Abstract:
PROBLEM TO BE SOLVED: To provide a compact liquid droplet ejection apparatus in which ejection variance between ejection ports is suppressed without using a dedicated circuit structure. SOLUTION: In the liquid droplet ejection apparatus that selects one nozzle among a plurality of nozzles for ejecting liquid droplets and ejects the liquid droplets, a voltage parameter acquisition part 603 reads out the parameter of an applied voltage of the selected nozzle by searching a voltage table 627, transmitting the read-out parameter to an ejection control part, and the ejection control part forms a voltage signal based on the parameter to apply it to the electrode of the selected nozzle, making the nozzle eject droplets. A voltage control circuit for individual nozzles is not necessary in the liquid droplet ejection apparatus, enabling the equipment to be made compact. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a substrate with alignment mark, where the position of alignment mark formed on the substrate is detected accurately and the alignment time of the substrate can be shortened. SOLUTION: In the substrate with an alignment mark 10, a main alignment mark 1 and eight auxiliary alignment marks 2 to 9, which are dispersedly arranged at relative positions that are previously decided, with respect to the main alignment mark at a periphery of the main alignment mark 1, are formed on the substrate. The main alignment mark 1 and the auxiliary alignment marks 2 to 9 have different shapes. At least one mark in the main alignment mark so that a plurality of the auxiliary alignment marks are arranged to enter the image-captured region. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a magnetic field measuring apparatus capable of measuring magnetic fields, while maintaining a fixed distance between the surface of an object to be measured and a magnetic field probe, regardless of the shape of the surface of the object to be measured and accurately measuring the intensity distributions of magnetic fields of unwanted radiation. SOLUTION: An alignment part 14 converts coordinates, indicated by coordinate information of the object to be measured 21 stored in a CAD data storage part 12, into coordinates of the object to be measured 21 in the coordinate axes of a moving part 13. A measuring position control part 18 moves an electric field probe 11 to a plurality of measuring positions which maintains a fixed distance from the surface of the object to be measured 21, in a predetermined direction to the moving part 13, on the basis of coordinate positions indicated by the coordinate information stored in the CAD data storage part 12. It is then possible to move the magnetic field probe 11, while maintaining an actual and fixed distance between the magnetic field probe 11 and the surface of the object to be measured 21. The intensity of magnetic fields at each measuring position is acquired by an electromagnetic field measuring device 15. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a heat radiation structure for an electronic component, capable of preventing a local rise of the temperatures of a cabinet as much as possible even if the thickness of the cabinet is reduced. SOLUTION: In the heat radiation structure for the electronic component, the heat radiated from electronic components 11a, 11b housed in a cabinet 14 is transmitted to the cabinet 14, to radiate heat to the space outside the cabinet 14. A heat radiation part 16 in which an emissivity at an adjacent position adjacent to an opposed position is higher than that at the opposed position opposed to the electronic components 11a, 11b of the cabinet 14 is provided on an inner surface part of the cabinet 14. An emissivity distribution pattern of the heat radiation part 16 is set so that the emissivity changes based on a temperature distribution pattern by a radiation heat of the electronic components 11a, 11b on the inner surface part when the heat radiation part 16 is absent. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To easily specify through-put without increasing the information quantity of a header part. SOLUTION: A receiving module 104 is provided with a communicating part 142 for communicating information by using a packet, an identifying part 140 for judging whether or not the received packet is a test packet, a through-put estimating part 136 for measuring a through-put time since a time specified by judging that the received packet is the test packet by the identifying part 140 until the number of reception of coded packets reaches a predetermined reference number, and for specifying the communicating speed of the communicating part 142 based on the through-put time and the reference number and a requesting part 138 for controlling a communicating part 142 to transmit information showing the communicating speed. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a printed circuit board miniaturized and thinned while ensuring a function inhibiting common-mode noises. SOLUTION: The multilayer printed circuit board 1 is constituted by providing with a printed circuit board body 10, a connector and a common-mode choke coil 30. The choke coil 30 has magnetic-substance cores 31 and 22, wiring patterns 32 and 33 and a via-hole conductor 34. The core 31 is formed in a rectangular parallelopiped-shaped open magnetic circuit type, and buried in opening sections 40 formed to insulator layers 12a and 12b. The wiring patterns 32 and 33 and the coil by the via-hole conductor 34 are wound on the core 31. The wiring pattern 32 is formed on the surface of a conductor layer 11a, the wiring pattern 33 is formed on the surface of the conductor layer 11d, and the via-hole conductor 34 is formed in a via hole 35 penetrated to the insulator layers 12a to 12c. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To reduce a tact time by decreasing frequency of scanning in drawing. SOLUTION: A table 13 representing the number of nozzles to be used to the number of registered patterns is provided in a drawing control device 2. Based on respective drawing coordinates on a workpiece input by a drawing coordinate input section 6, a maximum number of nozzles to be used where all drawing patterns necessary for one scanning can be registered to a RAM 17 in a drawing unit 3 is determined by referring to the table 13 representing the number of the nozzles to be used to the number of the registered patterns using a drawing width calculation section 7 to a drawing condition determining section 11. Thus, the drawing pattern is formed based on the number of the nozzles to be used and the drawing coordinate in a scanning range at the number of nozzles to be used. Further, drawing is conducted by a drawing unit 3 according to the obtained drawing pattern. In this way, the frequency of scanning is suppressed from increasing and the tact time can be reduced. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic part which can reduce noises that are resulted from stacking substrates having pattern wirings and are transmitted among the pattern wirings of substrates. SOLUTION: When first to third semiconductor chips 1A-1C having pattern wiring are stacked, the pattern wiring of the semiconductor chips crosses each other at an angle other than a right angle when viewed from one side of the lamination direction. In this case, since the pattern wiring of the semiconductor chips are not parallel to each other, capacitive coupling and inductive coupling generating among the pattern wiring of the semiconductor chips become weak when compared with a case when the pattern wiring of the semiconductor chips is parallel to each other. In addition, current generating through the capacitive coupling and inductive coupling flows as it is being dispersed. Therefore, the capacitive coupling and inductive coupling can result in the electronic part 7 wherein noises transmitting among the pattern wiring of stacked semiconductor chips are reduced. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve both functions of shock absorbing performance and heat radiating performance for efficient external radiation of generated heat, in regard to a heating part such as an HDD, without causing an increase in the size of a case. SOLUTION: The case 6 of an information processing device 1 has therein shock absorbing members 3 for absorbing a shock to the heating part 11, and a heat radiating member 7 of a material high in heat conductivity. Between the shock absorbing members 3 and the heating part 11, heat-conductive members 2 are disposed in thermal connection with the heating part 11. At least either surfaces of unconnected portions of the heating part 11 thermally unconnected with the heat-conductive members 2, or inner surfaces of the case 6 facing the unconnected portions have low radiation surfaces 4 low in heat radiation. The heat-conductive members 2 are connected to the heat radiating member 7 at a part separated from the heating part 11. COPYRIGHT: (C)2005,JPO&NCIPI