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公开(公告)号：JP2014090629A
公开(公告)日：2014-05-15
申请号：JP2012240388
申请日：2012-10-31
Applicant: Denso Corp , 株式会社デンソー
Inventor： MATSUOKA TETSUYA , ICHIJO KOYO , HIRASAWA NAOKI
IPC: H02M7/48
CPC classification number: H02M7/003
Abstract: PROBLEM TO BE SOLVED: To provide a power conversion device that complicates interference between busbars or connectors connected to individual output terminal groups.SOLUTION: The power conversion device includes a plurality of semiconductor modules 2 (2a, 2b) and a control circuit board 3. The semiconductor modules 2 each include a pair of input terminals 21 and at least two output terminals 22. Semiconductor elements 29 are turned on/off to convert a DC voltage applied to the input terminals 21 to a three-phase AC voltage to be output from the output terminals 22. Two output terminal groups 8 (8a, 8b) are formed which each comprise three output terminals 22 to output the three-phase AC voltage. One or more output terminals 22a constituting one semiconductor module 2a and one or more output terminals 22b constituting another semiconductor module 2b are combined to form a single output terminal group 8.
Abstract translation: 要解决的问题：提供一种使连接到各个输出端子组的母线或连接器之间的干扰复杂化的电力转换装置。解决方案：电力转换装置包括多个半导体模块2（2a，2b）和控制电路板3。 半导体模块2各自包括一对输入端子21和至少两个输出端子22.半导体元件29导通/截止以将施加到输入端子21的DC电压转换为三相AC电压以从 输出端子22.形成两个输出端子组8（8a，8b），每个输出端子组包括三个输出端子22，以输出三相AC电压。 构成一个半导体模块2a的一个或多个输出端子22a和构成另一个半导体模块2b的一个或多个输出端子22b组合以形成单个输出端子组8。
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公开(公告)号：JP2012217315A
公开(公告)日：2012-11-08
申请号：JP2011232216
申请日：2011-10-21
Applicant: Denso Corp , 株式会社デンソー
Inventor： ICHIJO KOYO , KANEKO TAKAHISA , KAIDA KENSHIRO , FUJIWARA TAKESHI
CPC classification number: H05K7/20927 , H01L23/4006 , H01L23/4012 , H01L23/473 , H01L25/0657 , H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H02M7/003 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a power conversion apparatus capable of improving vibration resistance of a frame and reducing a stress generated in a control circuit board connected to a semiconductor module.SOLUTION: A conversion apparatus 1 comprises: a semiconductor module 11 constructing a part of a power conversion circuit; a control circuit board 4 connected to a control terminal 113 in the semiconductor module 11; and a frame 3 housing the semiconductor module 11 therein. The frame 3 comprises: a pair of sidewall parts 32; and a board fixing plate 2 coupling the pair of sidewall parts 32 and arranged between the semiconductor module 11 and the control circuit board 4. The semiconductor module 11 is arranged between the pair of sidewall parts 32, and the control circuit board 4 is fixed to the board fixing plate 2.
Abstract translation: 要解决的问题：提供一种能够改善框架的抗振性并减少与连接到半导体模块的控制电路板中产生的应力的电力转换装置。 解决方案：转换装置1包括：构成功率转换电路的一部分的半导体模块11; 连接到半导体模块11中的控制端子113的控制电路板4; 以及在其中容纳半导体模块11的框架3。 框架3包括：一对侧壁部分32; 以及连接该对侧壁部32并配置在半导体模块11与控制电路基板4之间的板固定板2.半导体模块11配置在该对侧壁部32之间，将控制电路基板4固定于 板固定板2.版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2011155171A
公开(公告)日：2011-08-11
申请号：JP2010016359
申请日：2010-01-28
Applicant: Denso Corp , 株式会社デンソー
Inventor： ICHIJO KOYO , KANEKO TAKAHISA
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor module that decreases the man-hour needed for fixation and has superior vibration resistance. SOLUTION: The semiconductor module includes a body portion 3 where semiconductor elements 2 are sealed. A power terminal 4 for inputting and outputting currents to be controlled to and from the semiconductor elements 2 protrudes from the body portion 3. Further, a plurality of mutually parallel control terminals 5 for inputting and outputting signal currents to and from the semiconductor elements 2 protrude from the body portion 3. Furthermore, terminals 6 for fixation reinforcement which are not electrically connected to the semiconductor elements 2 protrude from the body portion 3 in the same direction with the control terminals 5. The plurality of control terminals 5 and the terminals 6 for fixation reinforcement are configured to be connected to a control circuit board 7 which controls the semiconductor elements 2. