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公开(公告)号：JP4914113B2
公开(公告)日：2012-04-11
申请号：JP2006132659
申请日：2006-05-11
Applicant: ハリマ化成株式会社
CPC classification number: Y02W30/74
Abstract: PROBLEM TO BE SOLVED: To provide a method for producing sterols in simple operations without using a special apparatus, while preventing the formation of wastes. SOLUTION: This method for producing the sterols from a tall pitch is characterized by comprising (I) a process for passing a non-polar solvent solution of the tall pitch through the first adsorption column filled with an inorganic adsorbent to adsorb the polar substances to the inorganic adsorbent, (II) a process for reacting sterol esters contained in the polar substance-removed tall pitch with a lower alcohol in the presence of a catalyst to release sterols which are polar substances, (III) a process for distilling away the lower alcohol, adding the released sterols to a non-polar solvent, and passing the obtained solution through the second adsorption column filled with an inorganic adsorbent to adsorb the released sterols to the inorganic adsorbent, and (IV) a process for eluting the sterols from the inorganic adsorbent with a polar solvent. COPYRIGHT: (C)2008,JPO&INPIT
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Patent Agency Ranking
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公开(公告)号：JP4824346B2
公开(公告)日：2011-11-30
申请号：JP2005163990
申请日：2005-06-03
Applicant: ハリマ化成株式会社
CPC classification number: Y02E60/142 , Y02E60/145
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公开(公告)号：JP4787384B1
公开(公告)日：2011-10-05
申请号：JP2011104043
申请日：2011-05-09
Applicant: ハリマ化成株式会社
CPC classification number: B23K35/22 , B22F1/0011 , B23K35/025 , B23K35/262 , B23K35/3006 , C22C1/005 , C22C13/00 , C22C13/02
Abstract: 【課題】 Ａｇの含有量を低減させてコストを抑えるとともに、優れた伸び、融点、強度などを有し、かつ高い耐疲労性（耐冷熱疲労性）を有する、長期間信頼できる低銀はんだ合金を提供する。
【解決手段】 本発明の低銀はんだ合金は、銀が０．０５〜２．０質量％、銅が１．０質量％以下、アンチモンが３．０質量％以下、ビスマスが２．０質量％以下、インジウムが４．０質量％以下、ニッケルが０．２質量％以下、ゲルマニウムが０．１質量％以下、コバルトが０．５質量％以下（但し、前記銅、アンチモン、ビスマス、インジウム、ニッケル、ゲルマニウム、およびコバルトは、それぞれ０質量％ではない）、および残部が錫からなる。
【選択図】 なし-
公开(公告)号：JP2011183458A
公开(公告)日：2011-09-22
申请号：JP2011142476
申请日：2011-06-28
Applicant: Denso Corp , Harima Chemicals Inc , ハリマ化成株式会社 , 株式会社デンソー
Inventor： MITSUHARU MASAKI , YAMAMOTO MASAYASU , NAKANISHI KENSUKE , AIHARA MASAMI
IPC: B23K35/363
Abstract: PROBLEM TO BE SOLVED: To provide a soldering flux and a solder paste composition capable of satisfactorily suppressing cracking of flux residue after soldering even in a severe environment such as drastic change in temperature, has high reliability, is excellent in soldering and has a manufacturing cost and a load to the environment equal to those in the conventional technique.
SOLUTION: The soldering flux comprises a base resin, an activator and an organic solvent, wherein the content of the base resin is 8.7 to 71 wt.% with respect to the total amount of flux, the content of the activator is 0.1 to 20 wt.% with respect to the total amount of flux, the content of the organic solvent is 26.7 to 90.0 wt.% with respect to the total amount of flux and the content of a thermoplastic acrylic resin having a glass transition temperature less than -50°C, as the base resin is 5.7 to 56 wt.% with respect to the total amount of flux. The solder paste composition contains the soldering flux and a solder alloy powder.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题：为了提供能够令人满意地抑制焊接后的焊剂残留物的裂纹的助焊剂和焊膏组合物，即使在诸如剧烈变化的剧烈环境下也具有高可靠性，焊接性优异， 制造成本和对环境的负荷等于常规技术的成本。 助焊剂包括基础树脂，活化剂和有机溶剂，其中基础树脂的含量相对于助熔剂的总量为8.7至71重量％，活化剂的含量为0.1 至20重量％，相对于助熔剂的总量和玻璃化转变温度的热塑性丙烯酸树脂的含量，有机溶剂的含量为26.7〜90.0重量％ -50℃，相对于助熔剂的总量，基础树脂为5.7〜56重量％。 焊膏组合物含有助焊剂和焊料合金粉末。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2011173173A
公开(公告)日：2011-09-08
申请号：JP2011117261
申请日：2011-05-25
Applicant: Harima Chemicals Inc , ハリマ化成株式会社
Inventor： ANADA TAKAAKI , KASHIWAGI SHINICHIRO , KUMAMOTO SATOSHI
IPC: B23K35/363 , B23K35/26 , C22C13/00 , H05K3/34
Abstract: PROBLEM TO BE SOLVED: To provide a soldering flux capable of suppressing coloring of flux residues after the soldering and occurrence of any cracked state caused by a large number of cracks, and ensuring the visibility during the visual inspection even in a non-cleaned state while a rosinous resin is contained as a base resin, and a solder paste composition using the same. SOLUTION: The soldering flux is a non-cleaning flux containing rosin-based resin as the base resin, wherein the percentage content of an abietic acid type resinous acid having conjugate double bonds contained in the rosin-based resin is 2-5 wt.%. The rosin-based resin is preferably one or more kinds selected from the group composed of a hydrogenated rosin and a disproportionated rosin. The solder paste composition contains the above flux and solder alloy powder. The above flux or the soldering paste composition preferably contains an oxidation inhibitor. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：提供一种能够抑制焊接后的焊剂残留物的着色以及由大量裂纹引起的任何破裂状态的发生的助焊剂，并且即使在非易失性存储器中也能确保目视检查期间的可视性， 作为基础树脂含有松香性树脂时的清洗状态，以及使用其的焊膏组合物。 焊剂是含有松香系树脂作为基础树脂的非清洁助熔剂，其中松香类树脂中含有共轭双键的松香型树脂酸的含量百分含量为2-5 重量％。 松香系树脂优选为选自由氢化松香和歧化松香组成的组中的一种以上。 焊膏组合物含有上述焊剂和焊料合金粉末。 上述焊剂或焊膏组合物优选含有氧化抑制剂。 版权所有（C）2011，JPO＆INPIT
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