摘要:
PROBLEM TO BE SOLVED: To provide an optical device that has a metal pad formed thereon, formed by cleavage, has good yield, and can be manufactured at low costs.SOLUTION: Provided is an optical device that is formed by cleaving to separate one semiconductor substrate, and includes a light-emitting unit formed on the substrate, and electrode pads electrically connected with electrodes of the light-emitting unit. An outside end part of the electrode pad has a shape in which a thickness in the outside end part is gradually reduced toward the outside.
摘要:
PROBLEM TO BE SOLVED: To provide an optical sensor that can specify an object more precisely than conventional without cost increase and upsizing.SOLUTION: An optical sensor includes: a light source 11; a collimator lens 12; a light receiver 13; a polarization filter 14; a light receiver 15; a black box housing them; and other components. The light receiver 13 is disposed so as to receive a P polarization component included in internal diffusion reflection light, and the light receiver 15 is disposed so as to receive mainly surface positive reflection light. Setting is performed so that an incident angle of irradiation light onto recording paper is 80 degrees, and reflection light having a reflection angle of 70 to 80 degrees is received by the light receiver 15. In this case, the light receiver 15 can output a signal corresponding to smoothness of the recording paper with accuracy.
摘要:
PROBLEM TO BE SOLVED: To provide a transmission line capable of reducing loss in transmission and ensuring mechanical strength, and to provide a method for manufacturing the transmission line. SOLUTION: The transmission line comprises a substrate; a recess formed on the substrate; a membrane thin film formed on the recess; a center conductor formed on the membrane thin film; and an electrode formed at both the sides of the center conductor. COPYRIGHT: (C)2006,JPO&NCIPI
摘要:
PROBLEM TO BE SOLVED: To provide an optical device in which the excessive projection of core causing a coupling loss is suppressed to minimum, so as to form the core only on a region actually used and which has alignment rougher and better than in the conventional practice. SOLUTION: In the optical device in which an optical waveguide member 6 and a light emitting device or a light receiving device 1 are connected by a photosetting resin 8, the region besides a light emitting surface or a light receiving surface of the light emitting device or the light receiving device 1 has such a structure or surface so as not to vertically reflect light when the light from the optical waveguide member 6 for curing the photosetting resin 8 is made vertically incident to the light emitting surface or the light receiving surface of the light emitting device or the light receiving device 1. COPYRIGHT: (C)2005,JPO&NCIPI
摘要:
PROBLEM TO BE SOLVED: To provide an optical device which can reduce sticking of foreign matter to metal pads at the time of cleavage.SOLUTION: The optical device comprises 32 light-emitting parts formed on one substrate and 32 electrode pads electrically connected to p-side electrodes in the 32 light-emitting parts. An electrode pad 150 where a silicon sticking symptom is likely to occur in a cleavage process is set in such a way that the length of a side thereof which is close to a cleaved portion in a plan view is longer than a dimension d in a direction parallel to the cleaved portion. In this case, even when the thickness of a chip forming substrate is greater than that of a conventional one, adhesive strength of a protective sheet can be reduced and sticking of silicon to each electrode pad at the time of cleavage can therefore be prevented. As a result, a manufacturing yield can be improved.
摘要:
PROBLEM TO BE SOLVED: To provide a surface-emitting laser module which has extremely small variation in light quantity due to return light.SOLUTION: The surface-emitting laser module includes: a surface-emitting laser formed on a substrate to emit light in a direction perpendicular to its surface; a package including a recess portion in which the substrate is arranged; and a transparent substrate arranged to enclose the recess portion and the substrate and connected to the package on a light emitting side of the surface-emitting laser. In the surface-emitting laser module, a high reflectance region and a low reflectance region for the light are formed within a region enclosed by an electrode formed on an upper part of a mesa of the surface-emitting laser, and the transparent substrate is slanted to the surface of the substrate in a polarization direction of the light determined by the high reflectance region and the low reflectance region.
摘要:
PROBLEM TO BE SOLVED: To provide an optical device excellent in productivity without deteriorating resistance to high temperature and high humidity. SOLUTION: An optical device includes a laser chip 110, a package member 120 for holding the laser chip 110 on the bottom surface of a space region whose periphery is surrounded by a wall, and a cover glass 140 which is connected to a step portion of the wall of the space region and which seals the space region. A wall surface opposed to the side surface of the cover glass 140 in the longitudinal section of the package member 120 has a section for positioning the cover glass 140 and a resin pool in a direction vertical to the bottom surface. COPYRIGHT: (C)2011,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide an MEMS switch in which an insertion loss is low in a high frequency region and which is superior in isolation characteristics. SOLUTION: In the MEMS switch provided with at least two transmission lines 2 of which mutual ends are opposedly arranged on a substrate 1 surface, a movable electrode 4 arranged above the transmission lines 2 so as to connect between these transmission lines 2, and a driving means 3 to displace this movable electrode 4, an electrically insulated protrusion 11 is formed between the opposing transmission lines 2, and one part of the movable electrode 4 is deformed with the protrusion 11 end part as a fulcrum in that displacement. COPYRIGHT: (C)2007,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide a light emitting module which can connect a planar optical element with an optical fiber by bending it by 90°, without the need of increasing the number of components nor improving process controllability, and uses a surface emitting semiconductor laser capable of enhancing alignment accuracy and reducing cost, and also to provide the manufacturing method of this module and an optical communication system using this module. SOLUTION: The light emitting module couples the light emitting element 1 of the surface emitting semiconductor laser having an oscillating wavelength of ≥1.1 μm and an optical fiber 2. This light emitting module is composed of a micro-lens 5 which is formed by machining an Si mono-crystal and collimates or condenses the vertically emitted light of the semiconductor laser element 1 to parallel light, a reflection prism 3 that uses as a reflection face the Si (111) face formed by machining the Si mono-crystal for the purpose of bending collimated or condensed light by nearly 90°, and an optical fiber guiding V-groove structure 4 formed on the Si (111) face, wherein the micro-lens 5, the reflection prism 3 and the guiding V-groove structure 4 are integrally formed. COPYRIGHT: (C)2006,JPO&NCIPI