Abstract:
PROBLEM TO BE SOLVED: To provide a charged particle beam apparatus in which a driving part has high stability and reliability by preventing a lubricant applied to a slide portion from being used up before maintenance of the apparatus. SOLUTION: The charged particle beam apparatus has the lubricant applied to the slide portion of a moving member moving in a vacuum chamber, wherein the lubricant satisfies the followings. (1) A cumulative slide time (induction time) for starting decomposition reaction of the lubricant in a depressed state is ≥140 hours. (2) Depression (critical surface pressure) which causes decomposition reaction of the lubricant is ≥0.5 GPa. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for efficiently cleaning a desired cleaning spot on the inner surface of a vacuum device without giving damage to the inner surface of a vacuum chamber nor heating resin components disposed outside the vacuum chamber more than required, with respect to the vacuum device represented by an electron microscope. SOLUTION: The desired cleaning spot on the inner surface of the device is irradiated with an infrared ray with a wavelength of 6-8 μm. Energy is given to an organic substance molecule desired to be dissociated by heating, and cleaning which suppresses the heating of the wall surface of the device to the minimum becomes possible thereby. As a result, a cleaning speed increases, and the throughput of the device can be improved. The vacuum chamber can be cleaned without giving damage to a resin material disposed outside the vacuum chamber. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide cleaning liquid which can remove metallic contaminants stuck to a surface and the like without damaging a ground silicon surface. SOLUTION: Cleaning liquid whose composition is displayed by wt. % and in which hydrogen fluoride: nitric acid:surface-active agent are in a range of 0.1 to 7.1:60.0 to 69.8:0.3 to 2 or cleaning liquid in which hydrogen fluoride:nitric acid:acetic acid are in the range of 0.4 to 0.5:30.0 to 60.0:19.0 to 55.0 suppresses face roughness of the silicon surface. Metallic materials on the silicon surface, a rear face and a bevel part can remarkably effectively be removed. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method for separating and recovering lithium, cobalt and the like in a high yield, which method can be operated via simple steps inexpensively, by utilizing a minimum amount of acid or alkali.SOLUTION: Provided is a method comprising vacuum firing, grinding, sieving, and having water apply for extraction of the thus-sieved product, thereby having lithium selectively leaching out. When lithium is separated from iron or aluminum eluted out in a trace amount, after leaching out of lithium with water, a solvent extraction is carried out with addition of a complex-forming agent thereto. Desirably, an oil phase obtained by the solvent extraction is further subjected, for example, by using a solution containing a lithium compound in a high concentration, to crystallization and separation, under conditions in which the crystallization of the lithium compound is proceeded with the separation. Further, an acid is applied to the residue from which lithium is leached out by water, to have cobalt selectively leach out.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for peeling a plated coating film from a magnet surface where the load of waste liquid treatment and the like is small, which can be performed in a simple facility, where the oxidation of a metal can be prevented, where impurities are not remained on a metal surface and which is safe.SOLUTION: Cavitation jet is spouted in water toward a magnet coated by plating. Shock waves are generated when generated cavitation collapses on the surface of the magnet coated by plating. A plated coating film is peeled by generating shear force between the plated coating film and the base magnet due to stress generated by the shock waves in the plated coating film.
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing slurry for polishing a platinum-base metal film with CMP method and to provide a manufacturing method having high electrical reliability, for a semiconductor device having a lower electrode consisting of the platinum-base metal film. SOLUTION: An SiO 2 film 13 is formed on an insulating film embedded with plugs 11. Then, holes (openings) 14 are formed in the SiO 2 film 13, followed by forming an Ru film 15 which is the platinum-base metal film in the holes 14 and on the SiO 2 film. The resultant is polished by CMP method using the polishing slurry comprising periodic acid, benzotriazole and abrasive grain to form lower electrodes consisting of the platinum-base metal film inside the openings. Thereafter, a dielectric film and a film serving as upper electrodes are sequentially formed. Since polished surfaces of the lower electrodes are remarkably flat and smooth, leakage current that flows through the dielectric film is suppressed to remarkably improve retention characteristics for information charges which are stored in a capacitor. Thus, time for retaining the stored information charges is increased, which in turn ensures high reliability in the capacitor. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To ensure satisfactory continuity of the lower-part electrode of a capacitive element for information storage to a plug. SOLUTION: The surface layer of a silicon oxide film 37 including the inside of a groove 38 is spin-coated with a solution containing Ru as a main composition, it is dried at about 600 to 700 deg.C, a seed layer 39 constituted of the Ru is formed, and an Ru film is deposited by a CVD method while the seed layer 39 is used as a seed. By the seed layer 39 formed on the inside wall of the groove 38, the incubation time is shortened when the Ru film is formed by the CVD method, the surface of the plug 35 is hardly exposed to oxygen, and the continuity of the Ru film to the plug 35 can be ensured.
Abstract:
PROBLEM TO BE SOLVED: To protect electrodes or wirings formed of high-melting metal nitride against etching at cleaning after the electrodes or wirings are formed in the manufacture of a semiconductor device provided with the electrodes or wirings formed of high-melting metal nitride. SOLUTION: A semiconductor device manufacturing method comprises a first process of forming conductor films that contain high-melting point nitride films on a semiconductor substrate, a second process of patterning the conductor films into required forms, and a third process of cleaning the patterned conductor films. A cleaning solution used in the third process of cleaning the patterned conductor films is a mixed solution of quaternary ammonium hydroxide represented by general formula, [(R1)nN(R)4-n]+OH- (R1 is a 1-2C alkyl group, R is a 1-2C alkyl group or a 1-2C hydroxy-substituted alkyl group, and R1 and R may be identical to each other or different from each other. n is an integer of 1 to 3), a hydrogen peroxide solution, and pure water.
Abstract:
PROBLEM TO BE SOLVED: To provide a technique of specifying the position of a microscopic defect in an insulating film with high accuracy. SOLUTION: An insulating film and Pt electrodes which are electrically connected with a silicon substrate are dipped in an Na2Au(SO3)2 electrolyte, a pulse voltage is applied between the silicon substrate, and the Pt electrodes and Au particles of a diameter of 10 nm or shorter are precipitated on a defect in the insulating film.