公开(公告)号：JP2010129781A

公开(公告)日：2010-06-10

申请号：JP2008302954

申请日：2008-11-27

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KONDO KOJI ,  YAZAKI YOSHITARO ,  WATABE KAZUMASA ,  MIYAGAWA EIJIRO

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer board, wherein misregistration of a conductor pattern on a surface and formation of an air gap caused by water vapor are suppressed.
SOLUTION: The method of manufacturing a multilayer board includes: a lamination step of laminating a plurality of resin films in a thickness direction of the resin films to form a laminate, wherein the resin films comprise a thermoplastic resin and contain a resin film of which a conductor layer is formed on a surface; and a hot press step of bonding and fixing the plurality of the resin films together to form a resin base material by pressing the laminate while heating after the lamination step. The resin films use a thermoplastic resin having a converted value of water vapor permeability of 2.6 g/(m
2 ×day) or above at 40°C, 90%RH, and 100 μm in resin film thickness. In the lamination step, a resin film, on the entire surface of which conductor foil as a conductor layer is formed, is laminated so that the conductor foil forms a surface of the laminate. The method includes an etching step of forming a conductor pattern as the conductor layer by patterning the conductor foil after the hot press step.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种制造多层板的方法，其中抑制了表面上的导体图案的不对准以及由水蒸气引起的气隙的形成。 解决方案：制造多层板的方法包括：层叠步骤，其在树脂膜的厚度方向上层叠多个树脂膜以形成层压体，其中树脂膜包含热塑性树脂并含有树脂膜 其表面上形成导体层; 以及热压步骤，通过在层叠步骤之后加热而将多个树脂膜粘合并固定在一起形成树脂基材。 树脂膜使用热塑性树脂，在40℃，90％RH和100μm的树脂膜厚度中，水蒸气透过率的转换值为2.6g /（m 2 / SP>×day）或更高 。 在层压步骤中，层叠形成作为导体层的导体箔的整个表面的树脂膜，使得导体箔形成层叠体的表面。 该方法包括通过在热压步骤之后图案化导体箔来形成导体图案作为导体层的蚀刻步骤。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010121043A

公开(公告)日：2010-06-03

申请号：JP2008296075

申请日：2008-11-19

Applicant: Denso Corp ,  株式会社デンソー

Inventor： MIYAGAWA EIJIRO ,  KONDO KOJI ,  HARADA TOSHIICHI

IPC: C08L79/08 ,  B32B27/34 ,  C08J5/18 ,  C08L71/10 ,  H05K1/03 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a resin film which can simultaneously achieve heat resistance and mechanical strength and the adhesion on laminating and can easily and inexpensively manufacture a multilayer substrate, a multilayer substrate using the same, and to provide a method for manufacturing the multilayer substrate. SOLUTION: The resin film is for use in a multilayer substrate which is manufactured by laminating the films with each other by heating under pressure and the resin film is composed of a polyaryl ketone resin and a polyetherimide resin which forms a complete compatibility system with the polyaryl ketone resin, and the content of the polyaryl ketone resin content is more than 10 wt.% and less than 35 wt.% and the content of the polyetherimide resin is more than 65 wt.% and less than 90 wt.%. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够同时实现耐热性和机械强度以及层压时的粘合性的树脂膜，并且可以容易且廉价地制造多层基板，使用该多层基板的多层基板，并且提供一种方法 制造多层基板。 解决方案：树脂膜用于通过在压力下加热将膜彼此层压而制成的多层基板，树脂膜由聚芳基酮树脂和形成完全相容性体系的聚醚酰亚胺树脂组成 与聚芳基酮树脂相比，聚芳基酮树脂含量大于10重量％且小于35重量％，聚醚酰亚胺树脂的含量大于65重量％且小于90重量％ 。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2008141008A

公开(公告)日：2008-06-19

申请号：JP2006326159

申请日：2006-12-01

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KONDO KOJI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer circuit board and method of manufacturing the same, wherein a heat-resistant strength is enhanced, a peeling malfunction of a conductor pattern is suppressed, and reliability is high at a low cost.
SOLUTION: In the multilayer circuit board, a plurality of resin films 10a to 10d made of a thermoplastic resin 1 on a surface of which a conductor pattern 2 is formed are attached to each other, so that the conductor pattern 2 is formed in a multilayered state, and the conductor patterns 2 in a different layer are connected to each other between layers by a connection conductor 3 made of a sintered body of a conductive paste. The multilayer circuit board is a multilayer circuit board 100 in which a glass fiber woven material 4 is embedded in the thermoplastic resin 1 of the resin films 10a to 10d constituting an interlayer of the conductor patterns 2.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种多层电路板及其制造方法，其耐热强度提高，导体图案的剥离故障被抑制，可靠性高，成本低。 解决方案：在多层电路板中，在形成有导体图案2的表面上由热塑性树脂1制成的多个树脂膜10a至10d彼此附接，使得形成导体图案2 并且不同层中的导体图案2通过由导电浆料的烧结体制成的连接导体3在层之间彼此连接。 多层电路板是多层电路板100，其中玻璃纤维编织材料4嵌入在构成导体图案2的中间层的树脂膜10a至10d的热塑性树脂1中。版权所有（C）2008 ，JPO＆INPIT

