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    Copper-based sliding material
    5.
    发明专利
    Copper-based sliding material 有权
    铜基滑动材料

    公开(公告)号：JP2012207277A

    公开(公告)日：2012-10-25

    申请号：JP2011074248

    申请日：2011-03-30

    Applicant: Daido Metal Co Ltd ,  大同メタル工業株式会社

    Inventor： IMAI TAKUO ,  ZUSHI KOJI ,  TSUJIMOTO KENTARO

    IPC: C22C9/02 ,  B22F7/00 ,  C22C9/00 ,  C22C9/06

    CPC classification number: C22C9/02 ,  B32B15/015 ,  C22C9/00 ,  F16C33/121 ,  F16C2204/18

    Abstract: PROBLEM TO BE SOLVED: To provide a copper-based sliding material suppressing coarsening of Bi particles in a Cu alloy layer formed by a continuous sintering process, thereby achieving excellent fatigue resistance and anti-seizing property.SOLUTION: In a copper-based sliding material, Bi, Sn and P are contained in a Cu alloy layer such that a mass ratio Bi/Sn of Bi to Sn is 1.7-3.4 and a mass ratio Bi/P of Bi to P is 500-2,100. Thus, a Cu-Sn-P compound is deposited on a Cu alloy in Cu alloy powder during a cooling process after sintering. Thereby, a difference between thermal shrinkage ratios of the Cu alloy and Bi changed into a liquid phase in the Cu alloy powder is reduced, and the liquid phase of Bi remains in the Cu alloy powder, so that coarsening of Bi particles is suppressed and the Bi particles have an average particle area of 60-350 μmto be dispersed minutely.

    Abstract translation: 要解决的问题：提供一种铜基滑动材料，其抑制通过连续烧结工艺形成的Cu合金层中的Bi颗粒的粗大化，从而获得优异的耐疲劳性和抗咬合性。 解决方案：在铜基滑动材料中，Bi，Sn和P包含在Cu合金层中，使得Bi与Sn的Bi / Sn的质量比为1.7-3.4，Bi / P的质量比Bi 到P是500-2,100。 因此，在烧结后的冷却工序中，Cu-Sn-P化合物沉积在Cu合金粉末的Cu合金上。 因此，Cu合金粉末中Cu合金和Bi变成液相的热收缩率之间的差异减小，Bi的液相残留在Cu合金粉末中，从而抑制Bi颗粒的粗化， Bi颗粒的平均粒子面积为60-350μm 2 要分散。 版权所有（C）2013，JPO＆INPIT

    Copper-based sliding material
    10.
    发明专利
    Copper-based sliding material 有权
    铜基滑动材料

    公开(公告)号：JP2011174118A

    公开(公告)日：2011-09-08

    申请号：JP2010037854

    申请日：2010-02-23

    Applicant: Daido Metal Co Ltd ,  大同メタル工業株式会社

    Inventor： IMAI TAKUO ,  ZUSHI KOJI ,  TSUJIMOTO KENTARO

    IPC: C22C9/00 ,  C22C1/05 ,  C22C9/06 ,  C22C32/00 ,  F16C33/12

    CPC classification number: C22C9/00 ,  B22F2301/10 ,  B22F2301/35 ,  B22F2302/05 ,  B22F2302/10 ,  B22F2302/20 ,  B22F2302/45 ,  B22F2303/01 ,  B22F2303/05 ,  B22F2303/40 ,  B22F2303/405 ,  B22F2998/10 ,  B32B15/013 ,  C22C32/0047 ,  F16C33/121 ,  F16C2204/18 ,  Y10T428/12063 ,  Y10T428/12139 ,  B22F9/082 ,  C22C1/05 ,  B22F3/10 ,  B22F3/18

    Abstract: PROBLEM TO BE SOLVED: To provide a copper-based sliding material in which coarsening of a Bi phase in a Cu alloy layer produced by a continuous sintering process is suppressed, and which has excellent fatigue resistance. SOLUTION: The Cu alloy layer contains Bi of 10 to 30 mass% and an inorganic compound of 0.5 to 5 mass%. Then, by controlling the average grain size of the inorganic compound to 1 to 5 μm and regulating its specific gravity to 70 to 130% relative to the specific gravity of Bi, the inorganic compound is embedded into the Bi phase on the surface of the Cu alloy powder, and the inorganic compound is dispersed into Bi which is made into the liquid phase without being flocculated, thus it is possible to retain the Bi which is made into the liquid phase in the Cu alloy powders up to the temperature at which the Cu alloy powders are sufficiently sintered. As a result, the liquid phase of the Bi is no longer spread, and thereafter, rolling and sintering are repeated to obtain a Cu alloy layer having the Bi phase finely dispersed therein. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 解决的问题：提供一种铜基滑动材料，其中通过连续烧结工艺制造的Cu合金层中的Bi相的粗化被抑制，并且具有优异的耐疲劳性。 解决方案：Cu合金层含有10〜30质量％的Bi，0.5〜5质量％的无机化合物。 然后，通过将无机化合物的平均粒径控制为1〜5μm，将其比重调节为比重为70〜130％，将Bi的表面上的无机化合物嵌入到Bi相中 合金粉末，无机化合物分散成Bi，其被制成液相而不被絮凝，因此可以将Cu合金粉末中制成液相的Bi保持在Cu 合金粉末充分烧结。 结果，Bi的液相不再扩散，然后重复进行轧制和烧结，以获得其中具有Bi相的微细分散的Cu合金层。 版权所有（C）2011，JPO＆INPIT

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