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公开(公告)号：JP4634891B2
公开(公告)日：2011-02-23
申请号：JP2005238019
申请日：2005-08-18
Applicant: 信越化学工業株式会社
CPC classification number: H01L23/3737 , C10M169/04 , C10M2201/041 , C10M2201/05 , C10M2201/053 , C10M2201/061 , C10M2229/041 , C10M2229/0415 , C10M2229/044 , C10M2229/046 , C10N2210/01 , C10N2210/03 , C10N2210/07 , C10N2210/08 , C10N2220/082 , C10N2230/02 , H01L2224/32245 , Y10T428/31663
Abstract: Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to provide from 0.1 to 5.0 hydrogen atoms bonded to silicon atoms within the component (B) for each alkenyl group within the component (A), (C) 100 to 2,200 parts by mass of a heat conductive filler, (D) an effective quantity of a platinum-based catalyst, and (E) an effective quantity of an addition reaction retarder, in which the component (C) includes more than 90% by mass and no more than 100% by mass of an indium powder with an average particle size of 0.1 to 100 µm. Also provided is a heat conductive silicone cured product obtained by curing the above composition by heating at a temperature equal to, or greater than, the melting point of the indium powder. Further provided is an electronic device including an electronic component, a heat radiating member, and a heat conductive member including the above cured product disposed between the electronic component and the heat radiating member. Still further provided is a method of curing the above composition. Even further provided is a method of forming a heat conductive member between an electronic component and a heat radiating member. The above heat conductive silicone grease composition generates a suitably thin cured product with excellent thermal conductivity that prevents problems such as the contamination of components other than the coated component, and the leakage of oily materials from the product if used over extended periods.
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公开(公告)号：JP4495749B2
公开(公告)日：2010-07-07
申请号：JP2007152594
申请日：2007-06-08
Applicant: 信越化学工業株式会社
IPC: C08L83/04 , C08K3/00 , C08K5/5419
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公开(公告)号：JP5111451B2
公开(公告)日：2013-01-09
申请号：JP2009156641
申请日：2009-07-01
Applicant: 信越化学工業株式会社
IPC: C09J5/00 , C09D5/00 , C09D7/12 , C09D183/05 , C09D183/07 , C09J183/05 , C09J183/07 , C09K5/08 , H01L23/373
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公开(公告)号：JP4839001B2
公开(公告)日：2011-12-14
申请号：JP2005028816
申请日：2005-02-04
Applicant: パイオニア・マイクロ・テクノロジー株式会社 , パイオニア株式会社 , 信越化学工業株式会社
CPC classification number: H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2924/19105 , H01L2924/00014
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公开(公告)号：JP4648099B2
公开(公告)日：2011-03-09
申请号：JP2005166824
申请日：2005-06-07
Applicant: 信越化学工業株式会社
IPC: C09J183/07 , C09J183/05 , C09J183/10 , H01L21/52 , H01L33/00 , H01L33/48
CPC classification number: C08L83/04 , C08G77/12 , C08G77/20 , C08L2666/14 , C08L83/00
Abstract: A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23°C, (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.
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Patent Agency Ranking
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公开(公告)号：JP4648146B2
公开(公告)日：2011-03-09
申请号：JP2005278352
申请日：2005-09-26
Applicant: 信越化学工業株式会社
Inventor： 敬 三好
CPC classification number: C08L83/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08L83/00 , C09J183/04 , Y10T428/31663
Abstract: Provided is a silicone composition, including: (A) an organopolysiloxane represented by an average composition formula R 1 n SiZ [(4-n)/2] (in which, R 1 represents a monovalent hydrocarbon group, an alkoxy group or a hydroxyl group, provided that from 5 to 50 mol% of all R 1 groups are alkenyl groups, and from 10 to 80 mol% of all R 1 groups arc aryl groups, Z represents an oxygen atom or a bivalent hydrocarbon group, provided at least 80 onol% of all Z groups are oxygen atoms, and n is a number that satisfies 1 = n
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公开(公告)号：JP4514058B2
公开(公告)日：2010-07-28
申请号：JP2006233344
申请日：2006-08-30
Applicant: 信越化学工業株式会社
IPC: C08L83/04 , C08K5/5419
CPC classification number: C09J183/04 , C08G77/045 , C08G77/18 , C08G77/20 , C08K3/22 , C08K5/56 , C08L83/00 , Y10T428/31663
Abstract: Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler. Heat generated by a heat-generating electronic component can be dissipated into a heat-radiating component by sandwiching the cured product between the heat-generating electronic component and the heat-radiating component.
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