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公开(公告)号:JP4822008B2
公开(公告)日:2011-11-24
申请号:JP2007034348
申请日:2007-02-15
Applicant: 信越化学工業株式会社
Inventor: 直樹 山川
Abstract: PROBLEM TO BE SOLVED: To provide a heat-curable silicone composition giving a cured product having high hardness/transparency and excellent heat-resistance and light resistance, and resistant to clouding even by leaving in a high-temperature and humidity state and returning to room temperature. SOLUTION: The heat-curable silicone composition is composed of (i) an organopolysiloxane expressed by formula (1): R 1 n (C 6 H 5 ) m SiO (4-n-m)/2 (R 1 is a univalent hydrocarbon group, an alkoxy group or hydroxyl group; 1≤n+m 2 a H b SiO (4-a-b)/2 (R 2 is a univalent hydrocarbon group; 0.7≤a≤2.1; 0.01≤b≤1.0; and 0.8≤a+b≤3.0), (iii) a catalyst for addition reaction, and (iv) one or more compounds selected from organohydrogenpolysiloxane having epoxy group and/or alkoxy group, organosilane having epoxy group and/or alkoxy group and non-silicon epoxy compound. COPYRIGHT: (C)2007,JPO&INPIT
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公开(公告)号:JP4648099B2
公开(公告)日:2011-03-09
申请号:JP2005166824
申请日:2005-06-07
Applicant: 信越化学工業株式会社
IPC: C09J183/07 , C09J183/05 , C09J183/10 , H01L21/52 , H01L33/00 , H01L33/48
CPC classification number: C08L83/04 , C08G77/12 , C08G77/20 , C08L2666/14 , C08L83/00
Abstract: A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23°C, (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.
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公开(公告)号:JP4600669B2
公开(公告)日:2010-12-15
申请号:JP2005133975
申请日:2005-05-02
Applicant: 信越化学工業株式会社
IPC: C09D163/00 , C09D183/00 , C09D183/02 , C09D183/04
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公开(公告)号:JP4310620B2
公开(公告)日:2009-08-12
申请号:JP2003090963
申请日:2003-03-28
Applicant: 信越化学工業株式会社
IPC: C09J183/04 , C09J11/00 , C09J163/00 , C09J183/05
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公开(公告)号:JP4697370B2
公开(公告)日:2011-06-08
申请号:JP2001227506
申请日:2001-07-27
Applicant: 信越化学工業株式会社
IPC: C09J183/04 , C09J183/05 , C09J11/04 , C09J163/00 , C09J183/07 , C09J183/08
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