公开(公告)号：JP2006049502A

公开(公告)日：2006-02-16

申请号：JP2004227007

申请日：2004-08-03

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KONDO KOJI ,  NOMOTO KAORU ,  KONDO KENJI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer substrate which can elongate the number of times of using a buffer member and can improve an operating rate.
SOLUTION: The method of manufacturing the multilayer substrate 100 includes a laminating step of laminating a resin film 11 made of a thermoplastic resin and a conductor pattern 12 to form a laminate 20; and a heating and pressurizing step of heating and pressurizing the laminate 20 by a hot press plate 50 from both upper and lower surfaces, in the state that the buffer member 50 arranged between the laminate 20 and the hot press plate 50 for reducing the pressure difference to be applied to the respective parts of the laminate 20 from the hot press plate 50 is interposed between the front surface of the laminate 20 and the hot press plate 50. The individual buffer members 60 are prepared according to the disposition of the conductor pattern 12 to the resin film 11. In the heating and pressurizing step, in the state that the laminate 20 and the buffer member 60 corresponding to the conductor pattern 12 of the laminate 20 are positioned, the laminate 20 is heated and pressurized by the hot press plate 50.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种可以延长使用缓冲构件的次数并可以提高工作速率的多层基板的制造方法。 解决方案：制造多层基板100的方法包括层压由热塑性树脂制成的树脂膜11和导体图案12以形成层压体20的层压步骤; 以及在层叠体20和热压板50之间设置的缓冲部件50，用于降低压力差的状态下，通过热压板50从上下表面对叠层体20进行加热加压的加热加压工序 从层压体20的前表面和热压板50之间插入层压体20的各部分，由热压板50构成。各个缓冲部件60根据导体图案12的配置 在加热和加压步骤中，在层压体20和对应于层压体20的导体图案12的缓冲构件60定位的状态下，层压体20被热压板加热和加压 50.版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2004253569A

公开(公告)日：2004-09-09

申请号：JP2003041624

申请日：2003-02-19

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  MORI TAKAYUKI ,  SHIN KEIICHI

IPC: H05K3/06 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer substrate which can prevent the occurrence of cracks, and also to provide a method of manufacturing the same. SOLUTION: The multilayer substrate 1 has a single-sided conductor pattern film 20 located in a surface layer. The single-sided conductor pattern film 20 has such a structure that a conductor pattern including a land 3 is formed on one face of a resin film 2 formed of thermoplastic resin, and a via hole 5 with the land 3 as a bottom face is filled with an interlayer connection material 4. In a part of the front surface or rear surface of the land 3, a concave portion 7 is formed. In the multilayer substrate 1, when the resin film 2 shrinks, the land 3 can also be deformed in compliance with the shrinkage of the resin film 2, resulting in preventing the occurrence of cracks 6 in the resin film 2 in contact with the land 3. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2004119508A

公开(公告)日：2004-04-15

申请号：JP2002278008

申请日：2002-09-24

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  MORI TAKAYUKI ,  HASEGAWA KENICHIRO

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer substrate with superior recyclability and its manufacturing method. SOLUTION: A resin film 2 is mutually bonded by laminating a plurality of one-surface conductor pattern films 1 and heating and pressing them at the same time to form a multilayer substrate 8. At this time, a releasing sheet 6 which is hard to stick on the resin film 2 and a heat radiation member 7 is previously provided between the one-surface conductor pattern films 1 and the heat radiation member 7 as a removal part of the multilayer substrate 8 in a bonding process. Consequently, the resin film 2 and the heat radiation member 7 can easily be separated from the surface of the releasing sheet 6 at the removal part, so the resin film 2 and the heat radiation member 7 can easily be recycled. COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2003311500A

公开(公告)日：2003-11-05

申请号：JP2002120251

申请日：2002-04-23

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  KAJINO HIDETADA ,  NAGASAKA HIROSHI

