A film forming method and film forming apparatus

    公开(公告)号:JP4906014B1

    公开(公告)日:2012-03-28

    申请号:JP2011546501

    申请日:2011-09-30

    CPC classification number: B05D1/00 C23C14/022 C23C14/06 C23C14/22 C23C14/546

    Abstract: Provided is a film formation apparatus that can efficiently form an anti-contamination film that can withstand actual use while also having improved abrasion resistance. A film formation apparatus (1) in which a substrate holder (12) that has a substrate holding surface for holding a plurality of substrates (14) is disposed rotatably within a vacuum vessel (10), said film formation apparatus (1) comprising: an ion source (38) mounted within the vacuum vessel (10) so as to have a configuration, position and orientation such that an ion beam can be radiated to an area that is a part of the substrate holding surface; and a vapor deposition source (34) and a control plate (36) that act as film formation means mounted within the vacuum vessel (10) so as to have a configuration such that the film formation material can be supplied to a region which is a part of the substrate holding surface and which overlaps at least a part of the ion beam radiation area irradiated by the ion source (38).

    Electroless plating method and electroless plating apparatus
    48.
    发明专利
    Electroless plating method and electroless plating apparatus 有权
    电镀方法和电镀镀膜装置

    公开(公告)号:JP2004124235A

    公开(公告)日:2004-04-22

    申请号:JP2002293913

    申请日:2002-10-07

    Inventor: MARUMO YOSHINORI

    CPC classification number: B05D1/00 C23C18/1676 C25D5/02 H01L21/288

    Abstract: PROBLEM TO BE SOLVED: To provide an electroless plating method by which the uniformity of a plating film to be formed can be improved.
    SOLUTION: An electroless plating liquid is fed, and reaction promotion conditions are imparted to start the formation of a plating film. In the stage where the electroless plating liquid is fed, the formation of the plating film is not performed, or, even if it is performed, the film forming rate therein is low. Thus, the electroless plating liquid is spread over a substrate before the normal formation of the plating film to improve the uniformity of the electroless plating film.
    COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题:提供可以提高要形成的镀膜的均匀性的化学镀方法。 解决方案:进料无电镀液,并赋予反应促进条件以开始形成镀膜。 在进料化学镀液的阶段中,不进行镀膜的形成,即使进行了,其成膜速度也低。 因此,在电镀膜正常形成之前,化学镀液体分散在基板上,以提高化学镀膜的均匀性。 版权所有(C)2004,JPO

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