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公开(公告)号：JP5293527B2
公开(公告)日：2013-09-18
申请号：JP2009215268
申请日：2009-09-17
Applicant: 日立電線株式会社
IPC: H05K3/34
Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board allowing for stable and accurate appearance quality check of an opening pattern of a via, and which is capable of suppressing or eliminating the generation of appearance unevenness, poor quality, or the like, in an electroless tin plated film formed on the surface of a land 5, and to provide a method of manufacturing the printed wiring board. SOLUTION: The printed wiring board includes a lead section 9 for detecting elution of copper, where the surface is exposed with an area smaller than an exposed area of the land 5, at a position differing from the land 5 and the electroless tin plated film is provided on the surface. In PSR films 6, 15, a first layer 6 and a second layer 15 are laminated on an insulating substrate 1, in this order. The film thickness T1 of the first layer 6 is not less than 8 μm and not more than 20 μm, in terms of height from the surface of a copper wiring pattern 3, the film thickness T2 of the second layer is not less than 5 μm and not more than 20 μm, in terms of height from the surface of the second layer 15, and the aspect ratio of the via 7, assuming that the opening area of the via 7 is converted into a circle having the same area, is not more than 0.10 for both of the first layer 6 and the second layer 15. COPYRIGHT: (C)2011,JPO&INPIT
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Patent Agency Ranking
公开(公告)号：JP3508561B2
公开(公告)日：2004-03-22
申请号：JP23613098
申请日：1998-08-21
Applicant: 日立電線株式会社
CPC classification number: H01L24/29 , H01L24/27 , H01L2224/83101
Abstract: PROBLEM TO BE SOLVED: To obtain a method for bonding a film piece, such as TAB(tape automated bonding) which can dispense with high manufacturing technique and an expensive manufacturing apparatus and also can positively prevent generation of warpages of the film piece. SOLUTION: A laminate film 6 consisting of a TAB tape and adhesive is placed on a cutting die 14 of a punching press 9 at a punching position, a substrate 7 is placed on a heat block 12, and the laminate film 6 is punched by a puncher 10 of the press 9. The puncher 10 pushes the heated substrate 7 against the punched film piece 11 during punching operation thereof, to cause a part of the film piece 11 to be attached temporarily to the substrate 7 by a projection 15 at a tip end of the puncher. Next, the temporarily/attached substrate 7 and film piece 11 are fed to a pressure roller, to bond the entire surface of the film piece onto the substrate.
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公开(公告)号：JP5281526B2
公开(公告)日：2013-09-04
申请号：JP2009215263
申请日：2009-09-17
Applicant: 日立電線株式会社 , 日立電線ファインテック株式会社
IPC: H05K3/34
Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board allowing for stable and accurate appearance quality check of the opening pattern of a via or stable and accurate check for the presence or absence of the occurrence of elution of copper (Cu) at a land exposed at an opening of a via which has strong correlation with the occurrence of defects in an opening pattern of such a via, and to provide a method of manufacturing the printed wiring board. SOLUTION: In the printed wiring board, at least one of copper wiring patterns 3 is connected to the land 5 exposed at the opening of the via 7 and to a lead section 9 for detecting elution of copper (Cu), provided in such a manner that the surface is exposed with an area smaller than the exposed area of the land 5 at a position differing from that of the land 5. An electroless tin (Sn) plated film is formed on the surface of the lead section 9 for detecting elution of copper (Cu). COPYRIGHT: (C)2011,JPO&INPIT
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6.发明专利
公开(公告)号：JP4654955B2
公开(公告)日：2011-03-23
申请号：JP2006087947
申请日：2006-03-28
Applicant: 日立電線株式会社
IPC: H01L21/60
CPC classification number: H01L2924/0002 , H01L2924/00
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