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：提供一种降低固定所需工时的半导体模块，并具有优异的抗振性。 解决方案：半导体模块包括半导体元件2被密封的主体部分3。 用于输入和输出要被控制到半导体元件2的电流的电源端子4从主体部分3突出。此外，用于输入和输出来自半导体元件2的信号电流的多个相互并行的控制端子5突出 此外，与电极不连接的半导体元件2的用于固定加强件的端子6从主体部分3以与控制端子5相同的方向突出。多个控制端子5和用于 固定加强件被配置为连接到控制半导体元件2的控制电路板7.版权所有：（C）2011，JPO＆INPIT
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公开(公告)号：JP2012210098A
公开(公告)日：2012-10-25
申请号：JP2011074697
申请日：2011-03-30
Applicant: Denso Corp , 株式会社デンソー
Inventor： ICHIJO KOYO , KANEKO TAKAHISA , IGUCHI TOMOHITO , KAIDA KENSHIRO , TOKUNAGA YASUAKI
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide an electric power conversion apparatus which suppresses vibrations of a semiconductor lamination unit to a frame located in a direction that intersects the lamination direction of the semiconductor lamination unit without inhibiting the transmission of a pressing force applied to the semiconductor lamination unit by a pressurizing member.SOLUTION: An electric power conversion apparatus 1 includes: a semiconductor lamination unit 10 formed by semiconductor modules 11 and cooling tubes 120; and a pressurizing member 4 pressurizing the semiconductor lamination unit 10 in the lamination direction X. Further, the electric power conversion apparatus 1 has: a contact plate 3 disposed between the pressurizing member 4 and the semiconductor lamination unit 10; and a frame 21 in which the semiconductor lamination unit 10, the pressurizing member 4, and the contact plate 3 are disposed on the inner side thereof. The semiconductor lamination unit 10 has vibration regulating means 34 regulating vibrations in a direction that intersects the lamination direction X while allowing the movements of the contact plate 3 in the lamination direction X.
Abstract translation: 解决的问题：提供一种电力转换装置，其抑制半导体层叠单元对位于与半导体层叠单元的层叠方向相交的方向的框架的振动，而不抑制施加到半导体层叠单元的压力的传递 半导体层叠单元由加压构件构成。 解决方案：电力转换装置1包括：由半导体模块11和冷却管120形成的半导体叠层单元10; 以及在层叠方向X上对半导体层叠单元10进行加压的加压构件4.此外，电力转换装置1具有：设置在加压构件4和半导体层叠单元10之间的接触板3; 以及框体21，其中半导体层叠单元10，加压构件4和接触板3设置在其内侧。 半导体层叠单元10具有调节与层叠方向X相交的方向的振动的振动调节单元34，同时允许接触板3在层叠方向X上移动。（C）2013，JPO＆INPIT
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公开(公告)号：JP2011071398A
公开(公告)日：2011-04-07
申请号：JP2009222276
申请日：2009-09-28
Applicant: Denso Corp , 株式会社デンソー
Inventor： HOSONO YUKIO , OKAMURA MAKOTO , SAKAI YASUYUKI , FUNABASHI KENJI , YAMAHIRA YU , TONOMOTO MASAYA , ICHIJO KOYO , KURIHARA TAKASHI
IPC: H01L23/473 , H05K7/20
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor cooling structure excellent in cooling efficiency for semiconductor elements. SOLUTION: The semiconductor cooling structure 1 includes a semiconductor module incorporating a semiconductor element 21, and a cooling pipe disposed in close contact with the semiconductor module. The cooling pipe 3 has a coolant flow passage 32 inside, and includes an intermediate plate 34 partitioning the coolant flow passage into a first flow passage 321 and a second flow passage 322 in a cooling surface normal direction X. The intermediate plate has a communication part 341, making the first flow passage communicate with second flow passage, at both ends in a cooling surface width direction Z. The first flow passage and second flow passage are provided with inclined fins 4 formed obliquely to a coolant flow direction Y, respectively, and the inclined fins of the first flow passage and the inclined fins of the second flow passage are opposite in inclination direction. The first flow passage and second flow passage each have partition plates 5, blocking the linear flow of a cooling medium in the coolant flow direction Y, formed at flow passage ends 323 in an element arrangement area V. The cooling medium flows alternately to the first flow passage and second flow passage through the communication part. