Cooling device for heat treatment equipment and manufacturing method therefor
    1.
    发明专利
    Cooling device for heat treatment equipment and manufacturing method therefor 有权
    用于热处理设备的冷却装置及其制造方法

    公开(公告)号:JP2008153505A

    公开(公告)日:2008-07-03

    申请号:JP2006341225

    申请日:2006-12-19

    Abstract: PROBLEM TO BE SOLVED: To provide a cooling device wherein the jointing rate for a brazing part is high, its manufacturing method, and heat treatment equipment provided with the cooling device, in the heat treatment equipment provided with the cooling device for which a cooling pipe is wound helically and brazed to a treatment vessel outer peripheral sidewall surface.
    SOLUTION: The cooling device 40 is provided with a cooling pipe 34 helically wound and brazed to the outer peripheral sidewall of a tube 31, and the cooling pipe 34 is such that the respective inner surfaces and the outer surfaces of a second part 34c, close to the outer peripheral sidewall of the tube 31 and a first part 34a facing the second part 34c, are curved toward the outside direction of the cooling pipe 34, and the curvature of the second part 34c becomes smaller than the curvature of the first part 34a.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题:为了提供一种其中钎焊部件的接合速率高的冷却装置,其制造方法和设置有冷却装置的热处理设备,在具有冷却装置的热处理设备中, 将冷却管螺旋地卷绕并钎焊到处理容器外周侧壁表面。 解决方案:冷却装置40设置有螺旋形地缠绕并钎焊到管31的外周侧壁的冷却管34,并且冷却管34使得相应的内表面和第二部分的外表面 34c,靠近管31的外周侧壁和面向第二部分34c的第一部分34a朝向冷却管34的外侧方向弯曲,并且第二部分34c的曲率变得小于 第一部分34a。 版权所有(C)2008,JPO&INPIT

    Stack structure of flat solid oxide fuel cell
    2.
    发明专利
    Stack structure of flat solid oxide fuel cell 有权
    平面固体氧化物燃料电池堆积结构

    公开(公告)号:JP2007026925A

    公开(公告)日:2007-02-01

    申请号:JP2005208312

    申请日:2005-07-19

    CPC classification number: Y02E60/525

    Abstract: PROBLEM TO BE SOLVED: To provide a stack structure of a flat solid oxide fuel cell capable of supplying a gas to the whole face of an electrode by distributing nearly equally, and capable of improving power generation efficiency. SOLUTION: The stack 1 is formed by alternately laminating a plurality of flat type unit cells 2 and separators 3 and combining them integrally and electrically connecting. The separator 3 is constructed of a laminated center plate 10, fuel electrode side plate 11, and air electrode side plate 12. A fuel gas supply passage 17 is provided on the surface of the center plate 10 and a plurality of fuel gas injection through holes 45 which are respectively communicated with the fuel gas supply passage 17 are provided at the fuel electrode side plate 11. An oxidizer gas supply passage 31 is provided on the rear face of the center plate 11, and a plurality of oxidizer gas injection through holes 52 which are respectively communicated with the oxidizer gas supply passage 31 are provided at the air electrode side plate 12. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种能够通过几乎相等地分布地向电极的整个面供给气体并能够提高发电效率的平坦的固体氧化物型燃料电池的堆叠结构。 解决方案:堆叠1通过交替层叠多个扁平型单元电池2和隔板3并将其组合并电连接而形成。 隔板3由层叠中心板10,燃料电极侧板11和空气电极侧板12构成。燃料气体供给通路17设置在中心板10的表面上,多个燃料气体注入通孔 分别与燃料气体供给路17连通的燃料气体供给路径45设置在燃料电极侧板11上。在中心板11的背面设有氧化剂气体供给路31,多个氧化剂气体注入通孔52 分别与氧化剂气体供给通道31连通的空气电极侧板12设置在空气电极侧板12上。(C)2007,JPO&INPIT

    Heat exchanger and vertical heat treatment equipment
    3.
    发明专利
    Heat exchanger and vertical heat treatment equipment 有权
    热交换器和垂直热处理设备

