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公开(公告)号：JP4988801B2
公开(公告)日：2012-08-01
申请号：JP2009224765
申请日：2009-09-29
申请人： 東京エレクトロン株式会社
IPC分类号： H01L21/683
CPC分类号： H01L21/67092
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公开(公告)号：JP5411689B2
公开(公告)日：2014-02-12
申请号：JP2009297626
申请日：2009-12-28
申请人： 東京エレクトロン株式会社
CPC分类号： H01L24/83 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L24/27 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/97 , H01L2221/68313 , H01L2224/27312 , H01L2224/7565 , H01L2224/83143 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2224/92 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/14 , H01L2924/15788 , H01L2224/27 , H01L2224/83 , H01L2924/00
摘要： A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.
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公开(公告)号：JP5129848B2
公开(公告)日：2013-01-30
申请号：JP2010233874
申请日：2010-10-18
申请人： 東京エレクトロン株式会社
CPC分类号： H01L24/81 , H01L21/67092 , H01L24/05 , H01L24/13 , H01L24/75 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05624 , H01L2224/13117 , H01L2224/16145 , H01L2224/75102 , H01L2224/7525 , H01L2224/75251 , H01L2224/75252 , H01L2224/7526 , H01L2224/75283 , H01L2224/75303 , H01L2224/75312 , H01L2224/75314 , H01L2224/755 , H01L2224/75501 , H01L2224/7565 , H01L2224/757 , H01L2224/75901 , H01L2224/75985 , H01L2224/81001 , H01L2224/81204 , H01L2224/8122 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01082 , H01L2924/00014 , H01L2924/01032
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公开(公告)号：JP5107408B2
公开(公告)日：2012-12-26
申请号：JP2010194619
申请日：2010-08-31
申请人： 東京エレクトロン株式会社
IPC分类号： H01L21/67 , H01L21/301 , H01L21/52
CPC分类号： H01L21/6835 , B25J15/0616 , B32B43/006 , H01L21/67011 , H01L21/67132 , H01L21/6836 , H01L21/6838 , H01L2221/68327 , Y10T156/1132 , Y10T156/1933
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公开(公告)号：JP5558452B2
公开(公告)日：2014-07-23
申请号：JP2011231671
申请日：2011-10-21
申请人： 東京エレクトロン株式会社
CPC分类号： H01L21/67092
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公开(公告)号：JP5335875B2
公开(公告)日：2013-11-06
申请号：JP2011219069
申请日：2011-10-03
申请人： 東京エレクトロン株式会社
IPC分类号： H01L21/3065 , H05H1/46
摘要： PROBLEM TO BE SOLVED: To provide a plasma processing device capable of reducing the potential difference between an inner wall of a housing container and a grounding substrate which supports at least one of a lower electrode or an upper electrode. SOLUTION: A plasma processing device 10 comprises: a chamber 11 accommodating a glass substrate G; a lower electrode plate 23 which is arranged in the chamber 11 and served as a mounting table for mounting the glass substrate G; a shower head 12 which is arranged facing the lower electrode plate 23 and supplies processing gas into the chamber 11; a high-frequency power supply 20 which is connected to an upper electrode plate 13 of the shower head 12; a grounding board 26 which supports the lower electrode plate 23 through a lower insulation part 25 and is arranged apart from the inner wall of the chamber 11; and a short circuit plate 36 which short-circuits the grounding board 26 and the inner wall of the chamber 11. The short circuit plate 36 consists of a liner conductor whose cross section is rectangle, and is branched into at least two in mid-course. COPYRIGHT: (C)2012,JPO&INPIT
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公开(公告)号：JP4887202B2
公开(公告)日：2012-02-29
申请号：JP2007108421
申请日：2007-04-17
申请人： 東京エレクトロン株式会社
IPC分类号： H01L21/3065
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