公开(公告)号：JPH09254575A

公开(公告)日：1997-09-30

申请号：JP9052296

申请日：1996-03-19

Applicant: DENSO CORP

Inventor： ECHIGO SUSUMU ,  SAITO ATSUSHI

IPC: B42D15/10 ,  G06K19/077 ,  H01L21/56 ,  H01L23/28

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic product which can prevent a particle-like curing agent from being separated from a protective resin and uniformly cure the entire resin with excellent adhesive state between a spacer and a cover. SOLUTION: A recess 100 is formed of a spacer 10 and a circuit board 11, and an electronic component 16 is mounted in the recess 100. Then, the protective resin 13 is filled in the recess 100, and a cover 12 is laminated on the upper surfaces of the spacer 10 and the recess 100 via an adhesive. The adhering between the spacer 10 and the cover 12 and curing of the resin 13 are simultaneously conducted. The resin 13 contains the particle-like curing agent 131, which contains 50wt.% or more of the agent having particle size of 10μm or less in the agent 131.

公开(公告)号：JP2001035882A

公开(公告)日：2001-02-09

申请号：JP36646199

申请日：1999-12-24

Applicant: DENSO CORP

Inventor： SONOBE TOSHIO ,  OGISO HOMARE ,  FUJII JUNPEI ,  SAITO ATSUSHI

IPC: H01L21/60

Abstract: PROBLEM TO BE SOLVED: To prevent deterioration of productivity, a thermal effect on another loaded component, generation of a void in a resin and unrepairable manufacturing drawback of a BGA/CSP(ball grid array or chip size package) in a mounting structure in which an electronic component is mounted on a substrate via a solder bump. SOLUTION: A resin sheet 5 obtained by sandwiching both sides of a cured thermosetting resin plate 51 with a pair of thermosetting resin films 52 is previously prepared, and the resin sheet 5 is interposed between a BGA/CSP 2 and a substrate 3. At the same time, reflowing and curing of a solder bump 1 are performed with the solder bump 1 brought into contact with a land portion 4. Subsequently, by heating and pressurizing the solder bump 1 at a lower temperature than the melting temperature of the solder bump 1, the solder bump 1 is crushed and each of both the thermosetting resin films 52 is bonded to the BGA/CSP 2 and the substrate 3.

公开(公告)号：JP2000268152A

公开(公告)日：2000-09-29

申请号：JP7589199

申请日：1999-03-19

Applicant: DENSO CORP

Inventor： SAITO ATSUSHI ,  NAKAKUKI KIYOSHI ,  KAMIYA KENJI

IPC: G06K19/077 ,  C09J5/06

Abstract: PROBLEM TO BE SOLVED: To eliminate the movement of an adhesive material and a reinforcing plate at the heating and hardening of the adhesive material even without sur rounding the periphery of the adhesive material in the case of adhering the reinforcing plate to a semiconductor chip by the adhesive material composed of thermosetting plastic. SOLUTION: The adhesive material 17 composed of a thermosetting resin is applied to a semiconductor chip 16, a reinforcing plate 18 is mounted on the adhesive material 17 and then, heating is performed by radiation heat from an electric heater 22 of an infrared ray heating furnace 21 for the time until at least temporarily hardening the adhesive material 17. By heating and hardening the adhesive material 17 by the radiation heat in such a manner, the influence of a wind is not received differently from the case of heating and hardening the adhesive material 17 by a hot blast furnace 23 from the beginning.

