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    Grinding method of elastic roller
    2.
    发明专利
    Grinding method of elastic roller 有权
    弹性滚筒研磨方法

    公开(公告)号：JP2008012627A

    公开(公告)日：2008-01-24

    申请号：JP2006186529

    申请日：2006-07-06

    Applicant: Bridgestone Corp ,  株式会社ブリヂストン

    Inventor： SATO JUNICHIRO

    IPC: B24B5/50

    CPC classification number: B24B5/04 ,  B24B5/50 ,  B65H27/00 ,  B65H2401/11 ,  B65H2402/80 ,  G03G15/0808 ,  G03G15/0818 ,  G03G21/0058

    Abstract: PROBLEM TO BE SOLVED: To provide a grinding method of an elastic roller capable of keeping high swinging accuracy and a uniform outer diameter and grinding an elastic layer surface with good manufacturing efficiency when grinding the surface having a region with no adhesive at an edge thereof.
    SOLUTION: The grinding method is for grinding the elastic roller having an elastic layer 1 via an adhesive on an outer periphery of a shaft 2 and having a region with no adhesive at one of roller longitudinal ends of the elastic layer. The method includes a step of grinding the outer peripheral surface of the elastic layer by a rotary grinding wheel 10 moving along the roller longitudinal direction. The grinding with the rotary grinding wheel is started from an end opposite to the end with the region with no adhesive in the roller longitudinal direction.
    COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种能够保持高摆动精度和均匀外径的弹性辊的研磨方法，并且在具有不具有粘合剂的区域的表面上研磨具有良好制造效率的研磨弹性层表面时 边缘。 解决方案：研磨方法是通过在轴2的外周上的粘合剂研磨具有弹性层1的弹性辊，并且在弹性层的辊纵向端部之一处具有不具有粘合剂的区域。 该方法包括通过沿辊纵向移动的旋转砂轮10研磨弹性层的外周面的步骤。 使用旋转砂轮进行研磨是从与辊的纵向方向上没有粘合剂的区域相反的一端开始的。 版权所有（C）2008，JPO＆INPIT

    円柱状部材の研磨装置およびその研磨方法
    3.
    发明专利
    円柱状部材の研磨装置およびその研磨方法 有权

    公开(公告)号：JPWO2012029194A1

    公开(公告)日：2013-10-28

    申请号：JP2011546363

    申请日：2010-10-13

    Applicant: 新東工業株式会社

    Inventor： 茂 棚橋 ,  茂 棚橋 ,  靖雄 野田 ,  靖雄 野田

    IPC: B24B29/00 ,  B24B49/04 ,  B24D13/14

    CPC classification number: B24B5/045 ,  B24B5/37 ,  B24B5/50

    Abstract: 硬脆材料からなる円柱形状の表層部に存在する微小の亀裂を除去する高研磨能力と表面の凹凸を除去して表面粗さを微細化する微細研磨能力を備えた安価な研磨装置とその研磨方法を提供する。被加工物の回転手段に連結し、前記被加工物の両端面を挟持するクランプ手段と、前記加工面に研磨具の先端が接触回転しながら研磨加工する研磨手段と、前記被加工物に対し前記研磨手段を、前記被加工物の断面方向と直交する長手方向に相対的に移動させる移動手段と、研磨加工前に検出した前記被加工物の加工面の高さ位置を記憶させる高さ位置検出手段と、前記位置検出手段により記憶された高さ位置と前記研磨手段の先端の切込み量とを演算処理して研磨加工を行うようにする制御手段と、を備えている【選択図】図1

    Glass substrate for semiconductor and manufacturing method for the same
    4.
    发明专利
    Glass substrate for semiconductor and manufacturing method for the same 有权
    用于半导体的玻璃基板及其制造方法

    公开(公告)号：JP2013088793A

    公开(公告)日：2013-05-13

    申请号：JP2011232522

    申请日：2011-10-24

    Applicant: Shin Etsu Chem Co Ltd ,  信越化学工業株式会社

    Inventor： OKAFUJI DAIYU ,  YAMAZAKI HIROYUKI ,  TAKEUCHI MASAKI

    IPC: G03F1/60 ,  C03C19/00 ,  H01L21/027

    CPC classification number: B24B37/042 ,  B24B1/00 ,  B24B5/50 ,  B24B7/228 ,  B24B9/065 ,  B24B9/08 ,  B24B37/02 ,  B24B37/04 ,  G03F1/60 ,  Y10T428/24355 ,  Y10T428/24479