    公开(公告)号:JP2008235853A

    公开(公告)日:2008-10-02

    申请号:JP2007299061

    申请日:2007-11-19

    Abstract: PROBLEM TO BE SOLVED: To provide a heat exchanger and heat treatment equipment capable of preventing water leakage from a core caused by the fatigue breakdown of the core and improving durability.
    SOLUTION: The heat exchanger 21 having the core 23 where air channels and cooling water channels are formed alternately by laminating corrugated sheets 22, water pipe jointing sections 25a, 25b that connect water cooling pipes allowing cooling water to flow into the cooling water channels of the core 23, and a case 27 having exhaust pipe jointing sections 26a, 26b that accommodate the core 23 and connect an exhaust pipe 18 allowing the air to flow into the air channels, wherein the core 23 is movably provided in the case 27 to absorb a thermal expansion difference between the core 23 and case 27.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种能够防止由于芯的疲劳破坏而引起的芯漏水的热交换器和热处理设备,并提高耐久性。 解决方案:具有芯23的热交换器21,其中空气通道和冷却水通道交替地通过层压波纹板22,水管接合部分25a,25b,水管接合部分25a,25b连接允许冷却水流入冷却水的水冷却管 芯23的通道和具有容纳芯23的排气管接合部26a,26b的壳体27,并且连接允许空气流入空气通道的排气管18,其中,芯23可移动地设置在壳体27中 以吸收芯23和壳体27之间的热膨胀差异。版权所有:(C)2009,JPO&INPIT

    Electrostatic attraction holder and substrate treatment device
    4.
    发明专利
    Electrostatic attraction holder and substrate treatment device 有权
    静电吸引支架和基板处理装置

    公开(公告)号:JP2003309168A

    公开(公告)日:2003-10-31

    申请号:JP2002113563

    申请日:2002-04-16

    CPC classification number: B25B11/002 Y10T279/23

    Abstract: PROBLEM TO BE SOLVED: To provide an electrostatic attraction holder of excellent performance suppressing the deformation and position deviation of a substrate. SOLUTION: A dielectric plate 42 is dielectrically polarized by a voltage applied to an attraction electrode 43, and a planar object 9 is electrostatically attracted and held on a surface. A mitigation layer 44 having a thermal expansion coefficient of an intermediate between those of the dielectric plate 42 and the attraction electrode 43 is provided between the dielectric plate 42 and the attraction electrode 43, and a coating layer 45 similarly having the thermal expansion coefficient is provided on the side opposite to the dielectric plate 42 of the attraction electrode 43. The dielectric plate 42 is composed of magnesia and the attraction electrode 43 is composed of aluminum. The mitigation layer 44 and the coating layer 45 are composed of the composite material of aluminum and ceramics. The dielectric plate 42 and the mitigation layer 44 are brazed with a brazing filler metal whose main component is aluminum. A substrate treatment device holds the substrate 9 by the electrostatic attraction holder and performs treatment. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题:提供一种具有优异性能的抑制基板的变形和位置偏移的静电吸引保持器。 解决方案:电介质板42通过施加到吸引电极43的电压进行介电极化,并且平面物体9被静电吸引并保持在表面上。 在电介质板42和吸引电极43之间设置具有介电板42和吸引电极43之间的中间热膨胀系数的缓和层44,并且提供类似地具有热膨胀系数的涂层45 在吸电极43的电介质板42的相反侧。电介质板42由氧化镁构成,吸引电极43由铝构成。 缓和层44和涂层45由铝和陶瓷的复合材料构成。 电介质板42和缓解层44用主要成分为铝的钎料钎焊。 基板处理装置通过静电吸引保持器保持基板9,进行处理。 版权所有(C)2004,JPO

    Cooling device and method for manufacturing the same
    5.
    发明专利
    Cooling device and method for manufacturing the same 审中-公开
    冷却装置及其制造方法