公开(公告)号：JP2000194815A

公开(公告)日：2000-07-14

申请号：JP36991498

申请日：1998-12-25

Applicant: DENSO CORP

Inventor： KAMIYA KENJI ,  SUGIURA MASAHIRO ,  NAKAKUKI KIYOSHI ,  SAITO ATSUSHI

IPC: G06K19/077

Abstract: PROBLEM TO BE SOLVED: To provide a reinforcing structure for expelling residual air to be the cause of weakening a reinforcing effect in the reinforcing structure of an IC chip mounting part to the utmost. SOLUTION: A groove part 11 provided in this reinforcing member 10 is oppositely arranged on the side of reinforcing resin 7. When the reinforcing member has no groove part 11 and has a smooth surface, in the case that a gap 20 is generated between the reinforcing member 10 and the reinforcing resin 7, when the gap 20 is not communicated with the outside at all, even though pressurizing is performed and the residual air is forced to be expelled to the outside, the reinforcing resin 7 of high viscosity hardly flows and the residual air is present. To the contrary, when the reinforcing member 10 is provided with the groove part 11, even when the reinforcing member 10 and the reinforcing resin 7 are tightly adhered at the part other than the groove part 11, the gap 20 is communicated with the outside at the groove part 11. Thus, even the reinforcing resin 7 of the high viscosity relatively easily flows, the residual air inside the gap 20 expelled through the groove part 11 to the outside and the possibility of eliminating the residual air becomes high as a result.

公开(公告)号：JPH09246300A

公开(公告)日：1997-09-19

申请号：JP5473396

申请日：1996-03-12

Applicant: DENSO CORP

Inventor： SAITO ATSUSHI ,  ECHIGO SUSUMU ,  KASUGAI HIROSHI

IPC: H01L23/28 ,  H01L21/56

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device having high reliability, which has a strong adhesive strength at the interface between laminated sealing resin layers. SOLUTION: A flip chip 4 is provided, with a cavity, on a circuit board 1. Liquid epoxy resin is injected into the cavity between the flip chip 4 and the circuit board 1, and the epoxy resin is heated for a 15 minutes or shorter until it is in a half-set state where 30% of the initial epoxy radical remains. Liquid epoxy resin 10 is extended over the entire flip chip 4 then heated for 2 hours, thus, both laminated resins are completely set. As a result, a lower-layer sealing resin 7 is formed at the cavity between the flip chip 4 and the circuit board 1, and the overall flip chip 4 is covered with an upper-layer sealing resin 8.

公开(公告)号：JP2001093925A

公开(公告)日：2001-04-06

申请号：JP27210499

申请日：1999-09-27

Applicant: DENSO CORP

Inventor： SAITO ATSUSHI ,  HIRAMATSU TOMOYUKI ,  OGISO HOMARE

IPC: H01L21/60 ,  H01L21/56

Abstract: PROBLEM TO BE SOLVED: To provide an assembly method for an LSI package in which the LSI package can be easily and surely assembled on a printed circuit board while easily positioning. SOLUTION: This method comprises a step for providing an LSI package 1 having solder bumps 11 at the position of corresponding to the solder bumps 11, and a step for assembling on a printed circuit board 2 having electrode pads 21 which is covered with solder. This method comprises a supply step in which liquid heat hardened resin 3 is supplied on a bump surface 12 of the LSI package 1, a mounting step in which the LSI package 1 is mounted on the printed circuit board 2 by facing the bump surface downwards and by positioning, and a heating and melting step in which the solder bumps 11 and solder covering over the solder bumps 11 are melted and bonded. The heat hardened resin 3 is maintained in a liquid state until the solder bumps 11 is bonded with the electrode pads 21 at the heating and melting step.

公开(公告)号：JPH10107182A

公开(公告)日：1998-04-24

申请号：JP27747096

申请日：1996-09-26

Applicant: DENSO CORP

Inventor： SAITO ATSUSHI

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

Abstract: PROBLEM TO BE SOLVED: To suppress cracks and improve reliability by reducing stress generated to sealing resin. SOLUTION: An electrode 11 formed on an alumina board 1 and a semiconductor chip 3 are electrically connected through solder bumps 2, and a space between the board and the semiconductor chip 3 is filled with sealing resin 4. Thermal stress is reduced and cracks are suppressed by making the average ratio of (a/b) at 2 or less where, (b) is a height of a sealing resin periphery part 41 from the bottom edge plane of the semiconductor chip 3, and (a) is a distance between the outer circumference edge of a circumference part 41 within the same flat plane as the bottom edge plane of the semiconductor chip 3 and the bottom edge of the semiconductor chip 3.