    Abstract: PROBLEM TO BE SOLVED: To provide a glass substrate for semiconductor that has a non-through hole, a groove, or a step having mirror-finished bottom and side faces for which dimensions such as size, bottom thickness, and degree of parallelization are accurately and stably controlled, that is resistant to cracking or chipping at the non-through hole, groove, or step, and that has high strength and cleanness, and a method for producing the glass substrate.SOLUTION: A glass substrate for a semiconductor has at least on one of its faces a non-through hole, a groove or a level difference; and a first chamfer is provided between a side face of the non-through hole, groove or level difference and the face having the non-through hole, groove or level difference. The side and bottom faces of the non-through hole, groove or level difference are mirror faces and the first chamfer also is a mirror face. The present invention provides a synthetic quartz glass substrate for semiconductor that has a non-through hole, a groove, or a step which has mirror-finished bottom and side faces and which have high dimensional accuracy, that is resistant to cracking or chipping at the non-through hole, groove, or step, and that has high strength and cleanness. The substracte is applicable to a synthetic quartz glass substrate for a photomask substrate or a molded substrate for nano-imprinting that is used in optical lithography, which is an important process in IC manufacturing.

    Abstract translation: 要解决的问题：提供一种具有非通孔的半导体用玻璃基板，槽或具有镜面底面和侧面的台阶，其尺寸，底部厚度和尺寸 准确，稳定地进行平行化，在非贯通孔，沟槽或台阶上耐开裂或切片，具有高强度和清洁性，以及玻璃基板的制造方法。 解决方案：用于半导体的玻璃基板至少在其一个表面上具有非通孔，凹槽或电平差; 并且在非通孔的侧面，槽或水平差与具有非通孔，凹槽或水平差的面之间设置第一倒角。 非通孔，凹槽或水平差的侧面和底面是镜面，第一倒角也是镜面。 本发明提供了一种半导体用合成石英玻璃基板，其具有非通孔，凹槽或台阶，其具有镜面精加工的底侧和侧面，并且具有高尺寸精度，耐磨损或破裂 非通孔，凹槽或台阶，具有高强度和清洁度。 该减法器适用于用于光掩模基板的合成石英玻璃基板或用于光刻中的纳米压印用成型基板，这是IC制造中的重要工艺。 版权所有（C）2013，JPO＆INPIT

    Grinding method of honeycomb structure
    10.
    发明专利
    Grinding method of honeycomb structure 有权
    蜂窝结构研磨方法

    公开(公告)号：JP2014065104A

    公开(公告)日：2014-04-17

    申请号：JP2012211514

    申请日：2012-09-25

    Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

    Inventor： FUJIOKA YASUMASA ,  IWADE MASANARI ,  NISHIO AKIFUMI ,  MICHIWAKI HIROSHI

    IPC: B24B5/14

    CPC classification number: B24B5/50 ,  B01D46/2451 ,  B24B1/00 ,  B24B5/04 ,  B24B5/14 ,  B24B5/16 ,  B24B5/26 ,  B24B5/42

    Abstract: PROBLEM TO BE SOLVED: To provide a grinding method of a honeycomb structure for forming a honeycomb structure which has a ring-shaped protrusion part, which is formed in a tapered shape, on an outer circumference in a short time by improving a profile of a processed surface.SOLUTION: In a grinding method of a honeycomb structure 41, a grinding member 1 having an outer circumference surface 4, a first grinder tapered surface 5, and a second grinder tapered surface 6, grinds a honeycomb segment joined body 11 rotating around a center axis while rotating the grinding member around the center axis. A first ground region 21, a second ground region 23, a center ground surface 33, a first tapered surface 31, and a second tapered surface 32 are formed by the respective surfaces of the grinding member 1 to produce the honeycomb structure 41 having a cylindrical honeycomb base material 42, and a ring-shaped protrusion part 43 which surrounds the outer periphery of the honeycomb base material 42, protrudes in a flange shape from an outer circumference of the honeycomb base material 42 to an outer side, and includes the first tapered surface 31, the second tapered surface 32, and the center ground surface 33.

    Abstract translation: 要解决的问题：为了提供一种用于形成蜂窝结构体的蜂窝结构体的研磨方法，所述蜂窝结构体具有形成为锥形的环形突出部分，其在短时间内在外周上通过改善 处理表面。解决方案：在蜂窝结构体41的研磨方法中，具有外圆周表面4，第一研磨锥形表面5和第二研磨锥形表面6的研磨构件1磨削围绕 同时使磨削构件围绕中心轴线旋转。 第一接地区域21，第二接地区域23，中心接地表面33，第一锥形表面31和第二锥形表面32由研磨构件1的各个表面形成，以形成具有圆柱形 蜂窝状基材42和围绕蜂窝状基材42的外周的环状突起部43从蜂窝状基材42的外周向外侧突出成凸缘状，并且包括第一锥形 表面31，第二锥形表面32和中心接地表面33。

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