公开(公告)号：JP2006300926A

公开(公告)日：2006-11-02

申请号：JP2006061785

申请日：2006-03-07

Applicant: Yamaichi Electronics Co Ltd ,  山一電機株式会社

Inventor： WAKABAYASHI YOSHINORI ,  HISAISHI MINORU ,  SUZUKI TAKESHI ,  MATSUOKA NORIYUKI

IPC: G01R31/26 ,  H01R33/76

CPC classification number: G01R1/0483

Abstract: PROBLEM TO BE SOLVED: To provide a socket for a semiconductor device that can uniformly bring a bare chip into contact with a bump of a sheet with an electrode without depending on the size of the bare chip and can press it with a suitable pressure. SOLUTION: In an IC socket body, a carrier unit 21 storing the bare chip inside is removably mounted to a storage section. The carrier unit 21 has the sheet 32 with the electrode and an attitude stabilizing member 30 mounted on this, and the attitude stabilizing member 30 stabilizes the attitude of the bare chip to be substantially parallel with the flat face of the sheet 32 with the electrode. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了提供半导体器件的插座，其能够均匀地使裸芯片与具有电极的片材的凸块接触而不依赖于裸芯片的尺寸，并且可以用合适的 压力。 解决方案：在IC插座主体中，将裸芯片存储在其内的托架单元21可拆卸地安装到存储部分。 托架单元21具有安装有电极的片材32和姿态稳定构件30，并且姿态稳定构件30使裸片的姿态与电极与片材32的平坦面基本平行。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006105692A

公开(公告)日：2006-04-20

申请号：JP2004290569

申请日：2004-10-01

Applicant: Yamaichi Electronics Co Ltd ,  山一電機株式会社

Inventor： KURODA TOSHITAKA ,  HISAISHI MINORU

IPC: G01R31/26

CPC classification number: H01L23/32 ,  G01R1/0466 ,  G01R1/0483 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074

Abstract: PROBLEM TO BE SOLVED: To preclude a bump of a connection substrate from being crushed, even when a pressing lid and a carrier housing are combined under the condition where no bare chip exists.
SOLUTION: This carrier unit 40 includes the carrier housing 46, a contact sheet 44 provided with the bump 44B pressed onto an electrode group of the stored bare chips by a pressing body 56, the pressing lid 52, and a latch mechanism 50. The bump 44B is not crushed even under the condition where no bare chip exists, since pressing parts 56wa, 56wb of the pressing body 56 have respectively recesses 56A, 56B inserted with the bump 44B.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：即使在不存在裸芯片的情况下组合按压盖和托架壳体时，为了防止连接基板的凸块被破碎。 解决方案：该载体单元40包括载体壳体46，设置有通过按压体56压入存储的裸芯片的电极组的凸块44B的接触片44，按压盖52和闩锁机构50 即使在不存在裸芯片的情况下，凸块44B也不会被挤压，因为按压体56的按压部分56wa，56wb分别具有插入凸块44B的凹部56A，56B。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2004079227A

公开(公告)日：2004-03-11

申请号：JP2002234518

申请日：2002-08-12

Applicant: Yamaichi Electronics Co Ltd ,  山一電機株式会社

Inventor： URATSUJI KAZUMI ,  HISAISHI MINORU ,  SUZUKI KATSUMI

IPC: G01R31/26 ,  G01R1/073 ,  H01R33/76

Abstract: PROBLEM TO BE SOLVED: To provide a peeling mechanism capable of easily and forcefully peeling contact of an IC socket and a pad of an IC package stuck on together.
SOLUTION: The IC socket comprises a socket main part, a cover which freely moves up and down on the socket main part through a spring, at least a pair of latches which open and close by a vertical movement of the cover, a floating plate which freely moves up and down on the socket main part through a spring and clips the IC package between itself and the latch, and a contact of which the contact part for contacting the pad of the IC package is arranged in the aperture provided on the floating plate and which electrically connects the IC package and the test board, and the latch has a push-up member for pushing up the floating plate. The above contact may be a pogo pin.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004014303A

公开(公告)日：2004-01-15

申请号：JP2002166290

申请日：2002-06-06

Applicant: Yamaichi Electronics Co Ltd ,  山一電機株式会社

Inventor： KURODA TOSHITAKA ,  HISAISHI MINORU

IPC: H01R33/76

Abstract: PROBLEM TO BE SOLVED: To provide an assembling method of a socket for an area array capable of easily incorporating a seat without damaging the tip of a contact.
SOLUTION: This method comprises first to fourth processes of: accommodating the seat having an IC package and vertically movably supported to a socket board in a seat storage chamber of the socket board: fixing contact electrically kept into contact with the IC package and elastically deformable to the socket board through the seat: lifting the seat from its storing position to a predetermined position: and mounting an elastic member between the seat and the bottom wall of the seat storage chamber, and the first to fourth processes are. A slot having a predetermined vertical length is formed in the seat, and a fifth process for fixing a shaft to the socket board through the slot is performed between the third and forth processes, or after the fourth process.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2003149290A

公开(公告)日：2003-05-21

申请号：JP2001346331

申请日：2001-11-12

Applicant: YAMAICHI ELECTRONICS CO LTD

Inventor： HISAISHI MINORU ,  MATSUOKA NORIYUKI

IPC: G01R31/26 ,  G01R1/04 ,  H01L23/32 ,  H01R33/76

Abstract: PROBLEM TO BE SOLVED: To provide a latch lock mechanism of a KGD carrier which facilitates the simultaneous opening/closing operation of latches and the mounting/removing operation of a carrier retainer in a simple structure. SOLUTION: The mechanism comprises a carrier retainer having a cover and a chip retainer, a carrier board having a carrier body, a substrate and a carrier base, at least two mutually opposed latches turnably mounted on the cover of the carrier retainer, each forming an L-letter with a handling part and a lock part, and an engaging part provided on the carrier body of the carrier board for engaging with the lock part of the latch. When the lock parts of the two opposed latches are closed, the engaging part engages with the lock part provided on the carrier body to lock the carrier retainer and the carrier board.

公开(公告)号：JP2003149289A

公开(公告)日：2003-05-21

申请号：JP2001346330

申请日：2001-11-12

Applicant: YAMAICHI ELECTRONICS CO LTD

Inventor： HISAISHI MINORU ,  MATSUOKA NORIYUKI

IPC: G01R31/26 ,  H01L23/32 ,  H01R33/76 ,  H05K7/10

Abstract: PROBLEM TO BE SOLVED: To provide a KGD carrier structured to be adaptable to a two-point contact type IC socket, thereby ensuring the electric connection. SOLUTION: The KGD carrier holds an IC chip with a carrier retainer and a carrier board comprising a carrier body, a carrier base and a substrate. The carrier body has IC socket contact-insertable cut grooves at a position facing a pad formed around the periphery of the substrate, and the carrier base has IC socket contact-insertable cut grooves at a position facing the pad formed around the periphery of the substrate sandwiched between the carrier body and the carrier base so as to electrically connect the pad of the substrate with the contact of the IC socket.