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：提供半导体元件的冷却效率优异的半导体冷却结构。 解决方案：半导体冷却结构1包括具有半导体元件21的半导体模块和与半导体模块紧密接触的冷却管。 冷却管3内部具有冷却剂流路32，并且包括将冷却剂流路分隔成冷却面法线方向X的第一流路321和第二流路322的中间板34.中间板具有连通部 341，使第一流路与第二流路连通，在冷却面宽度方向Z的两端。第一流路和第二流路分别设置有倾斜翅片4，倾斜翅片4相对于冷却剂流动方向Y倾斜地形成， 第一流路的倾斜翅片和第二流路的倾斜翅片在倾斜方向上相反。 第一流路和第二流路各具有分隔板5，阻挡冷却剂流动方向Y上的冷却介质的线性流动，该流动方向Y形成在元件配置区域V中的流路端部323处。冷却介质交替地流动到第一流路 流动通道和通过通信部分的第二流动通道。 版权所有（C）2011，JPO＆INPIT
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Patent Agency Ranking
公开(公告)号：JP2017093271A
公开(公告)日：2017-05-25
申请号：JP2015225041
申请日：2015-11-17
Applicant: 株式会社デンソー , Denso Corp
Inventor： HIRASAWA NAOKI , TANABE RYUTA , ICHIJO KOYO , KAWASHIMA TAKASHI
IPC: H02M7/48 , H01L23/40 , H01L23/473
CPC classification number: H01L25/0657 , B60L11/1874 , H01L23/053 , H01L23/32 , H01L23/473 , H01L2225/06555 , H01L2225/06582 , H01L2225/06589 , H02M7/003 , H02M2001/327 , H05K7/20927
Abstract: 【課題】半導体モジュールと冷却管との間の圧接力を充分に確保しつつ、半導体モジュールに電気的に接続された電子部品に作用する加圧力を抑制することができる電力変換装置を提供すること。【解決手段】電力変換装置1は、半導体モジュール2と、電子部品3と、複数の冷却管4と、ケース5と、半導体積層部11を積層方向に加圧する主加圧部材61と、部品積層部12を積層方向に加圧する副加圧部材62とを有する。半導体積層部11と部品積層部12とは一直線状に積層されている。主加圧部材61の加圧力は副加圧部材62の加圧力よりも大きい。主加圧部材61は半導体積層部11における部品積層部12から遠い側の端部に配置されている。ケース5には、主加圧部材61の加圧力が部品積層部12に作用することを防ぐように、半導体積層部11を部品積層部12側から支承する支承部7が設けてある。【選択図】図1
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公开(公告)号：JP2015012639A
公开(公告)日：2015-01-19
申请号：JP2013134428
申请日：2013-06-27
Applicant: 株式会社デンソー , Denso Corp
Inventor： ICHIJO KOYO , HIRASAWA NAOKI , MATSUOKA TETSUYA , SAKAI SHOJI
IPC: H02M7/48
Abstract: 【課題】接続電子部品の冷却を効率的に行うことができる電力変換装置を提供すること。【解決手段】電力変換装置1は、半導体モジュール21と半導体モジュール21を冷却する冷却器22とを積層してなる半導体積層ユニット2と、半導体モジュール21とバスバー3を介して電気的に接続された接続電子部品(コンデンサ素子4)と、接続電子部品を収納する部品ケース5と、を備える。半導体積層ユニット2は、部品ケース5の外側面50に冷却器22を当接させた状態で配置されている。バスバー3の一部は、部品ケース5内に配置されていると共に接続電子部品と冷却器22との間に配置されている。【選択図】図1
Abstract translation: 要解决的问题：提供一种能够有效地冷却连接电子部件的电力转换系统。电力转换系统1包括：通过层叠半导体模块21和冷却器22而形成的半导体层叠单元2， 半导体模块21; 连接电子部件（电容器元件4），其通过母线3与半导体模块21电连接; 以及容纳连接电子部件的部件壳体5。 半导体层叠单元2设置在冷却器22与组件壳体5的外表面50接触的状态。汇流条3的一部分设置在组件壳体5中，并且在连接电子部件和 冷却器22。
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公开(公告)号：JP2014011915A
公开(公告)日：2014-01-20
申请号：JP2012148645
申请日：2012-07-02
Applicant: Denso Corp , 株式会社デンソー
Inventor： ICHIJO KOYO , SAKAI SHOJI
IPC: H02M7/48 , H01L23/473 , H01L25/07 , H01L25/18 , H05K7/20
CPC classification number: H02M1/00 , H01L23/4006 , H01L23/473 , H01L25/117 , H01L2924/0002 , H02M7/003 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide an electric power conversion apparatus which reduces the number of components thereby enabling the downsizing and the reduction of the man hours in the manufacturing process.SOLUTION: An electric power conversion apparatus 1 includes: a semiconductor module 2 incorporating a switching element 21 therein; a cooling tube 3 which contacts with a heat radiation surface 24 of the semiconductor module 2 thereby cooling the semiconductor module 2; and a capacitor module 4 which is formed by sealing a capacitor element 41 with a potting material 42. A laminated body 10 formed by laminating the semiconductor module 2 on the cooling tube 3 is held in a lamination direction Z by the capacitor module 4 disposed at the one end side in the lamination direction Z and a pressing member 5 disposed at the other end side in the lamination direction Z. One end of the laminated body 10 is in contact with a potting surface 43 which is a surface of the potting material 42 in the capacitor module 4.
