Abstract:
PROBLEM TO BE SOLVED: To provide a spin injection electrode structure achieving a high output, which inhibits spin scattering at a boundary surface caused by a shear of a lattice constant between a semiconductor channel layer and a tunnel layer, and a lattice constant between the tunnel layer and a ferromagnetic layer; or provide a spin conduction element.SOLUTION: A spin injection electrode structure comprises tunnel layers and a ferromagnetic layer which are arranged on a semiconductor channel layer, in which a lattice constant of a first tunnel layer in contact with the semiconductor channel layer and a lattice constant of a second tunnel layer in contact with the ferromagnetic layer are different from each other, and further, the first tunnel layer and the second tunnel layer have crystalline systems different from each other.
Abstract:
PROBLEM TO BE SOLVED: To provide a spin injection electrode structure which inhibits spin scattering at a boundary surface cased by a shear of a lattice constant between a semiconductor channel layer and a tunnel layer, and a lattice constant between the tunnel layer and a ferromagnetic layer; and provide a spin conduction element.SOLUTION: In a spin injection electrode structure, a lattice constant of a tunnel layer on the side in contact with a semiconductor channel layer and a lattice constant of the tunnel layer on the side in contact with a ferromagnetic layer are different from each other and the tunnel layer in contact with the semiconductor channel layer and the tunnel layer in contact with the ferromagnetic layer have a single crystal structure.
Abstract:
PROBLEM TO BE SOLVED: To provide a method capable of preparing easily a sample suitable for analyzing the surface state of a thin film and the state of a plane parallel to the surface. SOLUTION: After forming an etching groove 16 reaching a soluble film 12 so as to enclose an analysis object domain 10R by irradiating FIB 15A, 15B toward a laminated film 10Z, a bottom part 12B which is a part in contact with an intermediate pattern 13 is dissolved and removed by using acid solution capable of dissolving only the soluble film 12 among a wafer 11, the soluble film 12 and an intermediate film 13Z, to thereby form the sample 10 for analysis. The acquired sample 10 for analysis is taken out by grasping its side surfaces 10W. Hereby, the sample 10 for analysis suitable for analyzing the surface state and the state of a plane parallel to the surface by using a SEM or a TEM can be formed easily and highly accurately without fouling the surface of an analysis object film pattern 14. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a magneto-resistive element having a novel constitution capable of expanding a design margin of an electrical circuit by suppressing the heat generation at the connection part between an electrode layer and a magneto-resistive film by reducing an electric resistance for connection and also by suppressing the increase of the electric resistance between reading elements. SOLUTION: On a base 1 constituted of AlTiC, etc., a base protecting layer 2, a lower shield layer 3 and a lower insulation layer 4 are formed in this order. The magneto-resistive film 5 is formed on the lower insulation layer 4, and magnetic bias layers 6 are formed so as to be brought into contact with both side surfaces of this magneto-resistive element film 5 in the direction parallel with the air bearing surface. Then, the electrode layers 9b are formed so as to be brought into contact with the rear side surface 5e of the magneto- resistive film 5 at the opposite side to the air bearing surface.
Abstract:
PROBLEM TO BE SOLVED: To form a patterned thin film which is provided with a groove of fine width and equipped with an end that faces the groove and is superior in adhesion to the other thin film. SOLUTION: A patterned thin film forming method comprises a first step of successively forming an etching stopper film 102 and a patterning film 103 on a base 101, second step of forming a first patterned film 104 on the patterning film 103, third step of forming a second film 105 on all the surfaces of the patterning film 103 and the first film 104, fourth step of separating the first film 104 so as to enable the second film 105 formed on the patterning film 103 to function as an etching mask, and fifth step of selectively etching the patterning film 103 using the etching mask through dry etching for the formation of a patterned thin film with a groove.