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公开(公告)号：JP2001035882A
公开(公告)日：2001-02-09
申请号：JP36646199
申请日：1999-12-24
Applicant: DENSO CORP
Inventor： SONOBE TOSHIO , OGISO HOMARE , FUJII JUNPEI , SAITO ATSUSHI
IPC: H01L21/60
Abstract: PROBLEM TO BE SOLVED: To prevent deterioration of productivity, a thermal effect on another loaded component, generation of a void in a resin and unrepairable manufacturing drawback of a BGA/CSP(ball grid array or chip size package) in a mounting structure in which an electronic component is mounted on a substrate via a solder bump. SOLUTION: A resin sheet 5 obtained by sandwiching both sides of a cured thermosetting resin plate 51 with a pair of thermosetting resin films 52 is previously prepared, and the resin sheet 5 is interposed between a BGA/CSP 2 and a substrate 3. At the same time, reflowing and curing of a solder bump 1 are performed with the solder bump 1 brought into contact with a land portion 4. Subsequently, by heating and pressurizing the solder bump 1 at a lower temperature than the melting temperature of the solder bump 1, the solder bump 1 is crushed and each of both the thermosetting resin films 52 is bonded to the BGA/CSP 2 and the substrate 3.
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公开(公告)号：JP2001007503A
公开(公告)日：2001-01-12
申请号：JP17692499
申请日：1999-06-23
Applicant: DENSO CORP
Inventor： HIRAMATSU TOMOYUKI , OGISO HOMARE , SONOBE TOSHIO
Abstract: PROBLEM TO BE SOLVED: To provide a mounting method for a BGA(ball grid array) by junctioning via mutual electrodes on a printed circuit board and in which a life against thermal fatigue is effectively improved while the crushing of melted solder is suppressed. SOLUTION: In this mounting method, solder paste 50 is printed on electrodes 21 on a whole surface of a printed circuit board 20, thermosetting resin 41 is applied at the center excepting the electrode area. After that, a BGA 10 having a solder ball 14 on a surface is so mounted on the surface of the printed circuit board 20 as the electrodes 11 and 21 to contact via each solder 14 and 50. At the next process, the solder is melted, additionally the thermosetting resin is so semi-cured as displacement correction of the BGA 10 corresponding to the printed circuit board 20 and crushing suppression of the solder in the heightwise direction to be possible and coagulation of the solder and curing of the thermosetting resin 41 are subsequently performed.
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公开(公告)号：JP2001093925A
公开(公告)日：2001-04-06
申请号：JP27210499
申请日：1999-09-27
Applicant: DENSO CORP
Inventor： SAITO ATSUSHI , HIRAMATSU TOMOYUKI , OGISO HOMARE
Abstract: PROBLEM TO BE SOLVED: To provide an assembly method for an LSI package in which the LSI package can be easily and surely assembled on a printed circuit board while easily positioning. SOLUTION: This method comprises a step for providing an LSI package 1 having solder bumps 11 at the position of corresponding to the solder bumps 11, and a step for assembling on a printed circuit board 2 having electrode pads 21 which is covered with solder. This method comprises a supply step in which liquid heat hardened resin 3 is supplied on a bump surface 12 of the LSI package 1, a mounting step in which the LSI package 1 is mounted on the printed circuit board 2 by facing the bump surface downwards and by positioning, and a heating and melting step in which the solder bumps 11 and solder covering over the solder bumps 11 are melted and bonded. The heat hardened resin 3 is maintained in a liquid state until the solder bumps 11 is bonded with the electrode pads 21 at the heating and melting step.
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公开(公告)号：JP2000012574A
公开(公告)日：2000-01-14
申请号：JP17150498
申请日：1998-06-18
Applicant: DENSO CORP
Inventor： OGISO HOMARE , FUJII JUNPEI
IPC: H01L21/56
Abstract: PROBLEM TO BE SOLVED: To provide a testing method which tests certainly and readily a defoaming performance of a drip-proof material for preventing a wetness in electronic parts. SOLUTION: This testing method is performed by using the defoaming performance measuring device 100. A measuring part 1 composed of meshes having a plurality of measures is dipped in a material viscosity control part 4 provided with a container containing a drip-proof material 6 maintained at a specified viscosity, and is pulled up at a specified speed by a pull-up speed control part 2, whereby a film of the drip-proof material 6 is formed in the measures. Continuously, this film is dried and solidified in a hood 5 which is set at a specified wind velocity by a wind velocity control part 3, and after dried, the number of films remaining behind in the measures is counted, and the presence or absence of an defoaming performance is tested by many or few of the number of films remaining behind.
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Patent Agency Ranking
公开(公告)号：JPH09260815A
公开(公告)日：1997-10-03
申请号：JP6131696
申请日：1996-03-18
Applicant: DENSO CORP
Inventor： ISHIKAWA TOMONORI , OGISO HOMARE
Abstract: PROBLEM TO BE SOLVED: To produce an electronic parts-mounted semiconductor device, using an unwashed flux, without causing such trouble as voids and reduction of the insulation resistance. SOLUTION: Lands 2, 3 on a circuit board 1 are electrically and mechanically connected by solders 7, 8 to electrodes 5, 6 of electronic parts 4 covered with a sealing resin 9 serving as a drip proof on the upper face of the board l. The resin 9 is an acrylic resin. In production, the lands 2, 3 on the board 1 are soldered to the electrodes 5, 6 of the electronic parts 4, using an unwashed flux 10 to mount the parts 4 on the board 1 and the parts 4 are covered with a defoaming agent-added sealing resin 13.
