Abstract:
PROBLEM TO BE SOLVED: To provide a pattern inspection/measurement technique capable of providing an SEM image high in S/N and small in in-view shading by minimizing change of an optical condition of a primary electron beam or omission of a secondary signal due to generation of an electric field orthogonal to the traveling direction of a primary electron beam present on a wafer surface, and of executing measurement of dimension and shape with high accuracy and high repeatability for a measurement object, and measurement of a defect inspection or the like. SOLUTION: This pattern inspection/measurement device is structured such that a secondary signal converging lens 69 is installed at a position of the crossover in the traveling direction of the primary electron beam, or on a path of a separated secondary signal by causing the secondary signal to spatially separate the primary electron beam by a Wien filter 18. By providing a means changing the setting of the secondary signal converging lens 69 in response to an optical condition of the primary electron beam (for instance, a retarding voltage, a charge control electrode or the like), an SEM image always preventing occurrence of in-view shading caused by omission of a secondary signal can be provided. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a charged particle beam device having high resolution, and a wide scanning region (observational visual field). SOLUTION: A means to adjust a focus, a means 45 to adjust astigmatism, a means to control and detect a scanning position, and a means to simultaneously control focus adjustment and astigmatism adjustment are provided, and achieving high resolution and securing a wide range of the observational visual field are made compatible. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a scanning charged-particle microscope in which distortion of measurement, even of an insulator pattern, in the field of view can be suppressed by suppressing the impact of charging due to primary charged-particle beam irradiation during photographing, and suppressing change in the detection rate of secondary charged-particles.SOLUTION: In the scanning charged-particle microscope which forms the image of a scanning area by performing the scanning for the two-dimensional area on a specimen 8 so as to reverse the line scanning direction of a charged-particle beam 4 alternately, the distance between the scan lines of charged-particle beam 4 is adjusted based on the charging characteristics of the specimen 8 or the uniformity of lightness in the field of view of the specimen 8, when the specimen 8 is irradiated with the charged-particle beam 4.
Abstract:
PROBLEM TO BE SOLVED: To provide a charged particle beam device which prevents the effect of charging on the surface of a sample exposed to a primary charged particle beam when a plurality of frames are integrated to obtain an image of a given area on the sample. SOLUTION: A given area on a sample wafer 78 is scanned with a primary electron beam from an electron gun 70 to generate secondary electrons. As generated secondary electrons are detected by a detector 63, a plurality of frames are generated and integrated to obtain an image of the given area. In generating the plurality of frames, when a judgment is made based on a detection signal from the detector 63 that a volume of charges in the given area has reached a specified value, a neutralizing voltage is applied to a boosting electrode 77 to eliminate or reduce charges before generation of the next frame. Hence the effect of charging is reduced when each frame is generated, so that the S/N of the image obtained by integrating the frames can be improved. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an inspection and measuring device and an inspection and measuring method capable of measuring electrostatic charge potential of a test piece with high precision compared with a conventional technology and capable of measuring the charge potential with a simple structure. SOLUTION: With respect to a pattern inspection and measurement technology of such as a semiconductor device and a photomask using electron beam, fluctuations in charge potential on the surface of an inspecting test piece can be suppressed by optimizing the energy of a primary electron beam to be irradiated, when a S-shape curve is observed for the semiconductor device to become each inspection and measuring object. When the surface potential of the semiconductor device is measured by this device, more precise potential measurement than a conventional one becomes possible without almost affecting the original charge potential of an insulating film surface. Since the measurement of surface potential is possible without mounting a dedicated device for wafer surface potential measurement such as an energy filter, cost reduction of the device is also obtained. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To highly accurately estimate a shape and a dimension before shrink when measuring a length of resist to be shrunk by electron beam irradiation by CD-SEM.SOLUTION: A shrink database including pre-electron-beam-irradiation cross-sectional shape data, a cross-sectional shape data group and a CD-SEM image data group obtained under various electron beam irradiation conditions, and models based on them is prepared for various patterns, a CD-SEM image of a resist pattern to be measured is acquired (S102), the CD-SEM image and the shrink database are collated (S103), and the shape and the dimension before the shrink of the pattern to be measured are estimated and outputted (S104).
Abstract:
PROBLEM TO BE SOLVED: To provide a method of neutralizing a charged part, occurring in a region of a specimen irradiated with a charged particle beam, at high speed without mounting another device anew on a charged particle beam apparatus.SOLUTION: In a stage after irradiating a charged particle beam for measurement of a specimen before starting next measurement, a retarding voltage and/or an acceleration voltage is adjusted, and the operation is controlled so that neutralization is performed by reducing the difference between the value of the retarding voltage and the value of the acceleration voltage when compared with the difference during measurement. Since a charged part, occurring in a region of a specimen irradiated with a charged particle beam, can be neutralized without mounting another device on a charged particle beam apparatus, neutralization can be carried out without lowering the throughput.
Abstract:
PROBLEM TO BE SOLVED: To provide a measuring device or an inspection device using a charged particle beam, in which both of a high sensitivity and a high stability of inspection are achieved. SOLUTION: In the inspection and measurement device, a static controlling electrode B421 is arranged on a side of a measurement testpiece or an inspection testpiece of a static controlling electrode A420, and in accordance with a static status of the testpiece, a constant voltage is impressed from a static controlling electrode controlling portion 423 of the static controlling electrode B, and variations of the static condition of a surface of the testpiece which is formed before inspection and a potential barrier are controlled. A retarding potential is impressed by a static controlling electrode controlling portion 66, and the static controlling electrode B421 is arranged below the static controlling electrode A420 which is adjusted in a same potential with the testpiece, and, as a result, a returning volume of a secondary beam 409, emitted from the testpiece such as a wafer 9 or the like on which a primary electron beam 19 is irradiated, can be adjusted and a highly sensitive inspection condition can be maintained stably during inspection. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To realize a charged particle beam system having a function for measuring a local electric charge potential of a sample. SOLUTION: An image is acquired by scanning primary charged particle beams over the sample placed in a mirror state. It does not matter whether or not the acquired image is one of the sample or one of a component of a charged particle optical system. Locally charged potential is measured by comparing the acquired image with an image of the standard sample. COPYRIGHT: (C)2009,JPO&INPIT