    公开(公告)号:JP2013038183A

    公开(公告)日:2013-02-21

    申请号:JP2011172148

    申请日:2011-08-05

    CPC classification number: H01L23/36 H01L23/3736 H01L2924/0002 H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a cooling device capable of achieving high mechanical strength of an attaching part for attaching the cooling device to a module and good thermal conductivity of the cooling device, and a method for manufacturing the same.SOLUTION: A cooling device 1 comprises: a cooling member 11 in which a flow channel 11a for a heat medium is provided on a member made of aluminium and aluminium alloy; a plate-like member 12 made of aluminium alloy and arranged on a plate-like member arrangement plane 11b of a cooling member 11 so as to expose a part of the cooling member 11; and a heat conduction layer 13 formed by accelerating powders of copper or copper alloy with gas toward an exposed part 11c where a part of a cooling member 12 is exposed from the plate-like member 12 and a surface of the plate-like member 12 around it and spraying and depositing the powders in a solid phase state.

    Abstract translation: 要解决的问题:提供一种能够实现用于将冷却装置连接到模块的安装部件和冷却装置的良好导热性的高机械强度的冷却装置及其制造方法。 解决方案:冷却装置1包括:冷却构件11,其中用于热介质的流路11a设置在由铝和铝合金制成的构件上; 由铝合金制成的板状构件12,其布置在冷却构件11的板状构件布置平面11b上,以暴露冷却构件11的一部分; 以及通过将气体的铜或铜合金的粉末朝着暴露部分11c加热而形成的导热层13,其中冷却部件12的一部分从板状部件12露出,并且板状部件12的表面围绕 并将粉末喷雾并沉积在固相状态。 版权所有(C)2013,JPO&INPIT

    Conductive member and method of manufacturing the same
    6.
    发明专利
    Conductive member and method of manufacturing the same 有权
    导电构件及其制造方法

    公开(公告)号:JP2011233273A

    公开(公告)日:2011-11-17

    申请号:JP2010100356

    申请日:2010-04-23

    Inventor: KAYAMOTO TAKASHI

    Abstract: PROBLEM TO BE SOLVED: To provide a conductive member that can be connected to aluminum-based metal and suppress reduction in electric conductivity, and a method of manufacturing the conductive member.SOLUTION: A conductive member has a wire connection portion 101 and a fastening portion 102 each serving as a base material which is formed of aluminum (Al) or alloy containing aluminum and has a connection surface to be connected to another member, and a connection layer 103 formed on the base material. The connection layer 103 is formed as follows: powder of metal or alloy which is smaller in ionization tendency and equal to or higher in electric conductivity than the base material is accelerated together with gas, and sprayed and deposited onto the connection surface under a solid-phase state.

    Abstract translation: 要解决的问题:提供可连接到铝基金属并抑制电导率降低的导电部件,以及制造导电部件的方法。 导电构件具有导线连接部分101和紧固部分102,它们各自用作由铝(Al)或铝合金形成的基体材料,并且具有要连接到另一部件的连接表面,以及 形成在基材上的连接层103。 连接层103如下形成:离子化倾向小于等于或高于基底材料的电导率的金属或合金的粉末与气体一起加速,并在固体 - 相态。 版权所有(C)2012,JPO&INPIT

    ELECTROSTATIC CHUCK
    7.
    发明专利

    公开(公告)号:JP2001308167A

    公开(公告)日:2001-11-02

    申请号:JP2000127810

    申请日:2000-04-27

    Abstract: PROBLEM TO BE SOLVED: To provide an electrostatic chuck which exhibits a high corrosion resistance and a small difference of coefficient of expansion between the chuck body and metallic members. SOLUTION: With respect to the electrostatic chuck 10 which has a chuck body 21 having an attracting surface 20 for attracting a semiconductor wafer 11 by static electricity and an electrode 22 for applying a voltage to the attracting surface 20, the chuck body 21 is formed of ceramics 21a mainly constituted by MgO. At least one type of additives selected from TiC, TiO2, ZrO2, V2O2, Nb2O2, Ta2O5, Co3O4, Cr2O3 and NiO is added to the ceramics 21a in such a way that the electric resistivity in the service temperature range is 1×108-1×1012 Ω.cm. Since the electrostatic chuck 10 using the ceramics 21a exhibits a high corrosion resistance even in a corrosive atmosphere such as fluoride plasma, it is suitably used for a manufacture process of semiconductor devices or the like.

