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19 条记录 (耗时 0.015 秒)

    Recording apparatus
    1.
    发明专利
    Recording apparatus 有权
    录音设备

    公开(公告)号：JP2013209179A

    公开(公告)日：2013-10-10

    申请号：JP2012079655

    申请日：2012-03-30

    申请人： Seiko Epson Corp ,  セイコーエプソン株式会社

    发明人： NAKANO YOSUKE ,  TAKEUCHI ATSUHIKO

    IPC分类号： B65H31/20

    CPC分类号： H04N1/00631 ,  B41J13/106 ,  B65H29/00 ,  B65H31/02 ,  B65H2405/324 ,  B65H2407/30 ,  B65H2601/25 ,  H04N2201/0082 ,  H04N2201/0093

    摘要： PROBLEM TO BE SOLVED: To provide a recording apparatus that restricts a recording medium remaining unremoved on a tray from being drawn inside by a restriction means engaged with a rear end of the medium, when the tray is retracted in the direction opposite to the medium discharge direction.SOLUTION: A recording apparatus 1 includes recording means 28, 29, 30 performing recording on a medium; discharging means 31, 32 for discharging the medium with information recorded by the recording means; a medium receiving tray 8 provided to select a first state where the tray protrudes in the medium discharge direction or a second state where the tray is drawn in a direction opposite the medium discharge direction, and receiving a medium discharged by the discharging means 31, 32; and restriction means 80 for engaging with a rear end of a medium P and restricting drawing of the medium P during transition of the medium receiving tray 8 from the first state to the second state.

    摘要翻译： 要解决的问题：提供一种记录装置，其限制未被移动到托盘上的记录介质由与介质的后端接合的限制装置拉入内部，当托盘沿与介质放电相反的方向缩回时 方向。解决方案：记录装置1包括在介质上执行记录的记录装置28,29,30; 用于通过由记录装置记录的信息来排出介质的排出装置31,32; 介质接收托盘8，被设置成选择托盘在介质排出方向上突出的第一状态或托盘在与介质排出方向相反的方向被拉伸的第二状态，并且接收由排出装置31,32排出的介质 ; 以及用于与介质P的后端接合的限制装置80，并且在介质接收盘8从第一状态转换到第二状态期间限制介质P的拉伸。

    Spacer tape and a method of manufacturing the same
    2.
    发明专利
    Spacer tape and a method of manufacturing the same 有权

    公开(公告)号：JP3794627B2

    公开(公告)日：2006-07-05

    申请号：JP2002015152

    申请日：2002-01-24

    申请人： ゴールド工業株式会社

    发明人： 賢太郎 村田

    IPC分类号： H01L21/60 ,  B65D57/00 ,  B65D59/00 ,  B65D73/02

    CPC分类号： B65H18/28 ,  B65H2407/30 ,  B65H2511/162 ,  B65H2601/2532 ,  B65H2701/1315 ,  B65H2701/1864

    摘要： PROBLEM TO BE SOLVED: To provide a space tape protecting an electronic component and eliminating the occurrence of chips and wear waste from the electronic component to be a cause of an abnormal operation and a malfunction as the result of preventing rubbing and shifting of the other tape and the spacer tape at the time of winding and delivery, and the manufacturing method. SOLUTION: The spacer tape is provided with a tape main body 1 and many projections 2 projected in the thickness direction of the tape main body 1 with a prescribed interval in the longitudinal direction of both side edge parts of the tape main body and provided with a circular or partially circular cross section projected outwards. Also, at both side edge parts of the tape main body 1, projected engaging parts 3 to be engaged with sprocket holes 5a for positioning formed at the side edge part of the other tape 5 such as a TAB tape are formed with an interval determined with the interval of the sprocket holes 5a for positioning as a reference. COPYRIGHT: (C)2003,JPO

    Spacer tape and tab tape spacer
    6.
    发明专利
    Spacer tape and tab tape spacer 有权

