METHOD FOR FORMING PACKAGING COMPOSITION

    公开(公告)号:JPH07178811A

    公开(公告)日:1995-07-18

    申请号:JP17831694

    申请日:1994-07-29

    申请人: RECOT INC

    发明人: DERKACH WILLIAM J

    摘要: PURPOSE: To provide a continuous in-line method for forming a film suitable for packaging a product forming a decomposition product by coating the single surface of an extruded stretched base layer with a film layer reducing the disadvantageous influence of a decomposition product generated by the decomposition of a product and extruding a sealant coating on this film layer. CONSTITUTION: For example, a polyethyleneimine(PEI) layer 14 containing an aldehyde absorbing substance arranged in an amt. effective to remove an aldehyde byproduct formed by the decomposition of oil in a packaged food is formed on the under surface of a polypropylene base layer 12. The PEI layer 14 is subsequently bonded to the polypropylene base layer 12 and the film coated with PEI is dried. Next, a sealant like SURLYNTM 1652SR is extruded on the PEI layer 14 to form a sealant layer 16. The formed multilayered film 10 is subsequently connected to a tenter to be biaxially stretched. Aldehyde passes through the sealant layer and comes into contact with an amine on the film 4 to be immobilized and cured.

    CURLING METHOD FOR CHIP FOOD, AND ITS DEVICE

    公开(公告)号:JPH08322501A

    公开(公告)日:1996-12-10

    申请号:JP3157396

    申请日:1996-02-20

    申请人: RECOT INC

    摘要: PROBLEM TO BE SOLVED: To provide an adhesive corresponding to a seasoning such as salt while adjusting volume density by moving a conveyer on which chips are put on, spraying the continuous curtain of water only onto the upper exposed surfaces of chips, drying and curling the upper parts of chips in a ratio different from lower parts. SOLUTION: The conveyer, on which monolayered chips are put on, is moved, the continuous curtain of water is sprayed only to the upper exposed surfaces of chips, and salt is scattered over chips. Next, concerning a moisture difference between the upper and lower surfaces of chips, the upper parts of chips are dried in the ratio different from the lower parts of chips and chips are curled.