公开(公告)号：JP5411689B2

公开(公告)日：2014-02-12

申请号：JP2009297626

申请日：2009-12-28

申请人： 東京エレクトロン株式会社

发明人： 充一 中村 ,  雅彦 杉山 ,  大 篠▲崎▼ ,  直樹 秋山

IPC分类号： H01L21/52 ,  H05K13/04

CPC分类号： H01L24/83 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/75 ,  H01L24/97 ,  H01L2221/68313 ,  H01L2224/27312 ,  H01L2224/7565 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2224/27 ,  H01L2224/83 ,  H01L2924/00

摘要： A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.