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    Photosensitive insulating resin composition and the cured product
    32.
    发明专利
    Photosensitive insulating resin composition and the cured product 有权

    公开(公告)号：JP4175221B2

    公开(公告)日：2008-11-05

    申请号：JP2003317112

    申请日：2003-09-09

    Applicant: Jsr株式会社

    Inventor： 伸一郎 岩永 ,  宏文 後藤 ,  克巳 猪俣

    IPC: G03F7/038 ,  H01L21/027 ,  H01L21/312

    CPC classification number: G03F7/038 ,  H01L21/0271 ,  H01L21/312

    Abstract: [Problem] The present invention provides a photosensitive insulating resin composition which can be cured at low temperatures without inhibiting functions of an organic semiconductor device or the like, by the use of which a cured product excellent in various properties such as resolution, electrical insulation, thermal shock resistance and chemical resistance can be obtained and which is suitably used for a surface protective film or a layer insulating film of a semiconductor device. [Means to solve problem] The photosensitive insulating resin composition of the present invention comprises a copolymer (A), which is obtained by copolymerizing monomer components containing a vinyl monomer having an epoxy group and a vinyl monomer having an oxetanyl group, and a photosensitive acid generator (B). The copolymer (A) is preferably obtained by copolymerizing monomer components containing a vinyl monomer having an epoxy group, a vinyl monomer having an oxetanyl group and another vinyl monomer.

    Method of processing substrates, laminates and the semiconductor device
    36.
    发明专利
    Method of processing substrates, laminates and the semiconductor device 有权

    公开(公告)号：JP5360260B2

    公开(公告)日：2013-12-04

    申请号：JP2012106681

    申请日：2012-05-08

    Applicant: Jsr株式会社

    Inventor： 誠一郎 高橋 ,  宏文 後藤

    IPC: H01L21/02 ,  H01L21/301 ,  H01L21/304

    CPC classification number: H01L21/02 ,  H01L21/6835 ,  H01L29/02 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

    Abstract: A method that includes, in the sequence set forth, (1) temporarily fixing a substrate onto a support via a temporary fixing material including a central section (A) having two or more layers and a peripheral section (B) with solvent resistance, section (B) being in contact with a peripheral portion of the support on the substrate side and with a peripheral portion of the substrate on the support side, section (A) being in contact with a central portion of the support on the substrate side and with a central portion of the substrate on the support side, the temporary fixing thus resulting in a stack in which section (A) is covered with the support, section (B) and the substrate; (2) processing the substrate and/or transporting the stack; (3) dissolving section (B) with a solvent; and (4) heating the residue of the temporary fixing material and separating the substrate from the support.

    Structure and method of manufacturing the same, and an electronic component that having an insulating coating
    37.
    发明专利
    Structure and method of manufacturing the same, and an electronic component that having an insulating coating 有权

    公开(公告)号：JP5262350B2

    公开(公告)日：2013-08-14

    申请号：JP2008169485

    申请日：2008-06-27

    Applicant: Jsr株式会社

    Inventor： 智裕 松木 ,  隆一 奥田 ,  宏文 後藤

    IPC: H01L21/312 ,  C08G73/10 ,  C08L79/08 ,  H01L23/14

    Abstract: PROBLEM TO BE SOLVED: To provide a structure which has a uniform insulating film with superior electric insulation and a method of manufacturing the same, a resin composition which can form the insulating film, and an electronic component. SOLUTION: The method of manufacturing the structure which has the insulating film includes a step of coating a substrate having a hole portion with a solvent, a step of coating the substrate with the resin composition so that the resin composition may come into contact with the solvent in the hole portion, a step of forming films 117, 118, and 119 containing a resin component on at least an internal wall surface between the internal wall surface and a bottom surface of the hole portion by drying the coating, a heating and curing step of heating the film formed on the entire surface of the substrate including the internal wall surface and bottom surface of the hole portion into insulating films 217, 218, and 219 containing a cured body of the resin component, and a surface and bottom surface-side insulating film removing step of removing the insulating film 219 formed on the surface of the substrate and the insulating film 218 formed on the bottom surface of the hole portion of the substrate, and leaving the insulating film 217 formed on the internal wall surface of the hole portion. COPYRIGHT: (C)2010,JPO&INPIT

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