Abstract translation: 要解决的问题：提供一种减少部件数量的电力转换装置，从而能够在制造过程中实现小型化和减少工时。解决方案：电力转换装置1包括：半导体模块2， 开关元件21; 冷却管3，其与半导体模块2的散热面24接触，从而冷却半导体模块2; 以及电容器模块4，其通过用封装材料42密封电容器元件41.通过将半导体模块2层叠在冷却管3上而形成的层叠体10通过电容器模块4被设置在层叠方向Z上 层叠方向Z的一端侧和位于层叠方向Z的另一端侧的按压部件5.层叠体10的一端与灌封材料42的表面接合， 在电容器模块4中。
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公开(公告)号：JP2014027768A
公开(公告)日：2014-02-06
申请号：JP2012165660
申请日：2012-07-26
Applicant: Denso Corp , 株式会社デンソー
Inventor： NOBUHARA MASAHIKO , ICHIJO KOYO , MATSUOKA TETSUYA
Abstract: PROBLEM TO BE SOLVED: To provide a capacitor capable of further reducing the floating inductance of bus bars and a power conversion device using the capacitor.SOLUTION: A capacitor 1 includes a capacitor element 2, a case 4, a pair of bus bars 3 (3a and 3b), and a sealing member 5. The capacitor element 2 is housed in the case 4. The pair of bus bars 3 are electrically connected to the capacitor element 2. A bus-bar opposite portion 6 is formed in the capacitor 1. The bus-bar opposite portion 6 is formed by oppositely disposing an inner extension portion 31 that is formed in the bus bar 3 and extends along a side wall 40 in the case 4 and an outer extension portion 32 that is formed in the bus bar 3 and extends along the side wall 40 outside the case 4 with the side wall 40 interposed therebetween. The directions of currents I each flowing through the inner extension portion 31 and the outer extension portion 32 are opposite to each other.
Abstract translation: 要解决的问题：提供能够进一步减小母线的浮动电感的电容器和使用电容器的功率转换装置。解决方案：电容器1包括电容器元件2，壳体4，一对母线3（ 电容器元件2容纳在壳体4中。一对母线3电连接到电容器元件2.汇流条相对部分6形成在电容器1中 汇流条相对部分6通过相对地设置形成在汇流条3中的内部延伸部分31并沿着壳体4中的侧壁40延伸并形成在母线中的外部延伸部分32 并且侧壁40在侧壁40之间延伸。 流经内延伸部31和外延伸部32的电流I的方向彼此相反。
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公开(公告)号：JP2012004358A
公开(公告)日：2012-01-05
申请号：JP2010138225
申请日：2010-06-17
Applicant: Denso Corp , 株式会社デンソー
Inventor： ICHIJO KOYO
IPC: H01L23/29
CPC classification number: H01L24/33 , H01L2924/13055 , H01L2924/13062 , H01L2924/13063 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor module mounting structure which can maintain cooling performance for a long term by preventing the outflow of grease and the ingression of foreign materials.SOLUTION: The semiconductor module mounting structure includes: a semiconductor module 10 which has a semiconductor chip 13, a resin encapsulation part 11 for encapsulating the semiconductor chip 13 with resin and a heat radiator plate 12 put in direct or indirect contact with the semiconductor chip 13 for releasing heat; a heat absorption member 30 for absorbing heat of the heat radiator plate 12; and thermally conductive grease 20 filled in between the heat radiator plate 12 and the heat absorption member 30. The semiconductor module mounting structure further includes a blocking part 40 for blocking the grease 20 from flowing out and a foreign material from entering from outside which is provided in both or one of the resin encapsulation part 11 and the heat absorption member 30. The blocking part 40 allows cooling performance to be kept for a long term.
Abstract translation: 要解决的问题：提供一种半导体模块安装结构，其可以通过防止润滑脂的流出和异物的侵入而长期保持冷却性能。 解决方案：半导体模块安装结构包括：半导体模块10，其具有半导体芯片13，用于将半导体芯片13用树脂封装的树脂封装部11和与该半导体芯片13直接或间接接触的散热板12 用于释放热量的半导体芯片13; 用于吸收散热板12的热量的吸热构件30; 以及填充在散热板12和吸热构件30之间的导热油脂20.半导体模块安装结构还包括用于阻止润滑脂20流出的阻挡部40和外部进入的异物， 在树脂封装部11和吸热构件30中的一个或两个中。阻挡部40允许长期保持冷却性能。 版权所有（C）2012，JPO＆INPIT
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