Abstract:
PROBLEM TO BE SOLVED: To provide a cooling device wherein the jointing rate for a brazing part is high, its manufacturing method, and heat treatment equipment provided with the cooling device, in the heat treatment equipment provided with the cooling device for which a cooling pipe is wound helically and brazed to a treatment vessel outer peripheral sidewall surface. SOLUTION: The cooling device 40 is provided with a cooling pipe 34 helically wound and brazed to the outer peripheral sidewall of a tube 31, and the cooling pipe 34 is such that the respective inner surfaces and the outer surfaces of a second part 34c, close to the outer peripheral sidewall of the tube 31 and a first part 34a facing the second part 34c, are curved toward the outside direction of the cooling pipe 34, and the curvature of the second part 34c becomes smaller than the curvature of the first part 34a. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a stack structure of a flat solid oxide fuel cell capable of supplying a gas to the whole face of an electrode by distributing nearly equally, and capable of improving power generation efficiency. SOLUTION: The stack 1 is formed by alternately laminating a plurality of flat type unit cells 2 and separators 3 and combining them integrally and electrically connecting. The separator 3 is constructed of a laminated center plate 10, fuel electrode side plate 11, and air electrode side plate 12. A fuel gas supply passage 17 is provided on the surface of the center plate 10 and a plurality of fuel gas injection through holes 45 which are respectively communicated with the fuel gas supply passage 17 are provided at the fuel electrode side plate 11. An oxidizer gas supply passage 31 is provided on the rear face of the center plate 11, and a plurality of oxidizer gas injection through holes 52 which are respectively communicated with the oxidizer gas supply passage 31 are provided at the air electrode side plate 12. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a heat exchanger and heat treatment equipment capable of preventing water leakage from a core caused by the fatigue breakdown of the core and improving durability. SOLUTION: The heat exchanger 21 having the core 23 where air channels and cooling water channels are formed alternately by laminating corrugated sheets 22, water pipe jointing sections 25a, 25b that connect water cooling pipes allowing cooling water to flow into the cooling water channels of the core 23, and a case 27 having exhaust pipe jointing sections 26a, 26b that accommodate the core 23 and connect an exhaust pipe 18 allowing the air to flow into the air channels, wherein the core 23 is movably provided in the case 27 to absorb a thermal expansion difference between the core 23 and case 27. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electrostatic attraction holder of excellent performance suppressing the deformation and position deviation of a substrate. SOLUTION: A dielectric plate 42 is dielectrically polarized by a voltage applied to an attraction electrode 43, and a planar object 9 is electrostatically attracted and held on a surface. A mitigation layer 44 having a thermal expansion coefficient of an intermediate between those of the dielectric plate 42 and the attraction electrode 43 is provided between the dielectric plate 42 and the attraction electrode 43, and a coating layer 45 similarly having the thermal expansion coefficient is provided on the side opposite to the dielectric plate 42 of the attraction electrode 43. The dielectric plate 42 is composed of magnesia and the attraction electrode 43 is composed of aluminum. The mitigation layer 44 and the coating layer 45 are composed of the composite material of aluminum and ceramics. The dielectric plate 42 and the mitigation layer 44 are brazed with a brazing filler metal whose main component is aluminum. A substrate treatment device holds the substrate 9 by the electrostatic attraction holder and performs treatment. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a cooling device capable of achieving high mechanical strength of an attaching part for attaching the cooling device to a module and good thermal conductivity of the cooling device, and a method for manufacturing the same.SOLUTION: A cooling device 1 comprises: a cooling member 11 in which a flow channel 11a for a heat medium is provided on a member made of aluminium and aluminium alloy; a plate-like member 12 made of aluminium alloy and arranged on a plate-like member arrangement plane 11b of a cooling member 11 so as to expose a part of the cooling member 11; and a heat conduction layer 13 formed by accelerating powders of copper or copper alloy with gas toward an exposed part 11c where a part of a cooling member 12 is exposed from the plate-like member 12 and a surface of the plate-like member 12 around it and spraying and depositing the powders in a solid phase state.
