higher at a strain rate of 40%/sec at 25 deg.C and Izod impact strength of 1.0 kgf.cm/cm or higher at 25 deg.C. Alternatively, a material containing a resin material having 0.05 or higher peak dynamic loss tangent value caused at a temperature between -100 deg.C and -50 deg.C by β-relaxation in dynamic viscoelasticity measurement and 0.02 or higher peak dynamic loss tangent value caused at a temperature between 0 deg.C and 100 deg.C by β'-relxation in a similar measurement at a rate of 80 wt.% or higher, preferably, 90 wt.% or higher is used.

公开(公告)号：JP2000091753A

公开(公告)日：2000-03-31

申请号：JP25728898

申请日：1998-09-10

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU

IPC: H05K3/28 ,  H01L23/12 ,  H01L23/14 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board for which heat- and moisture- resistance reliability can be secured and, at the same time, its high-frequency characteristic can be improved by lowering the permittivity of the board to the level of a polyimide resin. SOLUTION: Of a solder resist layer 13, a first resist layer L1R, a first insulating layer L1i, another soldering resist layer 17, a sixth resist layer L6R, and a sixth insulating layer L6i in a multilayered printed wiring board, at least one layer contains a silicone resin having an elastic modulus of

公开(公告)号：JP2015005725A

公开(公告)日：2015-01-08

申请号：JP2014078456

申请日：2014-04-07

Applicant: 株式会社デンソー ,  Denso Corp

Inventor： ECHIGO SUSUMU ,  YOSHIDA AKIKAZU ,  ARAO OSAMU

IPC: H01L23/29 ,  B29B7/76 ,  B29C31/10 ,  B29C39/10 ,  B29C39/12 ,  H01L21/56 ,  H01L23/31 ,  H05K3/28

Abstract: 【課題】低コストでの製造が可能であり、軽量で防水性に優れた電子部品ユニット及びその製造方法を提供すること。【解決手段】電子部品2と、これを被覆する樹脂封止部材3とからなる電子部品ユニット1である。樹脂封止部材3は、熱硬化性樹脂を発泡させてなる発泡樹脂からなる。発泡樹脂の発泡セル間をつなぐ連結穴の長径サイズ分布において、長径サイズの平均値αμmと標準偏差&sgr;μmとが、α+3&sgr;≦̸500の関係を満足する。電子部品ユニットの製造にあたっては、樹脂封止部材3を構成する熱硬化性樹脂の原料となる第1原料液と第2原料液との混合液により電子部品を被覆し、熱可塑性樹脂を発泡させつつ硬化させる。第1原料液と第2原料液との混合時には、第1原料液を加熱して粘度を低下させる。【選択図】図1

Abstract translation: 要解决的问题：提供一种能够以低成本制造，重量轻且高度防水的电子部件单元及其制造方法。电子部件单元1包括电子部件2和树脂密封部件3 覆盖它。 树脂密封构件3由发泡热塑性树脂形成的发泡树脂制成。 在泡沫树脂泡沫单元的连接孔的长径尺寸分布中，长径大小的平均值αμm和标准偏差（μm）满足α+ 3＆sgr≤500的关系。 为了制造电子部件单元，电子部件涂覆有作为构成树脂密封部件3的热塑性树脂的材料的第一原料液和第二原料液的混合物。热塑性树脂在发泡时固化。 在混合第一和第二原料液体期间，加热第一原料液体以降低其粘度。