Abstract:
PROBLEM TO BE SOLVED: To provide an electron beam application device capable of achieving charge control without reducing a throughput while maintaining good convergence of a primary beam for inspection. SOLUTION: A plurality of primary beams are formed from a single electron source, and charge of a sample is controlled by at least one primary beam, and at the same time, inspection of the sample is conducted by using another primary beam. Furthermore, surface electric field intensity is set independently on an irradiation region of the primary beam for charge control and an irradiation region of the primary beam for inspection. A current of the primary beam for charge control, and an interval between the primary beam of the charge control and the primary beam for inspection are controlled. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a charged particle beam apparatus for preventing a charged particle beam from deteriorating by preventing aberration of a convergent charged particle lens from getting worse due to a fact that an optical axis of the charged particle beam toward a sample from a first deflection means and a second deflection means, and toward a charged particle source from the lens is not kept parallel to an optical axis of the lens, and to provide an exposure apparatus, and a device manufacturing method using the exposure apparatus. SOLUTION: The charged particle beam apparatus includes a shielding plate having an aperture for permitting a charged particle beam 10 deflected by the first deflection means and deflected by the second deflection means to pass, and charged particles lenses 7 and 8 for converging the charged particle beam passing through the shielding plate to be irradiated onto the sample. The optical axis of the charged particle beam toward the sample from the first and second deflection means and toward the charged particle source from the lens is kept parallel to the optical axis of the lens. Thus, deterioration of the charged particle beam is prevented by preventing the aberration of the convergent charged particle lens from getting worse due to a fact that the optical axis is not kept parallel to the optical axis of the convergent charged particle lens. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a technique for facilitating the position adjustment of a crossover and improving the throughput of a device in the charged particle beam application device, such as an electron beam drawing device. SOLUTION: A sharp end face (a crossover prescription edge 208) for prescribing the height of a crossover 104 on a beam axis is provided on the front focal surface of a condenser lens 107. By measuring the shape of electron beams using the crossover prescription edge 208, the shape of beams on the front focal surface of the condenser lens 107 can be confirmed continuously even if the height of the crossover 104 formed by an electron gun and the resistance of a light source formation lens 105 change. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To improve the positional accuracy of a circuit pattern drawn on a wafer by dynamically detecting the potential of the wafer through a drawing time and by correcting the potential. SOLUTION: Contact resistance generated by a wafer 101 (sample) and an earth pin 107 (contact terminal) is measured, and then an electric current flowing to the earth potential from the wafer 101 (sample) via the earth pin 107 (contact terminal) is measured. On the basis of the measurement result, a potential difference is given between the wafer 101 (sample) and the earth potential. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To detect a metal foreign substance mixed in an object to be inspected which is a sheet-like magnetic material at high speed and with high accuracy.SOLUTION: The present invention relates to an inspection system 1a which inspects whether or not the metal foreign substance is mixed in a material 111 to be inspected which is the sheet-like magnetic material, the material 111 to be inspected with a possibility of containing the metal foreign substance is magnetized, after that, a magnetic field with intensity for canceling magnetization of the material 111 to be inspected is applied to the material 111 to be inspected, difference processing is performed to magnetic signals detected by a plurality of magnetic sensors 130 to determine whether or not the metal foreign substance is mixed in the material 111 to be inspected based on a result of the difference processing.
Abstract:
PROBLEM TO BE SOLVED: To set a retarding voltage to be an appropriate value by accurately estimating a potential distribution of a wafer due to electrostatic charge. SOLUTION: A potential at a plurality of points along the diameter of a semiconductor wafer 13 is actually measured. The electric potential between actually-measured points adjoining each other in radial direction is spline-interpolated, to acquire a potential distribution across the diameter. Then, the electric potential between the points adjoining in circumferential direction with the center of the semiconductor wafer 13 as a center is spline-interpolated, to acquire a two-dimensional interpolation function about the potential distribution in the semiconductor wafer 13. Then, a coordinate value of a measurement point on the semiconductor wafer is assigned to the two-dimensional interpolation function to acquire the potential at the measurement point. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a charged particle beam application device, capable of attaining both reduction of off-axis aberrations and separation detection of secondary beams. SOLUTION: The charged particle beam application device, provided with an electro-optical system forming a plurality of primary charged particle beams, projecting them on a sample 117, and scanning them on a sample by a first deflector 115; a plurality of detectors 124a, 124b, 124c individually detecting a plurality of secondary charged particle beams 120, generated from a plurality of places of the sample due to irradiation of the plurality of primary charged particle beams; and a power source impressing voltage on the sample, is further provided with a Wien filter, separating the path of the primary charged particle beams from that of the secondary charged particle beams, a second deflector 123 deflecting the secondary charged particle beams separated by the Wien filter 113, and a control means for controlling the synchronization of the first deflector and the second deflector. The plurality of detectors individually detect the plurality of charged particle beams separated by the Wien filter. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a deflector for exposing a wafer precisely by reducing the impact of a charged particle beam on the insulating film of a deflector, and to provide a charged particle beam aligner having the deflector and a process for fabricating a device using that charged particle beam aligner. SOLUTION: The deflector of a charged particle beam aligner comprises an opening formed in a substrate and passing a charged particle beam, at least two electrodes arranged oppositely to each other around the opening, and an insulating film interposed between the substrate and the electrode in order to insulate them electrically. Since a potential applied to the electrode is controlled on the basis of the charging potential by a charged particle beam on the insulating film and the charged particle beam is deflected, impact of the charged particle beam on the insulating film of the deflector is reduced and a wafer is exposed precisely. A charged particle beam aligner having that deflector and a process for fabricating a device using that charged particle beam aligner are also provided. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To fabricate a high precision device while reducing optical aberration without requiring a complex mechanism. SOLUTION: The electrostatic lens comprises a plurality of electrode substrates 401-403 each having openings arranged in a plane perpendicular to the optical axis, and marks 404-406 for defining a direction dependent on the arrangement of the openings wherein the plurality of electrode substrates are assembled based on the direction defined by the marks 404-406. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide charged-particle-beam lithography technology for permitting drawing process without changing a multi-beam forming element and without deteriorating a drawing accuracy, even when electron beam having fault in characteristics thereof by the fault of the multi-beam forming element is generated. SOLUTION: The charged-particle-beam lithography system is provided with a plurality of charged-particle-beam forming means (101, 102, 103) arrayed with a predetermined interval; a plurality of blankers (107) acting on a plurality of charged-particle-beams individually; a common blanker (201) acting on all of the charged-particle-beams; and a blanking choke making the charged-particle-beam arrive and is provided with a predetermined deviation action by a plurality of blankers (107) on a specimen and intercepting the charged-particle-beam, which is not provided with the predetermined deviation action by the plurality of blankers (107) with respect to a sample, under a status with a signal not being impressed on the common blanker (201), to intercept a beam having faulty characteristics with respect to the sample and effect lithography employing only the beam having proper characteristics. COPYRIGHT: (C)2005,JPO&NCIPI