IPC: B30B15/34 ,  B30B7/02 ,  B30B15/06 ,  H05K3/46

CPC classification number: B30B15/064

Abstract: PROBLEM TO BE SOLVED: To simultaneously perform a plurality of works having different heating temperature profiles in a hot press working with a common hot press. SOLUTION: Heating boards 1a, 1b, 1c of ≥3 pieces are disposed in the laminated layer direction by arranging gaps, and a laminated body 90a of a conductor pattern is inserted into the gap of the upper step among the heating boards 1a, 1b, 1c and a laminated body 90b is inserted into the gap of the lower step. At this time, heat-insulating members 5 are disposed into only both sides of the laminated body 90b. In this way, since the heat calory conducted to the laminated body 90b from the heating boards 1b, 1c is reduced in comparison with the heat calory conducted to the laminated body 90a, the heating temperature profile between the laminated body 90a and the laminated body 90b can be differed. Therefore, even in the case of constituting the laminated bodies 90a, 90b with the different thermoplastic resin materials, since the heating temperature profile suitable to the respective materials can be realized, the hot press can simultaneously be performed with the common hot press. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：在使用普通热压机的热压机中同时执行具有不同加热温度分布的多个工件。 解决方案：通过设置间隙，层叠层方向设置≥3个的加热板1a，1b，1c，将导体图案的层叠体90a插入加热板1a的上部台阶的间隙 ，1b，1c和层叠体90b插入到下阶段的间隙中。 此时，隔热构件5仅设置在层叠体90b的两侧。 以这种方式，由于与从层叠体90a的热量相比，从加热板1b，1c向层叠体90b传递的热量减少，层叠体90a与层叠体90b的加热温度分布 可以不同 因此，即使在使用不同的热塑性树脂材料构成层压体90a，90b的情况下，由于可以实现适合于各种材料的加热温度曲线，所以可以用普通热压机同时进行热压。 版权所有（C）2004，JPO

公开(公告)号：JP2003304072A

公开(公告)日：2003-10-24

申请号：JP2002110097

申请日：2002-04-12

Applicant: Denso Corp ,  株式会社デンソー

Inventor： HARADA TOSHIICHI ,  ISHIKAWA YOSHICHIKA ,  NAKAGAWA SHUNJI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To restrain resin films as insulating layers composing a multilayer wiring board from being curved or corrugated and to prevent a wiring pattern from varying in impedance.
SOLUTION: The wiring pattern 22a and a dummy pattern 22b not used as wiring are formed on the resin film 23. A plurality of conductor pattern films 21 which are each provided with the wiring patterns 22a and the dummy pattern 22b are laminated into the multilayer wiring board 100. By this setup, a part where no wiring pattern is present can be compensated by the dummy pattern 22b, so that the resin film 23 can be restrained from being deformed such as curved or corrugated. Therefore, the wiring pattern 22a arranged between the resin films 23 can be restrained from varying in impedance.
COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：为了抑制构成多层布线板的绝缘层的树脂膜弯曲或波纹化并且防止布线图案阻抗变化。 解决方案：在树脂膜23上形成不用作布线的布线图案22a和虚设图案22b。将各布线图案22a和虚设图案22b的多个导体图案膜21层压成 通过该设置，可以通过虚设图案22b补偿不存在布线图案的部分，从而可以抑制树脂膜23变形，例如弯曲或波纹状。 因此，可以抑制布置在树脂膜23之间的布线图案22a的阻抗变化。 版权所有（C）2004，JPO

公开(公告)号：JP2003234016A

公开(公告)日：2003-08-22

申请号：JP2002029944

申请日：2002-02-06

Applicant: DENSO CORP ,  FUKUDA METAL FOIL POWDER

Inventor： MORIMOTO HIROSHI ,  KOMATSU MICHIO ,  YAZAKI YOSHITARO ,  SHIRAISHI YOSHIHIKO ,  KONDO KOJI ,  HARADA TOSHIICHI ,  YOKOCHI TOMOHIRO

IPC: C08K3/08 ,  C08K5/01 ,  C08K5/053 ,  C08K5/10 ,  C08L101/00 ,  C09D5/24 ,  C09D201/00 ,  H01B1/22

Abstract: PROBLEM TO BE SOLVED: To provide a conductive compound which enables high joining strength at a joining interface and enables high electric reliability at the joining interface even under severe environmental conditions such as temperature changes or vibrations. SOLUTION: The conductive compound comprises metal powder which consists of silver particles whose diameters are 0.5 to 60 μm and tin particles whose diameters are 0.5 to 60 μm, and dispersion medium wherein the tin particles have ball shapes. The metal powder of 85 to 93 wt.% is contained in the electrically conductive compound, the silver particles and the tin particles are mixed in the wt. radio of 75 to 50:25 to 50, and single or mixed solvent having boiling temperature of 200°C or more is chosen from polyhydric alcohol, hydrocarbon or alcohol ester as the dispersion medium. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003209356A

公开(公告)日：2003-07-25

申请号：JP2002006007

申请日：2002-01-15

Applicant: DENSO CORP

Inventor： SAKAIDA ATSUSUKE ,  HARADA TOSHIICHI ,  TAKADA KEIKICHI

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To simultaneously adhere a plurality of resin films by heating and pressurizing steps without bringing about a positional deviation of the conductor pattern formed on the resin film. SOLUTION: The method for manufacturing the multilayer board comprises the step of forming a plurality of through holes 27, 35 formed in a multilayer board forming film 21 at superposing positions along a laminating direction of the board. The method further comprises the step of filling a conductive paste 50 sintered at a lower temperature than a heating temperature of the heating and pressurizing step to be conducted to weld the multilayer board forming films 21 in the holes 27, 35. Thus, when the heating and pressurizing steps are conducted, the paste 50 is sintered to form columnar supports 60, 70, and a hot pressing plates 80a, 80b are supported, the thermoplastic resin of the region used as the board can be prevented from being applied by an excess pressure, and a conductor pattern 22 formed on the film 21 can be prevented from being deviated. COPYRIGHT: (C)2003,JPO