公开(公告)号：JP2006009039A

公开(公告)日：2006-01-12

申请号：JP2004183078

申请日：2004-06-21

Applicant: Okuno Chem Ind Co Ltd ,  Rambo Chemicals (Hong Kong) Ltd ,  奥野製薬工業株式会社 ,  永保化工(香港)有限公司

Inventor： KWOK CHUN WAH ,  KWOK YIM WAH ,  NAKAGISHI YUTAKA

IPC: C25D5/10 ,  C23C18/16 ,  C23C18/48 ,  H05K3/34

CPC classification number: C23C18/1653 ,  C23C18/1651 ,  C23C18/1841 ,  C23C18/48 ,  C23C18/52 ,  C25D5/10 ,  H05K3/3463 ,  H05K3/3473 ,  Y10T428/12639 ,  Y10T428/12708

Abstract: PROBLEM TO BE SOLVED: To provide a product in which a lead-free tinning film or a lead-free tin alloy plating film is formed, and which can be produced relatively easily without need of a complicated process while the generation of whiskers is suppressed over a long period. SOLUTION: The tin based plating film in which the growth of whiskers is suppressed is composed of a plating film with a double layer structure consisting of: a lower layer formed of a tinning film or a tin alloy plating film comprising ≤5 wt.% of at least one kind of metal selected from the group consisting of cobalt, copper, bismuth, silver and indium, and ≥95 wt.% tin; and an upper layer formed of a tinning film or a tin alloy plating film comprising ≤5 wt.% of at least one kind of metal selected from the group consisting of cobalt, copper, bismuth, silver and indium, and ≥95 wt.% tin. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种无铅锡镀膜或无铅锡合金镀膜形成的产品，并且可以相对容易地制造而不需要复杂的工艺而产生晶须 被长期压制。 解决方案：抑制晶须生长的锡基电镀膜由具有双层结构的镀膜构成，该镀膜由以下组成：由镀锡膜或含有≤5重量％的锡合金镀膜形成的下层 选自钴，铜，铋，银和铟中的至少一种金属和≥95重量％的锡的％ 以及由含有≤5重量％的选自钴，铜，铋，银和铟中的至少一种金属的镀锡膜或锡合金镀膜形成的上层，并且≥95重量％ 锡。 版权所有（C）2006，JPO＆NCIPI