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive member that can be connected to aluminum-based metal and suppress reduction in electric conductivity, and a method of manufacturing the conductive member.SOLUTION: A conductive member has a wire connection portion 101 and a fastening portion 102 each serving as a base material which is formed of aluminum (Al) or alloy containing aluminum and has a connection surface to be connected to another member, and a connection layer 103 formed on the base material. The connection layer 103 is formed as follows: powder of metal or alloy which is smaller in ionization tendency and equal to or higher in electric conductivity than the base material is accelerated together with gas, and sprayed and deposited onto the connection surface under a solid-phase state.
Abstract:
PROBLEM TO BE SOLVED: To provide an electrostatic chuck which exhibits a high corrosion resistance and a small difference of coefficient of expansion between the chuck body and metallic members. SOLUTION: With respect to the electrostatic chuck 10 which has a chuck body 21 having an attracting surface 20 for attracting a semiconductor wafer 11 by static electricity and an electrode 22 for applying a voltage to the attracting surface 20, the chuck body 21 is formed of ceramics 21a mainly constituted by MgO. At least one type of additives selected from TiC, TiO2, ZrO2, V2O2, Nb2O2, Ta2O5, Co3O4, Cr2O3 and NiO is added to the ceramics 21a in such a way that the electric resistivity in the service temperature range is 1×108-1×1012 Ω.cm. Since the electrostatic chuck 10 using the ceramics 21a exhibits a high corrosion resistance even in a corrosive atmosphere such as fluoride plasma, it is suitably used for a manufacture process of semiconductor devices or the like.
Abstract:
PROBLEM TO BE SOLVED: To obtain a lightweight material easy in precision machining, resistant to abrasion, and affording precision mobile mechanical equipment parts having such electroconductivity as to enable static electricity developing when set in operation to be removed. SOLUTION: This material is obtained by incorporating an oxide ceramic with either combination, i.e., tin oxide plus antimony or tin oxide plus antimony oxide, so as to secure electroconductivity; thereby this material can be afforded with such electroconductivity as to enable static electricity developing when set in operation to be removed as well as advantages inherent in ceramics, i.e., easiness of precision machining, lightweightness, and abrasions resistance; therefore, use of this material in precision mobile mechanical equipment parts can easily afford the aimed lightweight parts of high mechanical strength enabling themselves to be subjected to precision machining and prevented from electrification. In particular, use of this material as a support material 1a for magnetic disk substrates can prevent noise generation in the readout or writing of information and improve the reliability of magnetic disk devices.
Abstract:
PROBLEM TO BE SOLVED: To provide an electrostatic chuck which has high heat transfer efficiency and has excellent strength and durability. SOLUTION: Between a lower insulating layer 6 of an electrostatic chuck 5 and a base member 1, damper layer 2-4 are formed which are made of a composite material wherein the ratio of an addition agent to matrix metal varies in such a way that the coefficient of thermal expansion may become gradually higher from the lower insulating layer 6 side toward the base member 1 side in a specified range between the coefficient of thermal expansion of the lower insulating layer 6 and that of the base member 1. By forming the damper layers 2-4, the difference in coefficient of thermal expansion between the lower insulating layer 6 and the base member 1 is absorbed well and the appearance of thermal stress can be prevented and thereby the strength and the durability of the device are increased. Especially, by brazing the electrostatic chuck 5 on the base member 1 or stacking the lower insulating layer 6, an electrode layer 7, and an upper insulating layer 8 on the base member 1 by flame coating or evaporation, the heat transfer efficiency between the layer is increased and thereby the cooling/heating efficiency of an object to be chucked such as a wafer is increased.
Abstract:
PROBLEM TO BE SOLVED: To raise time thermal conductivity by using metal compound material containing carbon fibers of a specific length in a specific range of volume, and having a thermal expansion coefficient being in a specific range by their reaction with a metal component. SOLUTION: Metal compound material contains fibers of lengths of 40μm or less and a metal component composed of either Cu or Al, and has a thermal expansion coefficient of 5×10 -10×10 . Especially, reactivity of the metal component with the carbon fibers can be enhanced, by adding 0.3-5wt.% of at least one kind of metal out of Ti, Zr, Cr, and Si to the metal compound material. Besides, sinterability can be enhanced by adding 0.3-8wt.% of at least one kind of metal different from the metal component out of Si, Ag, Sn, P, Al, and Cu to the metal compound material.