    MATERIAL FOR PRECISION MECHANICAL EQUIPMENT PART AND SUPPORT MEMBER FOR MAGNETIC DISK SUBSTRATE USING THE SAME

    公开(公告)号:JPH11228224A

    公开(公告)日:1999-08-24

    申请号:JP2301898

    申请日:1998-02-04

    Abstract: PROBLEM TO BE SOLVED: To obtain a lightweight material easy in precision machining, resistant to abrasion, and affording precision mobile mechanical equipment parts having such electroconductivity as to enable static electricity developing when set in operation to be removed. SOLUTION: This material is obtained by incorporating an oxide ceramic with either combination, i.e., tin oxide plus antimony or tin oxide plus antimony oxide, so as to secure electroconductivity; thereby this material can be afforded with such electroconductivity as to enable static electricity developing when set in operation to be removed as well as advantages inherent in ceramics, i.e., easiness of precision machining, lightweightness, and abrasions resistance; therefore, use of this material in precision mobile mechanical equipment parts can easily afford the aimed lightweight parts of high mechanical strength enabling themselves to be subjected to precision machining and prevented from electrification. In particular, use of this material as a support material 1a for magnetic disk substrates can prevent noise generation in the readout or writing of information and improve the reliability of magnetic disk devices.

    ELECTROSTATIC CHUCK
    9.
    发明专利

    公开(公告)号:JPH1041377A

    公开(公告)日:1998-02-13

    申请号:JP20936296

    申请日:1996-07-22

    Abstract: PROBLEM TO BE SOLVED: To provide an electrostatic chuck which has high heat transfer efficiency and has excellent strength and durability. SOLUTION: Between a lower insulating layer 6 of an electrostatic chuck 5 and a base member 1, damper layer 2-4 are formed which are made of a composite material wherein the ratio of an addition agent to matrix metal varies in such a way that the coefficient of thermal expansion may become gradually higher from the lower insulating layer 6 side toward the base member 1 side in a specified range between the coefficient of thermal expansion of the lower insulating layer 6 and that of the base member 1. By forming the damper layers 2-4, the difference in coefficient of thermal expansion between the lower insulating layer 6 and the base member 1 is absorbed well and the appearance of thermal stress can be prevented and thereby the strength and the durability of the device are increased. Especially, by brazing the electrostatic chuck 5 on the base member 1 or stacking the lower insulating layer 6, an electrode layer 7, and an upper insulating layer 8 on the base member 1 by flame coating or evaporation, the heat transfer efficiency between the layer is increased and thereby the cooling/heating efficiency of an object to be chucked such as a wafer is increased.

    HEAT RADIATING MEMBER FOR SEMICONDUCTOR DEVICE

    公开(公告)号:JPH0964254A

    公开(公告)日:1997-03-07

    申请号:JP24254495

    申请日:1995-08-28

    Abstract: PROBLEM TO BE SOLVED: To raise time thermal conductivity by using metal compound material containing carbon fibers of a specific length in a specific range of volume, and having a thermal expansion coefficient being in a specific range by their reaction with a metal component. SOLUTION: Metal compound material contains fibers of lengths of 40μm or less and a metal component composed of either Cu or Al, and has a thermal expansion coefficient of 5×10 -10×10 . Especially, reactivity of the metal component with the carbon fibers can be enhanced, by adding 0.3-5wt.% of at least one kind of metal out of Ti, Zr, Cr, and Si to the metal compound material. Besides, sinterability can be enhanced by adding 0.3-8wt.% of at least one kind of metal different from the metal component out of Si, Ag, Sn, P, Al, and Cu to the metal compound material.

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