Exposure method and device manufacturing method
    3.
    发明专利
    Exposure method and device manufacturing method 有权
    空值

    公开(公告)号:JP4677987B2

    公开(公告)日:2011-04-27

    申请号:JP2006529242

    申请日:2005-07-20

    CPC classification number: G03F7/70341 G03F7/11 Y10S430/162

    Abstract: An exposure method is provided in which a substrate is favorably exposed in a state with a liquid being retained in a desired condition. An upper surface (1A) of a base material (1) that is used as the substrate (P) to be exposed via the liquid has an effective region (4) coated with a photosensitive material (2), and at least part of the surface of the base material (1) is coated with a first material (3) such that the surface of the base material (1) does not come into contact with the liquid on an outside of the effective region (4).

    Abstract translation: 提供一种曝光方法,其中在保持液体保持期望状态的状态下,基板良好地曝光。 用作经由液体曝光的基板(P)的基材(1)的上表面(1A)具有涂覆有感光材料(2)的有效区域(4),并且至少部分 基材(1)的表面被涂覆有第一材料(3),使得基材(1)的表面不与有效区域(4)的外侧上的液体接触。

    Manufacturing method and device of wiring circuit board
    7.
    发明专利
    Manufacturing method and device of wiring circuit board 有权
    制造电路板的制造方法和装置

    公开(公告)号:JP2005085944A

    公开(公告)日:2005-03-31

    申请号:JP2003315634

    申请日:2003-09-08

    Inventor: NAITO TOSHIKI

    Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method capable of inexpensively manufacturing a wiring circuit board having high reliability. SOLUTION: The conductive layer 10b of a predetermined wiring pattern is formed on an insulating layer 10a. The solution of a photosensitive solder resist is applied on the insulating layer 10a including the conductive layer 10b of the predetermined pattern. The solution of the applied photosensitive solder resist is dried using a hot air circulation furnace or the like. Thereafter, a transparent protective film Fi is stacked on a photosensitive solder resist layer SR. For the formation of the conductive layer 10b on the insulating layer 10a, the application and drying of the solution of the photosensitive solder resist on the insulating layer 10a including the conductive layer 10b, and the stack of the transparent protective film Fi on the photosensitive solder resist layer SR they are attained by roll-to roll, for example. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 解决的问题:提供一种能够廉价地制造具有高可靠性的布线电路板的制造方法。 解决方案:在绝缘层10a上形成预定布线图案的导电层10b。 将感光性阻焊剂的溶液涂布在包含规定图案的导电层10b的绝缘层10a上。 使用热空气循环炉等对所施加的光敏焊料抗蚀剂的溶液进行干燥。 此后,在感光性阻焊层SR上层叠透明保护膜Fi。 为了在绝缘层10a上形成导电层10b,在包括导电层10b的绝缘层10a上的感光性阻焊剂溶液的应用和干燥以及感光性焊料上的透明保护膜Fi的叠层 抗蚀剂层SR例如通过卷绕来获得。 版权所有(C)2005,JPO&NCIPI

    Silver halide photographic sensitive material
    9.
    发明专利
    Silver halide photographic sensitive material 失效
    银色摄影感光材料

    公开(公告)号:JPS6142653A

    公开(公告)日:1986-03-01

    申请号:JP16508384

    申请日:1984-08-07

    CPC classification number: G03C1/7614 Y10S430/151 Y10S430/162

    Abstract: PURPOSE: To obtain a silver halide photographic sensitive material improved in antistaticness and slidability by incorporating a polymer matting agent in a prescribed particle size in a hydrophilic backing layer, and a polyoxyethylene type surfactant and a silicone type sliding agent in an emulsion protective layer.
    CONSTITUTION: The backing layer, 0.1W10μm thick, of the photographic sensitive material contains a polymer matting agent having an average particle diameter of ≥3.0μm, embodied by water-dispersible vinyl polymer, such as PMMA, and starch, etc., in an applied amt. of 0.01W1g/m
    2 etc., and the emulsion protective layer contains a polyoxyethylene type surfactant and a silicone type sliding agent each in an amt. of 0.005W2.0g/m
    2 of the photographic sensitive material.
    COPYRIGHT: (C)1986,JPO&Japio

    Abstract translation: 目的:通过在亲水性背衬层中加入规定粒径的聚合物消光剂和乳液保护层中的聚氧乙烯型表面活性剂和硅酮型滑动剂,得到抗静电性和滑动性提高的卤化银感光材料。 构成:厚度为0.1-10μm的感光材料的背衬层含有平均粒径>3.0μm的聚合物消光剂,由水分散性乙烯基聚合物如PMMA和淀粉等体现, 在应用中 为0.01-1g / m 2,乳液保护层含有聚氨酯型表面活性剂和硅酮型滑动剂。 0.005-2.0g / m 2的感光材料。

    Silver halide photographic sensitive material
    10.
    发明专利
    Silver halide photographic sensitive material 失效
    银色摄影感光材料

    公开(公告)号:JPS6142651A

    公开(公告)日:1986-03-01

    申请号:JP16508184

    申请日:1984-08-07

    CPC classification number: G03C1/7614 Y10S430/151 Y10S430/162

    Abstract: PURPOSE: To obtain a photographic sensitive material well antistaticized and reduced in sliding friction without adversely affecting photographic characteristics, such as sensitivity and fog resistance, by incorporating a silicone unit- grafted copolymer in at least one of surface layers, and an antistatic agent in the surface layers or their adjacent layer.
    CONSTITUTION: A small amt. of the copolymer prepared by graft copolymerizing a water-repellent silicone fraction less affinitive to a photographic polymer with a component more affinitive to the photographic polymer as a stem polymer or a copolymer prepared vice versa is incorporated in the surface layer of the photographic sensitive material, and an antistatic agent is incorporated in this surface layer or its adjacent layer. This comonomer to be grafted is derived from a copolymerizable monomer having an ethylenically unsatd. group, and the stem polymer is one affinitive to the photographic polymer, such as acrylic acid or methacrylic acid polymer. These silicone-grafted polymer and antistatic agent are dissolved, e.g., in water or acetone, applied to a support, and dried in an amt. of 0.001W1.0g copolymer and 0.01W1.0g agent per m
    2 of photographic sensitive material, respectively.
    COPYRIGHT: (C)1986,JPO&Japio

    Abstract translation: 目的:为了获得良好的抗静电和降低滑动摩擦的照相感光材料,而不影响感光特性,例如敏感性和抗雾性,通过在至少一个表面层中引入有机硅单位接枝共聚物,以及抗静电剂 表面层或其相邻层。 宪法:一小撮 通过将对感光性聚合物的亲水性较差的防水硅酮部分与作为茎状聚合物的相片聚合物或反相体系的共聚物进行接枝共聚而制成的共聚物被并入感光材料的表面层中, 并且在该表面层或其相邻层中并入抗静电剂。 该接枝的共聚单体衍生自具有烯键式不饱和单体的可共聚单体。 并且茎聚合物与照相聚合物如丙烯酸或甲基丙烯酸聚合物是亲和性的。 将这些有机硅接枝的聚合物和抗静电剂溶解在例如水或丙酮中,施加到载体上,并以amt干燥。 分别为0.001-1.0g共聚物和0.01-1.0g试剂/ m 2照相感光材料。

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