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公开(公告)号：JP2004095842A
公开(公告)日：2004-03-25
申请号：JP2002254789
申请日：2002-08-30
Applicant: Denso Corp , 株式会社デンソー
Inventor： OBARA FUMIO , OGISO HOMARE
CPC classification number: H01L24/81 , H01L2224/16225
Abstract: PROBLEM TO BE SOLVED: To prevent air bubbles remaining locally in an reinforcing resin. SOLUTION: A substrate 20 has a plurality of substrate electrodes 24 and 24 corresponding to solder bumps arrayed in lattice on a CSP, on a surface 22 on the side for mounting the CSP. When the CSP is mounted at a position corresponding to the center of a square constituted of adjoining four substrate electrodes 24 and 24, a plurality of resin bonds 40 and 40 for reinforcement are applied thicker than the gap formed between the CSP and the substrate 20. When, under this condition, the CSP is mounted on the substrate so that the position of the solder bump disposed at the CSP agrees with that of the substrate electrodes 24 and 24, an escape route for air is assured between the solder bump and the resin bond 40 although the resin bonds 40 and 40 are spread by the CSP. So, the air within the space between the substrate 20 and the CSP escapes outside instead of confined by the resin bond 40. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2003011742A
公开(公告)日：2003-01-15
申请号：JP2001195366
申请日：2001-06-27
Applicant: Denso Corp , 株式会社デンソー
Inventor： OBARA FUMIO , OGISO HOMARE
Abstract: PROBLEM TO BE SOLVED: To provide a housing case of on-vehicle electronic equipment capable of suppressing attachment of condensation dew drops on a surface or the like of a print board 11 arranged in an inside of a case body 1 by effectively absorbing and eliminating both of moisture and condensation dew drops.
SOLUTION: Moisture absorbents 5, 7, 8 capable of absorbing both of the moisture in the air and droplets are provided, the moisture absorbents 5, 7, 8 are arranged in a periphery of the inside of the case body 1, and both of the moisture in the periphery of the inside of the case body 1 and the droplets which are generated by dew condensation in the periphery of the inside of the case body 1. That is, the moisture absorbents are arranged in the inside of a limited vent hole 3 as the periphery of the inside of the case body 1 and a part which covers an inner wall surface 1bb of the case body 1 in a proximal position of an opening 3b or the like. Thereby both of the moisture and condensation dew drops in the periphery of the inside of the case body 1 are effectively absorbed, and the attachment of the condensation dew drops on the print board 11 housed in the inside of the case body 1 and an electronic component 10 mounted on the print board 11 is suppressed.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：提供一种车载电子设备的外壳，能够通过有效地吸收和消除两者而抑制布置在壳体1的内部的印刷板11的表面等上的凝结露珠的附着 的水分和凝露露珠。 解决方案：提供能够吸收空气和液滴两者中的水分的吸湿剂5,7,8，吸湿剂5,7,8设置在壳体1的内部的周围，并且两者 在壳体1的内周的周围的水分和在壳体1的内部的周围产生的结露的液滴。也就是说，吸湿剂配置在有限通气孔3的内部 作为壳体1的内侧的周边，以及在开口部3b的近端位置等覆盖壳体1的内壁面1bb的部分。 由此，能够有效地吸收壳体1的内周侧的湿气和冷凝露水，并且，凝结露水附着在容纳在壳体1的内部的印刷基板11上，电子部件 10被安装在印刷基板11上。
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公开(公告)号：JP2001085823A
公开(公告)日：2001-03-30
申请号：JP26433299
申请日：1999-09-17
Applicant: DENSO CORP
Inventor： ISHIKAWA TOMONORI , OGISO HOMARE
Abstract: PROBLEM TO BE SOLVED: To provide a mounting structure which can simplify a resin applying process at securing of the moisture resistance of electronic components with resin by contriving the coexistence of the temperature cycle resistance and moisture resistance of the components. SOLUTION: In a mounting structure for electronic components, electronic components (BGA element) 1 and a mounting substrate 3 are electrically connected to each other via bumps 8 and the connections formed of the bumps 8 and the parts 1 are covered with a resin 10, in such a way tat the ratio of the occupying area of the resin 10 on an arbitrary cross section in the space formed between the parts 1 and substrate 3 is set at 2-80%. Since the packing quantity of the resin 10 is reduced, an air layer 11 is formed between the parts 1 and substrate 3, and the apparent elastic modulus of the resin 10 can be reduced. Consequently, both the temperature cycle resistance and moisture resistance of the parts 1 can be made compatible by using only one kind of the resin 10.
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公开(公告)号：JP2000340946A
公开(公告)日：2000-12-08
申请号：JP14716699
申请日：1999-05-26
Applicant: DENSO CORP
Inventor： OGISO HOMARE , FUJII JUNPEI
IPC: H05K3/34
Abstract: PROBLEM TO BE SOLVED: To quickly and reliably remove only an insulating drip-proof film remaining at portions from which electronic components have been removed without affecting other components thereabout, in a method of repairing a circuit board for replacing the electronic components which are sealed with the insulating drip-proof film thereon. SOLUTION: A partially dipping jig 6 having a frame part 6a is made to abut against a surface 1a of a circuit board 1 in a manner enclosing with the part 6a a mounting region from which an IC element 2 has been removed. Here, of the part 6a, an abutment part 6b which is abutted with the surface 1a of the board 1 is made of an elastic body. Then, a cleaning agent 8 is supplied to and stored in the hollow part of the part 6a, whereby an insulating drip-proof film 5 remaining at the mounting region is dissolved into the agent 8, and successively, the agent 8 is removed from the hollow part of the part 6a while maintaining the abutment state of the part 6b.
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