    公开(公告)号：JP2004071738A

    公开(公告)日：2004-03-04

    申请号：JP2002227052

    申请日：2002-08-05

    申请人： Gold Kogyo Kk ,  ゴールド工業株式会社

    发明人： MURATA KENTARO

    IPC分类号： B65D73/02 ,  H01L21/60

    CPC分类号： B65H18/28 ,  B65H2407/30 ,  B65H2511/162 ,  B65H2601/2532 ,  B65H2701/1315 ,  B65H2701/1864

    摘要： PROBLEM TO BE SOLVED: To provide a spacer tape and a tab tape spacer which have no possibility that projections of a spacer tape wound outside may get into a space extended in a tape lengthwise direction between projections of a spacer tape wound inside. SOLUTION: In the spacer tape which has the projections protruding on a front surface and/or a rear surface of a main body 1 of a tape on both edges in the longitudinal direction of the main body 1 of the tape, the projections 2 are formed continuously over the whole length of the main body 1 of the tape. Due to this structure, there is no possibility that projections of a spacer tape wound outside may get into a space extended in a tape lengthwise direction between projections of a spacer tape wound inside, and local bending of the spacer tape and the tab tape is prevented. Moreover, there is no damage to electronic components and no deformation of leads, and there is no movement of the electronic components with respect to the tab tape, reducing rates of occurrence of defective electronic components and defective substrates. COPYRIGHT: (C)2004,JPO

    Embossed tape
    9.
    发明专利
    Embossed tape 有权
    胶带

    公开(公告)号：JP2010089841A

    公开(公告)日：2010-04-22

    申请号：JP2010005349

    申请日：2010-01-13

    申请人： Sharp Corp ,  シャープ株式会社

    发明人： KUDOSE SATOSHI ,  TOYOSAWA KENJI

    IPC分类号： B65D73/02 ,  H01L21/60

    CPC分类号： B65D73/02 ,  B65B15/04 ,  B65B55/20 ,  B65H18/28 ,  B65H2407/30 ,  B65H2511/162 ,  B65H2601/2532 ,  B65H2701/1315 ,  B65H2701/1864 ,  H01L24/50 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  Y10T428/24479

    摘要： PROBLEM TO BE SOLVED: To perform packaging by using a TAB tape at a desiring reeling amount while securing the protection of the TAB tape sufficiently at shipping and conveyance. SOLUTION: Packaging structure in which the TAB tape 100 having a plurality of semiconductor chips 103 adhered to a film 101 on which a wiring pattern is formed repeatedly and a conductive embossed tape 200 having an embossed section 202 formed continuously in the side of one surface and in the lengthy direction of a film 201 are wound around a conductive reel is constituted so that the TAB tape 100 and the embossed tape 200 are wound around the reel while being superimposed, so that the adhering surface of the semiconductor chip 103 of the film 101 and the projecting surface of the embossed section 202 of the film 201 may face each other, and when the thickness t of the semiconductor chip 103 is (0.2≤t≤0.625) mm and the thickness of the film 201 is about 0.125 mm, the total thickness of the embossed tape 200 is thicker than (t+0.4) mm and thinner than 1.1 mm. COPYRIGHT: (C)2010,JPO&INPIT

    摘要翻译： 要解决的问题：通过在期望的卷取量下使用TAB带进行包装，同时在运输和运输期间充分保证TAB带的保护。 解决方案：其中具有多个半导体芯片103的TAB带100粘附到其上重复形成布线图案的膜101上的包装结构和具有压花部分202的导电压纹带200在 薄膜201的缠绕在导电卷轴上的一个表面和长度方向被构成为使得TAB带100和压纹带200被重叠地卷绕在卷轴上，使得半导体芯片103的粘合表面 膜101和膜201的压花部分202的突出表面可以彼此面对，并且当半导体芯片103的厚度t为（0.2≤t≤0.625）mm时，膜201的厚度为约0.125 压纹带200的总厚度比（t + 0.4）mm厚，比1.1mm厚。 版权所有（C）2010，JPO＆INPIT